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Patent # Description
2011/0244718 Flexible holder for connectors
A holder is capable of providing flexible support for the connector of a flexible printed circuit board, and has particular applicability for battery recharging...
2011/0244717 MOUNTING APPARATUS FOR ELECTRONIC DEVICE
A mounting apparatus includes a mounting rack and an electronic device. The mounting rack includes a frame. An interface is defined in the frame. The frame...
2011/0244716 CABLE ASSEMBLY FOR MOBILE MEDIA DEVICES
Disclosed herein is a mobile media device cable assembly for connecting a mobile media device with an accessory device, e.g., a docking station, audio system...
2011/0244715 Adaptive Power Strip
An adaptive power strip has a power rail. A power entry module and one or more receptacle modules having plug receptacles are mounted on the power rail. The...
2011/0244714 HIGH-CURRENT PLUG-IN CONNECTOR
The present invention relates to high-current plug-in connectors, in particular to unipolar high-current plug-in connectors for wind turbine generator systems,...
2011/0244713 WELDING CONTROL CABLE ASSEMBLY WITH STRAIN RELIEF
A cable assembly with strain relief for providing welding control is provided. One welding control cable assembly includes a cable having a plurality of...
2011/0244712 ELECTRICAL APPLIANCE
An electrical appliance includes a housing having a holding chamber and an insert slot, an insulation displacement connector (IDC), and an electrical component...
2011/0244711 CONNECTOR
A first connector has a first holding member holding first male and female terminals. Each first male terminal has a horizontally extending first male contact....
2011/0244710 TOOL-RELEASABLE SOLAR POWER CONNECTOR
An electrical connector housing system includes a plug housing, a receptacle housing, and a latching mechanism. The latching mechanism pivots on pivot posts on...
2011/0244709 Connector for use in accepting a base-plate
A connector 100 for use in accepting a base-plate, the connector 100 comprising; a housing 110; an actuator unit 120 which is rotatably attached to the housing...
2011/0244708 TERMINAL BLOCK AND METHOD OF ASSEMBLING THE SAME
To provide a terminal block having a structure for facilitating the mounting operation of a coil spring to the terminal block, and a method for assembling the...
2011/0244707 Apparatus and method securely connecting mating ends of multiple power cords
An apparatus for securely connecting mating ends of two power cords to prevent the mating ends of the two power cords from inadvertently or accidentally...
2011/0244706 ELECTRICAL CONNECTOR HAVING A LATCH LOCK
An electrical connector includes a housing holding a contact configured for mating with a mating connector. The housing has a deflectable latch configured for...
2011/0244705 ELECTRICAL COMPONENTS HAVING CONTACTS CONFIGURED TO ENGAGE THRU-HOLES USING AXIAL FORCES
An electrical component configured to engage a circuit board having a thru-hole. The thru-hole has a plated portion of conductive material that includes an...
2011/0244704 EXTENSION CABLE WITH SEQUENCED DISCONNECT
A breakaway cable is provided with a plug that has a number of wires that are arranged so as to disconnect in a predetermined sequence. The disconnect plug is...
2011/0244703 Cold Cathode Fluorescent Lamp Connector
A cold cathode fluorescent lamp connector includes a holding base and a plurality of terminals. The holding base has a base board and a plurality of terminal...
2011/0244702 RETICULATED FLASH PREVENTION PLUG
A connector for introducing fluid to an electrical cable affixed in a chamber internal to the connector, the connector comprising an injection port exposed to...
2011/0244701 ELECTRICAL CONNECTOR AND ONE PAIR OF SWITCH TERMINALS THEREOF
An electrical connector includes a base, terminals each being disposed on the base and having a contact, and one pair of switch terminals, disposed on the base,...
2011/0244700 WATERPROOF 20 AMP SIMPLEX RECEPTACLE
A 20 amp simplex assembly (200) includes a body (202) with a front portion (208). Three terminals (210) extend through the front portion (208). A waterproofing...
2011/0244699 Apparatus for Preventing Electrical Shock in Devices
A device for preventing electrical shock from a device with electrical interfaces. A shutter or other barrier associated with the device that physically...
2011/0244698 Intelligent Inter-Connect and Cross-Connect Patching System
An intelligent network patch field management system is provided that includes electronic hardware, firmware, mechanical assemblies, cables, and software that...
2011/0244697 MAGNETIC JUMPER FOR BYPASSING ELECTRICAL CIRCUITS
A magnetic jumper for bypassing electrical circuits. The jumper includes a magnet at each end of a wire. Each magnet can be attached to a terminal of a low...
2011/0244696 60 GHz DATA TRANSMISSION THROUGH A MECHANICAL SWIVEL CONNECTION
A swivel mechanism comprising a first swivel portion having a first coupling portion and a second swivel portion having a second coupling portion, the second...
2011/0244695 UV-CURABLE INORGANIC-ORGANIC HYBRID RESIN AND METHOD FOR PREPARATION THEREOF
The present invention relates to a method for preparation of an ultraviolet (UV)-curable inorganic-organic hybrid resin containing about or less than 4%...
2011/0244694 DEPOSITING CONFORMAL BORON NITRIDE FILMS
A method of forming a boron nitride or boron carbon nitride dielectric produces a conformal layer without loading effect. The dielectric layer is formed by...
