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| Patent # | Description |
|---|---|
| 2011/0241218 |
Electronic Device and Manufacturing Method A semiconductor package includes a semiconductor chip, an encapsulant embedding the semiconductor chip, first contact pads on a first main face of the... |
| 2011/0241217 |
Multi-Layer Interconnect Structure for Stacked Dies A multi-layer interconnect structure for stacked die configurations is provided. Through-substrate vias are formed in a semiconductor substrate. A backside of... |
| 2011/0241216 |
Semiconductor device A semiconductor device includes a substrate over which a circuit is formed, a multi-layer wiring layer having a plurality of wiring layers formed over the... |
| 2011/0241215 |
EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS
CONTAINING SAME A reconstituted wafer includes a rigid mass with a flat surface and a base surface disposed parallel planar to the flat surface. A plurality of dice are... |
| 2011/0241214 |
Virtually Substrate-less Composite Power Semiconductor Device and Method A virtually substrate-less composite power semiconductor device (VSLCPSD) and method are disclosed. The VSLCPSD has a power semiconductor device (PSD), a... |
| 2011/0241213 |
Silicide Contact Formation A method for forming a silicide contact includes depositing a metal layer on silicon such that the metal layer intermixes with the silicon to form an intermixed... |
| 2011/0241212 |
STRESS LAYER STRUCTURE A stress layer structure includes an active stress portion and a dummy stress portion, both formed of a stress material and disposed on the substrate. The... |
| 2011/0241211 |
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE A method of manufacturing a semiconductor device has forming, in a dielectric film, a first opening and a second opening located in the first opening, forming a... |
| 2011/0241210 |
COMPOSITION FOR SEALING SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND PROCESS
FOR PRODUCING SEMICONDUCTOR DEVICE The invention provides a composition for sealing a semiconductor, the composition being able to form a thin resin layer, suppress the diffusion of a metal... |
| 2011/0241209 |
Substrate comprising alloy film of metal element having barrier function
and metal element having catalytic power It is an object of the present invention to provide a layer having a barrier function and catalytic power and excelling in formation uniformity and coverage of... |
| 2011/0241208 |
MICROELECTRONIC PACKAGE CONTAINING SILICON CONNECTING REGION FOR HIGH
DENSITY INTERCONNECTS, AND METHOD OF... A microelectronic package comprises a substrate (110), a silicon patch (120) embedded in the substrate, a first interconnect structure (131) at a first location... |
| 2011/0241207 |
DUMMY SHOULDER STRUCTURE FOR LINE STRESS REDUCTION Semiconductor integrated circuit line structures for improving a process window in the vicinity of dense-to-isolated pattern transition areas and a technique to... |
| 2011/0241206 |
SEMICONDUCTOR DEVICE A semiconductor device is provided by the present invention. The semiconductor device includes a first semiconductor die comprising at least a first bond pad;... |
| 2011/0241205 |
SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT Semiconductor devices are described that have a metal interconnect extending vertically through a portion of the device to the back side of a semiconductor... |
| 2011/0241204 |
Semiconductor device A semiconductor device includes an electrode pad provided on a semiconductor chip, in which the electrode pad includes aluminum (Al) as a major constituent and... |
| 2011/0241203 |
SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, AND
PORTABLE APPARATUS A semiconductor module includes a device mounting board and a semiconductor device. The semiconductor device and the device mounting board are flip-chip... |
| 2011/0241202 |
Dummy Metal Design for Packaging Structures An integrated circuit structure includes a semiconductor chip, a metal pad at a major surface of the semiconductor chip, and an under-bump metallurgy (UBM) over... |
| 2011/0241201 |
Radiate Under-Bump Metallization Structure for Semiconductor Devices An under-bump metallization (UBM) structure for a semiconductor device is provided. The UBM structure has a center portion and extensions extending out from the... |
| 2011/0241200 |
ULTRA LOW DIELECTRIC CONSTANT MATERIAL WITH ENHANCED MECHANICAL PROPERTIES An ultra low dielectric constant material is disclosed. The ultra-low dielectric constant material comprises a three dimensional random network porous... |
| 2011/0241199 |
PROGRAMMABLE SYSTEM IN PACKAGE Some embodiments of the invention provide a programmable system in package ("PSiP"). The PSiP includes a single IC housing, a substrate and several IC's that... |
| 2011/0241198 |
Power Semiconductor Module In a power semiconductor module, a semiconductor device including electrode surfaces for connection on its front side and back side is connected on its back... |
| 2011/0241197 |
Device and Method for Manufacturing a Device A device includes a first semiconductor chip and a first encapsulant that encapsulates the first semiconductor chip and that includes a cavity. A carrier and an... |
| 2011/0241196 |
COMPLIANT SPRING INTERPOSER FOR WAFER LEVEL THREE DIMENSIONAL (3D)
INTEGRATION AND METHOD OF MANUFACTURING The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor... |
| 2011/0241195 |
FORMING IN-SITU MICRO-FEATURE STRUCTURES WITH CORELESS PACKAGES Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a die to a... |
| 2011/0241194 |
Stacked Semiconductor Device Package Assemblies with Reduced Wire Sweep
and Manufacturing Methods Thereof An embodiment of a stacked package assembly includes: (1) a first semiconductor device package including: (a) a semiconductor device including back and lateral... |
| 2011/0241193 |
Semiconductor Device Packages with Fan-Out and with Connecting Elements
