Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2011/0244668 Semiconductor device and manufacturing process therefor
A process for manufacturing a semiconductor device, in which a current flows in a deflected part that includes a semiconductor, includes forming a straight beam...
2011/0244667 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device including a nitride semiconductor layer having high-precision thickness is provided. The method includes steps...
2011/0244666 Methods Of Manufacturing Stair-Type Structures And Methods Of Manufacturing Nonvolatile Memory Devices Using...
Methods of manufacturing stair-type structures and methods of manufacturing nonvolatile memory devices using the same. Methods of manufacturing stair-type...
2011/0244665 MANUFACTURING METHOD OF GaN BASED SEMICONDUCTOR EPITAXIAL SUBSTRATE
A low-temperature protective layer having AlN is grown on a rare earth perovskite substrate and a first GaN based semiconductor layer having ...
2011/0244664 METHOD OF MANUFACTURING SUPERJUNCTION STRUCTURE
The present invention discloses a method of manufacturing superjunction structure, which comprises: step 1, grow an N type epitaxial layer on a substrate having...
2011/0244663 FORMING A COMPOUND-NITRIDE STRUCTURE THAT INCLUDES A NUCLEATION LAYER
The present invention generally provides apparatus and methods for forming LED structures. In one embodiment, a method for fabricating a compound nitride-based...
2011/0244662 METHOD OF MANUFACTURING GRAPHENE BY USING GERMANIUM LAYER
A method of manufacturing graphene includes forming a germanium layer on a surface of a substrate, and forming the graphene directly on the germanium layer by...
2011/0244661 Large Scale High Quality Graphene Nanoribbons From Unzipped Carbon Nanotubes
A new method is disclosed for large-scale production of pristine few-layer graphene nanoribbons (GNRs) through unzipping of mildly gas-phase oxidized, and,...
2011/0244660 MANUFACTURING METHOD OF SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
An object is to provide a manufacturing method of a semiconductor substrate provided with a single crystal semiconductor layer with a surface having a high...
2011/0244659 WAFER CUTTING METHOD AND A SYSTEM THEREOF
A method for cutting a semiconductor wafer by generating a crack within the wafer, and a system thereof, are provided. The method comprises irradiating a laser...
2011/0244658 Crack Stops for Semiconductor Devices
Crack stops for semiconductor devices, semiconductor devices, and methods of manufacturing semiconductor devices are disclosed. In one embodiment, a barrier...
2011/0244657 SEMICONDUCTOR DIE SINGULATION METHOD
In one embodiment, a method of singulating semiconductor die from a semiconductor wafer includes forming a material on a surface of a semiconductor wafer and...
2011/0244656 INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
It is an object of the present invention to improve a factor which influences productivity such as variation caused by a characteristic defect of a circuit by...
2011/0244655 METHOD FOR FABRICATING SOI SUBSTRATE
There is provided a method for manufacturing an SOI substrate capable of effectively and efficiently embrittling an interface of an ion-implanted layer without...
2011/0244654 METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
A nitride-based semiconductor crystal and a second substrate are bonded together. In this state, impact is applied externally to separate the low-dislocation...
2011/0244653 METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
An object of the present invention is to reduce the influence of a foreign substance adhering to a single crystalline semiconductor substrate and manufacture a...
2011/0244652 METHOD OF MANUFACTURING SOI SUBSTRATE
An object of the present invention is to provide an SOI substrate including a semiconductor layer which is efficiently planarized. A method for manufacturing an...
2011/0244651 METHOD AND DEVICE FOR ALTERNATELY CONTACTING TWO WAFERS
A method and device for alternatively contacting two wafer-like component composite arrangements, in which two component composite arrangements, provided with...
2011/0244650 SEMICONDUCTOR DEVICE WITH STI AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
A semiconductor device includes: a semiconductor substrate having first and second areas; an STI isolation region being made of an isolation trench formed in...
2011/0244649 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes: a process to form an element isolation trench on a semiconductor substrate, the element isolation...
2011/0244648 Method of Manufacturing Nonvolatile Memory Device
In one embodiment of a method of manufacturing a nonvolatile memory device, a tunnel insulating layer and a charge trap layer are first formed over a...
2011/0244647 Mark Structure for Coarse Wafer Alignment and Method for Manufacturing Such a Mark Structure
A method for forming a mark structure on a substrate comprising a plurality of lines. The lines extend parallel to each other in a first direction and are...
2011/0244646 SEMICONDUCTOR WITH A DYNAMIC GATE-DRAIN CAPACITANCE
A semiconductor device with a dynamic gate drain capacitance. One embodiment provides a semiconductor device. The device includes a semiconductor substrate, a...
2011/0244645 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
A semiconductor device includes: a semiconductor substrate in which a trench is formed; a source region and a drain region each of which is buried in the trench...
2011/0244644 Two Step Poly Etch LDMOS Gate Formation
A method of making a transistor includes etching a first side of a gate, the gate including an oxide layer formed over a substrate and a conductive material...
2011/0244643 SILICON CARBIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A manufacturing method of a silicon carbide semiconductor device in which an electric field applied to a gate oxide film can be relaxed and thereby reliability...