2011/0244693 COMPONENT FOR SEMICONDUCTOR PROCESSING APPARATUS AND MANUFACTURING METHOD THEREOF
A component for a semiconductor processing apparatus includes a matrix defining a shape of the component, and a protection film covering a predetermined surface...
2011/0244692 Method for Forming a Nano-textured Substrate
A method for forming a nano-textured surface on a substrate is disclosed. An illustrative embodiment of the present invention comprises dispensing of a...
2011/0244691 ETCHING PROCESSING METHOD
An etching processing method for etching a substrate formed with a target film and a mask film is performed in a substrate processing apparatus including a...
2011/0244690 COMBINATORIAL PLASMA ENHANCED DEPOSITION AND ETCH TECHNIQUES
According to various embodiments of the disclosure, an apparatus and method for enhanced deposition and etch techniques is described, including a pedestal, the...
2011/0244689 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes forming a first mask pattern on a substrate by using a material including a polymer having a...
2011/0244688 METHOD OF PRODUCING MASK
According to one embodiment, a method of producing a mask includes: a step of forming a pattern on a substrate; a step of forming a first film that covers the...
2011/0244687 SEMICONDUCTOR DEVICE MANUFACTURING METHOD
In a process for forming trenches having M different widths in a substrate, a passivation step and an etching step are alternately performed. The passivation...
2011/0244686 INORGANIC RAPID ALTERNATING PROCESS FOR SILICON ETCH
A method for etching features into a silicon substrate disposed below a mask in a plasma processing chamber is provided. The silicon substrate is etched through...
2011/0244685 Method of chemical mechanical polishing a substrate with polishing composition adapted to enhance silicon oxide...
A method for chemical mechanical polishing of a substrate is provided, comprising: providing a substrate, wherein the substrate comprises silicon oxide;...
2011/0244684 POLISHING LIQUID AND POLISHING METHOD
Provided is a polishing liquid which is used for chemical mechanical polishing of a body to be polished having a layer containing polysilicon or a modified...
2011/0244683 Fabricating Voids Using Slurry Protect Coat Before Chemical-Mechanical Polishing
A semiconductor structure is fabricated with a void such as a line, contact, via or zia. To prevent slurry particles from falling into and remaining in a void...
2011/0244682 ATOMIC LAYER DEPOSITION OF TUNGSTEN MATERIALS
Embodiments of the invention provide a method for depositing tungsten-containing materials. In one embodiment, a method includes forming a tungsten nucleation...
2011/0244681 METHOD OF FORMING A TANTALUM-CONTAINING LAYER ON A SUBSTRATE
A method for forming a tantalum-containing layer on a substrate, the method comprising at least the steps of: a) providing a vapor comprising at least one...
2011/0244680 SURFACE CLEANING AND SELECTIVE DEPOSITION OF METAL-CONTAINING CAP LAYERS FOR SEMICONDUCTOR DEVICES
A method is provided for integrating metal-containing cap layers into copper (Cu) metallization of semiconductor devices. In one embodiment, the method includes...
2011/0244679 Contact Elements of a Semiconductor Device Formed by Electroless Plating and Excess Material Removal with...
Contact elements in the contact level of a semiconductor device may be formed on the basis of a selective deposition technique, such as electroless plating,...
2011/0244678 SEMICONDUCTOR PROCESS
A semiconductor process is provided. First, a metal layer, a dielectric layer and a patterned hard mask layer are sequentially formed on a substrate....
2011/0244677 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS
A method of manufacturing a semiconductor device includes: forming a first conductive film on a substrate; forming an insulating film to cover the conductive...
2011/0244676 CHEMICAL MECHANICAL POLISHING (CMP) PROCESSING OF THROUGH-SILICON VIA (TSV) AND CONTACT PLUG SIMULTANEOUSLY
A method includes forming conductive material in a contact hole and a TSV opening, and then performing one step to remove portions of the conductive material...
2011/0244675 Structure and method of forming pillar bumps with controllable shape and size
A structure and method of forming pillar bumps with controllable shape and size are provided, which use polishing planarization technology to eliminate shape...
2011/0244674 Method Of Forming A Plurality Of Spaced Features
A method of forming a plurality of spaced features includes forming sacrificial hardmask material over underlying material. The sacrificial hardmask material...
2011/0244673 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH BURIED GATES
A method for fabricating a semiconductor device includes: forming a thin film over trenches by using a first source gas and a first reaction gas; performing a...
2011/0244672 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device including forming a mask layer on a polycrystalline silicon film formed on a semiconductor substrate via an...
2011/0244671 Method for Fabricating a III-Nitride Semiconductor Device
A III-nitride semiconductor device which includes a barrier body between the gate electrode and the gate dielectric thereof.
2011/0244670 Replacement Gate Approach for High-K Metal Gate Stacks by Avoiding a Polishing Process for Exposing the...
In a replacement gate approach, the exposure of the placeholder material of the gate electrode structures may be accomplished on the basis of an etch process,...
2011/0244669 METHOD FOR LOW TEMPERATURE ION IMPLANTATION
Techniques for low temperature ion implantation are provided to improve the throughput. During a low temperature ion implantation, an implant process may be...
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