for Stacking and Manufacturing Methods... An embodiment of a semiconductor device package includes: (1) an interconnection unit including a patterned conductive layer; (2) an electrical interconnect... |
| 2011/0241192 |
Wafer-Level Semiconductor Device Packages with Stacking Functionality Described herein are wafer-level semiconductor device packages with stacking functionality and related stacked package assemblies and methods. In one... |
| 2011/0241191 |
SEMICONDUCTOR LAMINATION PACKAGE AND METHOD OF PRODUCING SEMICONDUCTOR
LAMINATION PACKAGE A semiconductor lamination package includes a first package with a first semiconductor chip mounted thereon and a second package with a second semiconductor... |
| 2011/0241190 |
Semiconductor Package A method of manufacturing a semiconductor package includes providing a carrier and attaching at least one semiconductor piece to the carrier. An encapsulant is... |
| 2011/0241189 |
APPARATUS FOR AND METHODS OF ATTACHING HEAT SLUGS TO PACKAGE TOPS A frame includes heat slug pads coupled together in a N.times.M matrix such that singulation of the heat slug pads consists of one or more passes across the... |
| 2011/0241188 |
GRANULAR EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR,
SEMICONDUCTOR DEVICE USING THE SAME AND... Disclosed is a granular epoxy resin composition for encapsulating a semiconductor used for a semiconductor device obtained by encapsulating a semiconductor... |
| 2011/0241187 |
LEAD FRAME WITH RECESSED DIE BOND AREA A lead frame having a recessed die bond area. The lead frame has top and bottom surfaces and a first lead frame thickness defined as the distance between the... |
| 2011/0241186 |
FORMING METAL FILLED DIE BACK-SIDE FILM FOR ELECTROMAGNETIC INTERFERENCE
SHIELDING WITH CORELESS PACKAGES Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a cavity in a... |
| 2011/0241185 |
SIGNAL SHIELDING THROUGH-SUBSTRATE VIAS FOR 3D INTEGRATION A shielded through-substrate via (TSV) structure includes a first through-substrate via configured to transmit a signal at least from a top surface of a... |
| 2011/0241184 |
INTEGRATED CIRCUIT DEVICES HAVING SELECTIVELY STRENGTHENED COMPOSITE
INTERLAYER INSULATION LAYERS AND METHODS... An integrated circuit device includes a plurality of stacked circuit layers, at least one of the plurality of circuit layers including a composite interlayer... |
| 2011/0241183 |
STACKED CHIP PACKAGE WITH REDISTRIBUTION LINES A chip package comprises a first chip having a first side and a second side, wherein said first chip comprises a first pad, a first trace, a second pad and a... |
| 2011/0241182 |
DIE SEAL RING An improved die seal ring is described which includes at least one break. In the region of the break in the die seal ring, the doping is modified so that the... |
| 2011/0241181 |
SEMICONDUCTOR DEVICE WITH A CONTROLLED CAVITY AND METHOD OF FORMATION A semiconductor device includes a first cap wafer having a first opening extending through the first cap wafer, and a second cap wafer bonded to the first cap... |
| 2011/0241180 |
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, METHOD FOR DETECTING A
SEMICONDUCTOR SUBSTRATE AND... A method for manufacturing a semiconductor device, includes: preparing a semiconductor substrate with a first notch; preparing a supporting substrate with a... |
| 2011/0241179 |
DIFFUSION REGION ROUTING FOR NARROW SCRIBE-LINE DEVICES The present disclosure provides a method of making an integrated circuit (IC) device. The method includes forming a first IC feature and a second IC feature in... |
| 2011/0241178 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME An organic protective film 23' is formed on the periphery of a chip region 12 on a substrate 11 so as to continuously surround the internal part of the chip... |
| 2011/0241177 |
Semiconductor wafer including cracking stopper structure and method of
forming the same A semiconductor includes a semiconductor substrate having a main face, the semiconductor device having a device region and a dicing line and a stack of... |
| 2011/0241176 |
Substrate Bonding with Bonding Material Having Rare Earth Metal A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and... |
| 2011/0241175 |
HARDMASK COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PROCESS FOR
PRODUCING A SEMICONDUCTOR INTEGRATED... A hardmask composition for forming a resist underlayer film, a process for producing a semiconductor integrated circuit device, and a semiconductor integrated... |
| 2011/0241174 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Provided is a semiconductor device manufacturing method wherein the following steps are performed; a step of forming at least a part of an element on a base... |
| 2011/0241173 |
RESIST PATTERN FORMATING METHOD The present invention provides a pattern formation method capable of preventing formation of surface defects. In the method, a resist surface after subjected to... |
| 2011/0241172 |
Charge Balance Techniques for Power Devices A silicon wafer includes a silicon region of first conductivity type and a plurality of strips of second conductivity type pillars extending in parallel in the... |
| 2011/0241171 |
Method of fabricating semiconductor integrated circuit device and
semiconductor integrated circuit device... Provided are a method of fabricating a semiconductor integrated circuit device and a semiconductor integrated circuit device fabricated using the method. The... |
| 2011/0241170 |
MONOLITHIC SEMICONDUCTOR SWITCHES AND METHOD FOR MANUFACTURING One aspect is monolithic semiconductor switches and method for manufacturing. One embodiment provides a semiconductor die with a first n-type channel FET and a... |
| 2011/0241169 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE A capacitor having a cylindrical shape is increased in capacitance, and a high-resistance region is prevented from being formed in a lower electrode. A... |
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