Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2011/0136362 JOINT-PACK INTEGRATED SPACERS
A joint pack includes one or more phase members that utilize integrated standoff spacers that protrude and come into contact with opposing conductor plates to...
2011/0136361 Light String System
A lamp system used in a light string system comprises a light assembly and a socket assembly. The light assembly comprises a light source, a base in...
2011/0136360 ELECTRICAL CARD CONNECTOR
An electrical card connector (100) includes a receiving space (10) for receiving an electrical card, and includes an insulative housing (1) and an ejecting...
2011/0136359 GUITAR END PIN JACK PLUG
A guitar end pin jack plug device is described which is mated with an end pin jack while the electrical plug is not mated with the end pin jack, for the purpose...
2011/0136358 SAFETY STRUCTURE FOR ELECTRIC RECEPTACLES AND POWER STRIPS
A symmetrically movable safety structure disposed inside of an upper lid of a power panel, includes a cover plate disposed with a jack corresponding to the...
2011/0136357 DATA STORAGE DEVICE AND PRINTING APPARATUS INCLUDING THE SAME
A data storage device is provided. At least a storage section configured to store information therein and a connection terminal configured to transmit...
2011/0136356 FLASH MEMORY DEVICE WITH SLIDABLE CONTACT MODULE
A flash memory device includes a circuit board and a contact module slidable with respect to the circuit board. The circuit board includes a plurality of first...
2011/0136355 Port Attached To Flexible Mount
A system including a flexible mount that can be coupled to a computing device. A port can be attached to the flexible mount. The flexible mount can conform to...
2011/0136354 ELECTRICAL PLUG HAVING ADJUSTABLE PRONGS
An electrical plug is provided. The plug includes a base, a cover, a live prong, a neutral prong, and a ground prong. The cover defines a first hole, a second...
2011/0136353 APPARATUS AND METHOD FOR SCALABLE POWER DISTRIBUTION
In one aspect, the invention provides a system for power distribution. According to some embodiments, the system includes a rack mountable power distribution...
2011/0136352 USB DEVICE
A USB device is provided. The USB device includes a housing, a circuit board, a chip, a USB connector and a metal connector. The circuit board is disposed in...
2011/0136351 MAGNETIC CONNECTOR FOR ELECTRONIC DEVICE
An electrical plug and receptacle relying on magnetic force from an electromagnet to maintain contact are disclosed. The plug and receptacle can be used as part...
2011/0136350 Magnetic and Locking Cable Connectors
In embodiments of the present invention improved capabilities are described for a cable connector. The cable connector may have magnetic properties and/or a...
2011/0136349 FLEXIBLE BATTERY CONNECTOR
A battery connector including an electrical connector including a plurality of terminals, each mechanically and electrically connectable with a battery, the...
2011/0136348 PHONON-ENHANCED CRYSTAL GROWTH AND LATTICE HEALING
A system for modifying dislocation distributions in semiconductor materials is provided. The system includes one or more vibrational sources for producing at...
2011/0136347 POINT-OF-USE SILYLAMINE GENERATION
The production and delivery of a reaction precursor containing one or more silylamines near a point of use is described. Silylamines may include trisilylamine...
2011/0136346 Substantially Non-Oxidizing Plasma Treatment Devices and Processes
Non-oxidizing plasma treatment devices for treating a semiconductor workpiece generally include a substantially non-oxidizing gas source; a plasma generating...
2011/0136345 Process for the Manufacture of Etched Items
C4 compounds selected from the group of trifluorobutadienes and tetrafluorobutenes can be used as etching gases, especially for anisotropic etching in the...
2011/0136344 COMPOSITION AND METHOD FOR POLISHING POLYSILICON
The invention provides a polishing composition comprising silica, an aminophosphonic acid, a polysaccharide, a tetraalkylammonium salt, a bicarbonate salt, an...
2011/0136343 COMPOSITION AND METHOD FOR LOW TEMPERATURE DEPOSITION OF SILICON-CONTAINING FILMS
This invention relates to silicon precursor compositions for forming silicon-containing films by low temperature (e.g., <300.degree. C.) chemical vapor...
2011/0136342 SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
A semiconductor apparatus including a semiconductor substrate, an insulating layer, a via hole, and a through-hole interconnection is provided. The insulating...
2011/0136341 FIELD EFFECT TRANSISTOR HAVING MULTIPLE PINCH OFF VOLTAGES
A compound field effect transistor having multiple pinch-off voltages, comprising first and second field effect transistors, each field effect transistor...
2011/0136340 METHOD OF FABRICATING SEMICONDUCTOR DEVICE
A method of fabricating a semiconductor device facilitates the forming of a conductive pattern of features having different widths. A conductive layer is formed...
2011/0136339 CONDUCTOR STRUCTURE INCLUDING MANGANESE OXIDE CAPPING LAYER
A microelectronic structure includes a dielectric layer located over a substrate. The dielectric layer is separated from a copper containing conductor layer by...
2011/0136338 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
A method of fabricating a semiconductor device includes forming a via hole in a semiconductor substrate, forming an isolation layer on an inner side of the via...
2011/0136337 Method for Manufacturing Semiconductor Device
A method for manufacturing a semiconductor device. The method includes forming an energy cured resin layer on a semiconductor substrate having an electrode pad...
