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| Patent # | Description |
|---|---|
| 2011/0244718 |
Flexible holder for connectors A holder is capable of providing flexible support for the connector of a flexible printed circuit board, and has particular applicability for battery recharging... |
| 2011/0244717 |
MOUNTING APPARATUS FOR ELECTRONIC DEVICE A mounting apparatus includes a mounting rack and an electronic device. The mounting rack includes a frame. An interface is defined in the frame. The frame... |
| 2011/0244716 |
CABLE ASSEMBLY FOR MOBILE MEDIA DEVICES Disclosed herein is a mobile media device cable assembly for connecting a mobile media device with an accessory device, e.g., a docking station, audio system... |
| 2011/0244715 |
Adaptive Power Strip An adaptive power strip has a power rail. A power entry module and one or more receptacle modules having plug receptacles are mounted on the power rail. The... |
| 2011/0244714 |
HIGH-CURRENT PLUG-IN CONNECTOR The present invention relates to high-current plug-in connectors, in particular to unipolar high-current plug-in connectors for wind turbine generator systems,... |
| 2011/0244713 |
WELDING CONTROL CABLE ASSEMBLY WITH STRAIN RELIEF A cable assembly with strain relief for providing welding control is provided. One welding control cable assembly includes a cable having a plurality of... |
| 2011/0244712 |
ELECTRICAL APPLIANCE An electrical appliance includes a housing having a holding chamber and an insert slot, an insulation displacement connector (IDC), and an electrical component... |
| 2011/0244711 |
CONNECTOR A first connector has a first holding member holding first male and female terminals. Each first male terminal has a horizontally extending first male contact.... |
| 2011/0244710 |
TOOL-RELEASABLE SOLAR POWER CONNECTOR An electrical connector housing system includes a plug housing, a receptacle housing, and a latching mechanism. The latching mechanism pivots on pivot posts on... |
| 2011/0244709 |
Connector for use in accepting a base-plate A connector 100 for use in accepting a base-plate, the connector 100 comprising; a housing 110; an actuator unit 120 which is rotatably attached to the housing... |
| 2011/0244708 |
TERMINAL BLOCK AND METHOD OF ASSEMBLING THE SAME To provide a terminal block having a structure for facilitating the mounting operation of a coil spring to the terminal block, and a method for assembling the... |
| 2011/0244707 |
Apparatus and method securely connecting mating ends of multiple power
cords An apparatus for securely connecting mating ends of two power cords to prevent the mating ends of the two power cords from inadvertently or accidentally... |
| 2011/0244706 |
ELECTRICAL CONNECTOR HAVING A LATCH LOCK An electrical connector includes a housing holding a contact configured for mating with a mating connector. The housing has a deflectable latch configured for... |
| 2011/0244705 |
ELECTRICAL COMPONENTS HAVING CONTACTS CONFIGURED TO ENGAGE THRU-HOLES
USING AXIAL FORCES An electrical component configured to engage a circuit board having a thru-hole. The thru-hole has a plated portion of conductive material that includes an... |
| 2011/0244704 |
EXTENSION CABLE WITH SEQUENCED DISCONNECT A breakaway cable is provided with a plug that has a number of wires that are arranged so as to disconnect in a predetermined sequence. The disconnect plug is... |
| 2011/0244703 |
Cold Cathode Fluorescent Lamp Connector A cold cathode fluorescent lamp connector includes a holding base and a plurality of terminals. The holding base has a base board and a plurality of terminal... |
| 2011/0244702 |
RETICULATED FLASH PREVENTION PLUG A connector for introducing fluid to an electrical cable affixed in a chamber internal to the connector, the connector comprising an injection port exposed to... |
| 2011/0244701 |
ELECTRICAL CONNECTOR AND ONE PAIR OF SWITCH TERMINALS THEREOF An electrical connector includes a base, terminals each being disposed on the base and having a contact, and one pair of switch terminals, disposed on the base,... |
| 2011/0244700 |
WATERPROOF 20 AMP SIMPLEX RECEPTACLE A 20 amp simplex assembly (200) includes a body (202) with a front portion (208). Three terminals (210) extend through the front portion (208). A waterproofing... |
| 2011/0244699 |
Apparatus for Preventing Electrical Shock in Devices A device for preventing electrical shock from a device with electrical interfaces. A shutter or other barrier associated with the device that physically... |
| 2011/0244698 |
Intelligent Inter-Connect and Cross-Connect Patching System An intelligent network patch field management system is provided that includes electronic hardware, firmware, mechanical assemblies, cables, and software that... |
| 2011/0244697 |
MAGNETIC JUMPER FOR BYPASSING ELECTRICAL CIRCUITS A magnetic jumper for bypassing electrical circuits. The jumper includes a magnet at each end of a wire. Each magnet can be attached to a terminal of a low... |
| 2011/0244696 |
60 GHz DATA TRANSMISSION THROUGH A MECHANICAL SWIVEL CONNECTION A swivel mechanism comprising a first swivel portion having a first coupling portion and a second swivel portion having a second coupling portion, the second... |
| 2011/0244695 |
UV-CURABLE INORGANIC-ORGANIC HYBRID RESIN AND METHOD FOR PREPARATION
THEREOF The present invention relates to a method for preparation of an ultraviolet (UV)-curable inorganic-organic hybrid resin containing about or less than 4%... |
| 2011/0244694 |
DEPOSITING CONFORMAL BORON NITRIDE FILMS A method of forming a boron nitride or boron carbon nitride dielectric produces a conformal layer without loading effect. The dielectric layer is formed by... |
| 2011/0244693 |
COMPONENT FOR SEMICONDUCTOR PROCESSING APPARATUS AND MANUFACTURING METHOD
THEREOF A component for a semiconductor processing apparatus includes a matrix defining a shape of the component, and a protection film covering a predetermined surface... |