2011/0244642 METHOD OF FABRICATING SEMICONDUCTOR DEVICE
A method of fabricating a semiconductor device utilizes a substrate including a high voltage circuit area, a medium voltage circuit area and a low voltage...
2011/0244641 Shielded Gate Trench FET with an Inter-electrode Dielectric Having a Low-k Dielectric Therein
A method for forming a shielded gate trench field effect transistor (FET) includes forming trenches in a semiconductor region, forming a shield electrode in a...
2011/0244640 METHOD OF MANUFACTURING FLASH MEMORY CELL
A method of manufacturing a flash memory cell includes providing a substrate having a first dielectric layer formed thereon, forming a control gate on the first...
2011/0244639 METHOD FOR MANUFACTURING A PATTERN FORMED BODY, METHOD FOR MANUFACTURING A FUNCTIONAL ELEMENT, AND METHOD FOR...
A main object of the present invention is to disclose a manufacturing method of the pattern formed body capable of attaining patterning efficiently with a high...
2011/0244638 SEMICONDUCTOR DEVICE MANUFACTURING METHOD
A semiconductor device manufacturing method is a method of forming a semiconductor device that includes a cell part that includes plural transistor cells in...
2011/0244637 MOLD AND SUBSTRATE FOR USE WITH MOLD
A mold (10) including a first mold part (12) and a second mold part (14) define a mold cavity (16) therebetween. A gate (18) is formed in at least one of the...
2011/0244636 MANUFACTURING METHOD OF SEMICONDUCTOR CHIP-EMBEDDED WIRING SUBSTRATE
With respect to a substrate including a first film, on a surface of which a pad is formed, a second film made of thermoplastic resin is a thermal compression...
2011/0244635 METHOD FOR MANUFACTURE OF INLINE INTEGRATED CIRCUIT SYSTEM
A method for manufacture of an integrated circuit package system includes: providing a leadframe with an integrated circuit mounted thereover; encapsulating the...
2011/0244634 SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME
A semiconductor package and a method of manufacturing the semiconductor package. The semiconductor package includes a first package that a first semiconductor...
2011/0244633 PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES
Semiconductor packages and methods for making and using such semiconductor packages are described. The semiconductor packages contain a dual gauge heat sink...
2011/0244632 Reduction of Mechanical Stress in Metal Stacks of Sophisticated Semiconductor Devices During Die-Substrate...
In a reflow process for connecting a semiconductor die and a package substrate, the temperature gradient and thus the thermally induced mechanical forces in a...
2011/0244631 SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND WIRING BOARD
In a semiconductor device manufacturing method, a semiconductor chip is mounted on a support board so as to expose a side of the semiconductor chip on which a...
2011/0244630 Method of Substrate Bonding with Bonding Material Having Rare Earth Metal
A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and...
2011/0244629 Packaging Process to Create Wettable Lead Flank During Board Assembly
A method and apparatus are described for fabricating a low-pin-count chip package (701) including a die pad (706) for receiving an integrated circuit device and...
2011/0244628 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes: supplying a supercritical fluid mixed with an under-fill material to a stacked unit, which has a...
2011/0244627 METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE
In a method of manufacturing a photoelectric conversion device having a pixel region and a peripheral circuit region, a semiconductor compound layer is formed...
2011/0244626 METHOD OF FORMING SOLAR CELL
A method of forming solar cell includes the following steps. A substrate having a first region and a second region is provided. A dopant source layer is then...
2011/0244625 Continuously Optimized Solar Cell Metallization Design through Feed-Forward Process
An improved, lower cost method of processing substrates, such as to create solar cells, is disclosed. The doped regions are created on the substrate, using a...
2011/0244624 Production Method of Photoelectric Conversion Device and Solution for Forming Semiconductor
The production method of a photoelectric conversion device comprises the steps of adding a chalcogenide powder of a group-IIIB element to an organic solvent...
2011/0244623 RAPID THERMAL METHOD AND DEVICE FOR THIN FILM TANDEM CELL
A method for forming a thin film photovoltaic device. The method includes providing a transparent substrate comprising a surface region. A first transparent...
2011/0244622 METHODS OF FORMING A CONDUCTIVE TRANSPARENT OXIDE FILM LAYER FOR USE IN A CADMIUM TELLURIDE BASED THIN FILM...
Methods are generally provided for forming a conductive oxide layer on a substrate. In one particular embodiment, the method can include sputtering a...
2011/0244621 METHODS OF FORMING A CONDUCTIVE TRANSPARENT OXIDE FILM LAYER FOR USE IN A CADMIUM TELLURIDE BASED THIN FILM...
Methods are generally provided for forming a conductive oxide layer on a substrate. In one particular embodiment, the method can include sputtering a...
2011/0244620 Methods Of Forming A Conductive Transparent Oxide Film Layer For Use In A Cadmium Telluride Based Thin Film...
Methods are generally provided for forming a conductive oxide layer on a substrate. In one particular embodiment, the method can include sputtering a...
2011/0244619 METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE
A solid-state imaging device with an improved heat release-ability for releasing a heat generated in the amplifier unit of the solid-state image sensing...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.