2011/0136336 METHODS OF FORMING CONDUCTIVE VIAS
Methods of forming a conductive via may include forming a blind via hole partially through a substrate, forming an aluminum film on surfaces of the substrate,...
2011/0136335 Semiconductor Device with Improved Contacts
A device with a solder joint made of a copper contact pad (210) of certain area (202) and an alloy layer (301) metallurgically attached to the copper pad across...
2011/0136334 METHOD OF FORMING AT LEAST ONE BONDING STRUCTURE
A method of forming at least one bonding structure may be provided. A ball may be formed on the front end of a wire outside a capillary. The capillary may be...
2011/0136333 SEMICONDUCTOR MATERIALS AND METHODS OF PREPARATION AND USE THEREOF
Disclosed are new semiconductor materials prepared from dimeric perylene compounds. Such compounds can exhibit high n-type carrier mobility and/or good current...
2011/0136332 METHODS OF FORMING INTEGRATED CIRCUIT DEVICES WITH CRACK-RESISTANT FUSE STRUCTURES
A fuse base insulating region, for example, an insulating interlayer or a compensation region disposed in an insulating interlayer, is formed on a substrate. An...
2011/0136331 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
A semiconductor device includes: a first gate insulating film on a first region of a semiconductor substrate; a first gate electrode on the first gate...
2011/0136330 Nonvolatile Semiconductor Memory Device and Manufacturing Method Thereof
A memory device includes a semiconductor substrate, memory elements formed above the substrate in rows and columns, bit lines and word lines selectively...
2011/0136329 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
A manufacturing method of a semiconductor device includes preparing a semiconductor substrate which is a base substrate of the semiconductor device and which is...
2011/0136328 METHOD FOR DEPOSITING ULTRA FINE GRAIN POLYSILICON THIN FILM
According to the present invention, a method for depositing an ultra-fine crystal particle polysilicon thin film supplies a source gas in a chamber loaded with...
2011/0136327 HIGH MOBILITY MONOLITHIC P-I-N DIODES
Methods of forming high-current density vertical p-i-n diodes on a substrate are described. The methods include the steps of concurrently combining a...
2011/0136326 PILLAR DEVICES AND METHODS OF MAKING THEREOF
A method of making a semiconductor device includes providing an insulating layer containing a plurality of openings, forming a first semiconductor layer in the...
2011/0136325 Method for fabricating a monolithic integrated composite group III-V and group IV semiconductor device
According to one disclosed embodiment, a monolithic vertically integrated composite device comprises a double sided semiconductor substrate having first and...
2011/0136324 SEMICONDUCTOR DICE TRANSFER-ENABLING APPARATUS AND METHOD FOR MANUFACTURING TRANSFER-ENABLING APPARATUS
A transfer-enabling apparatus, produced by a method of manufacturing, includes a substrate patterned with islands separated by trenches and an epitaxial layer,...
2011/0136323 SEMICONDUCTOR DEVICE MANUFACTURING EQUIPMENT AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Semiconductor device manufacturing equipment in which in the process of dividing a substrate into individual semiconductor devices using a dicing blade, the...
2011/0136322 Adhesive Sheet for a Stealth Dicing and a Production Method of a Semiconductor Wafer Device
An adhesive sheet is provided enabling to efficiently produce the very small size semiconductor chip by a stealth dicing method. An adhesive sheet for a stealth...
2011/0136321 METHOD FOR MANUFACTURING LAMINATION TYPE SEMICONDUCTOR INTEGRATED DEVICE
Provided is a method for manufacturing a lamination type semiconductor integrated device that can simultaneously attain grinding force resistance during back...
2011/0136320 METHOD OF MANUFACTURING SOI SUBSTRATE
To provide an SOI substrate with an SOI layer that can be put into practical use, even when a substrate with a low allowable temperature limit such as a glass...
2011/0136319 Methods Of Forming Isolation Structures, And Methods Of Forming Nonvolatile Memory
Some embodiments include methods of forming isolation structures. A trench may be formed to extend into a semiconductor material. Polysilazane may be formed...
2011/0136318 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING OPTICAL DEVICES
Provided is a method of manufacturing a semiconductor device. According to the method, a first buried oxide layer is formed in the semiconductor substrate in a...
2011/0136317 Semiconductor device, method of fabricating the same, and semicondutor module, electronic circuit board, and...
Example embodiments relate to a semiconductor device including an oxide dielectric layer and a non-oxide dielectric layer, a method of fabricating the device,...
2011/0136316 PHASE CHANGE MEMORY DEVICE IN WHICH A PHASE CHANGE LAYER IS STABLY FORMED AND PREVENTED FROM LIFTING AND METHOD...
A phase change memory device includes a semiconductor substrate having a plurality of phase change cell regions; a lower electrode formed in each of the phase...
2011/0136315 Multi-Level Phase Change Memory
A phase change memory may be formed which is amenable to multilevel programming. The phase change material may be formed with a lateral extent which does not...
2011/0136314 SYSTEMS AND METHODS FOR REDUCING CONTACT TO GATE SHORTS
A method for reducing contact to gate shorts in a semiconductor device and the resulting semiconductor device are described. In one embodiment, a gate is formed...
2011/0136313 Methods of Forming CMOS Transistors with High Conductivity Gate Electrodes
Provided is a method for manufacturing a MOS transistor. The method comprises providing a substrate having a first active region and a second active region;...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.