| 2011/0244692 |
Method for Forming a Nano-textured Substrate A method for forming a nano-textured surface on a substrate is disclosed. An illustrative embodiment of the present invention comprises dispensing of a... |
| 2011/0244691 |
ETCHING PROCESSING METHOD An etching processing method for etching a substrate formed with a target film and a mask film is performed in a substrate processing apparatus including a... |
| 2011/0244690 |
COMBINATORIAL PLASMA ENHANCED DEPOSITION AND ETCH TECHNIQUES According to various embodiments of the disclosure, an apparatus and method for enhanced deposition and etch techniques is described, including a pedestal, the... |
| 2011/0244689 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE A method of manufacturing a semiconductor device includes forming a first mask pattern on a substrate by using a material including a polymer having a... |
| 2011/0244688 |
METHOD OF PRODUCING MASK According to one embodiment, a method of producing a mask includes: a step of forming a pattern on a substrate; a step of forming a first film that covers the... |
| 2011/0244687 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD In a process for forming trenches having M different widths in a substrate, a passivation step and an etching step are alternately performed. The passivation... |
| 2011/0244686 |
INORGANIC RAPID ALTERNATING PROCESS FOR SILICON ETCH A method for etching features into a silicon substrate disposed below a mask in a plasma processing chamber is provided. The silicon substrate is etched through... |
| 2011/0244685 |
Method of chemical mechanical polishing a substrate with polishing
composition adapted to enhance silicon oxide... A method for chemical mechanical polishing of a substrate is provided, comprising: providing a substrate, wherein the substrate comprises silicon oxide;... |
| 2011/0244684 |
POLISHING LIQUID AND POLISHING METHOD Provided is a polishing liquid which is used for chemical mechanical polishing of a body to be polished having a layer containing polysilicon or a modified... |
| 2011/0244683 |
Fabricating Voids Using Slurry Protect Coat Before Chemical-Mechanical
Polishing A semiconductor structure is fabricated with a void such as a line, contact, via or zia. To prevent slurry particles from falling into and remaining in a void... |
| 2011/0244682 |
ATOMIC LAYER DEPOSITION OF TUNGSTEN MATERIALS Embodiments of the invention provide a method for depositing tungsten-containing materials. In one embodiment, a method includes forming a tungsten nucleation... |
| 2011/0244681 |
METHOD OF FORMING A TANTALUM-CONTAINING LAYER ON A SUBSTRATE A method for forming a tantalum-containing layer on a substrate, the method comprising at least the steps of: a) providing a vapor comprising at least one... |
| 2011/0244680 |
SURFACE CLEANING AND SELECTIVE DEPOSITION OF METAL-CONTAINING CAP LAYERS
FOR SEMICONDUCTOR DEVICES A method is provided for integrating metal-containing cap layers into copper (Cu) metallization of semiconductor devices. In one embodiment, the method includes... |
| 2011/0244679 |
Contact Elements of a Semiconductor Device Formed by Electroless Plating
and Excess Material Removal with... Contact elements in the contact level of a semiconductor device may be formed on the basis of a selective deposition technique, such as electroless plating,... |
| 2011/0244678 |
SEMICONDUCTOR PROCESS A semiconductor process is provided. First, a metal layer, a dielectric layer and a patterned hard mask layer are sequentially formed on a substrate.... |
| 2011/0244677 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
MANUFACTURING APPARATUS A method of manufacturing a semiconductor device includes: forming a first conductive film on a substrate; forming an insulating film to cover the conductive... |
| 2011/0244676 |
CHEMICAL MECHANICAL POLISHING (CMP) PROCESSING OF THROUGH-SILICON VIA
(TSV) AND CONTACT PLUG SIMULTANEOUSLY A method includes forming conductive material in a contact hole and a TSV opening, and then performing one step to remove portions of the conductive material... |
| 2011/0244675 |
Structure and method of forming pillar bumps with controllable shape and
size A structure and method of forming pillar bumps with controllable shape and size are provided, which use polishing planarization technology to eliminate shape... |
| 2011/0244674 |
Method Of Forming A Plurality Of Spaced Features A method of forming a plurality of spaced features includes forming sacrificial hardmask material over underlying material. The sacrificial hardmask material... |
| 2011/0244673 |
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH BURIED GATES A method for fabricating a semiconductor device includes: forming a thin film over trenches by using a first source gas and a first reaction gas; performing a... |
| 2011/0244672 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE A method of manufacturing a semiconductor device including forming a mask layer on a polycrystalline silicon film formed on a semiconductor substrate via an... |
| 2011/0244671 |
Method for Fabricating a III-Nitride Semiconductor Device A III-nitride semiconductor device which includes a barrier body between the gate electrode and the gate dielectric thereof. |
| 2011/0244670 |
Replacement Gate Approach for High-K Metal Gate Stacks by Avoiding a
Polishing Process for Exposing the... In a replacement gate approach, the exposure of the placeholder material of the gate electrode structures may be accomplished on the basis of an etch process,... |
| 2011/0244669 |
METHOD FOR LOW TEMPERATURE ION IMPLANTATION Techniques for low temperature ion implantation are provided to improve the throughput. During a low temperature ion implantation, an implant process may be... |
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