Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2011/0300733 METHOD AND SYSTEM FOR PREVENTING DISENGAGEMENT BETWEEN AN ELECTRICAL PLUG AND A CHARGE PORT ON AN ELECTRIC VEHICLE
A system and method is provided for preventing disengagement between an electrical plug and a charge port on an electric vehicle. One or more projections are...
2011/0300732 PLUG-TYPE CONNECTOR
The invention relates to a plug-type connector with a cable, which has at least one line, a contact carrier, which has at least one contact element, which is...
2011/0300731 WATERPROOF CONNECTOR
A waterproof connector has a first housing and a seal member. The first housing has an accommodation chamber which accommodates a terminal attached to an...
2011/0300730 WATERPROOF STRUCTURE FOR A CABLE CONNECTOR, AND A PLUG CONNECTOR, SOCKET CONNECTOR AND CABLE CONNECTOR...
In the case where the cable CA is passed through the hole of the sealing tube and connected to the plug contact terminal and the socket contact terminal, when...
2011/0300729 Outlet Cover
An electrical outlet safety cap is easily removed from an electrical outlet by adults but not by children. The safety cap comprises a disk, prong or prongs, and...
2011/0300728 LOCKING DEVICE
A locking device that locks a power feeding plug to a power receiving connector and locks a lid covering the power receiving connector. The locking device...
2011/0300727 CONNECTION RECEPTACLE LOCK AND SECURITY STRUCTURE
A lock and security structure is provided for a connection receptacle and includes a connection port, a pawl portion, and a lock and security portion. The...
2011/0300726 Connectors for electrically active grid
The invention includes an electrified framework system having a plurality of grid members which form a grid framework. A conductive material is disposed on a...
2011/0300725 Busbar Electrical Power Connector
A dual pole busbar power connector including opposing elements configured to form a slot configured to receive a dual-pole blade therebetween. The slot extends...
2011/0300724 EXTENDED USB PLUG, USB PCBA, AND USB FLASH DRIVE WITH DUAL-PERSONALITY FOR EMBEDDED APPLICATION WITH MOTHER BOARDS
An extended universal serial bus (USB) storage device is described herein. According to one embodiment, an extended USB storage device includes a printed...
2011/0300723 CONDUCTOR LINE, COLLECTOR AND CONDUCTOR SYSTEM
The invention relates to: a conductor line (2) for powering at least one device (11) that can travel along the conductor line (2), comprising a first elongated...
2011/0300722 SUBSTRATE PROCESSING APPARATUS
A substrate processing device comprises a reaction vessel 11 forming a space receiving a substrate 1 and adapted to have a plurality of reaction gases supplied...
2011/0300721 Methods of Making Crystalline Tantalum Pentoxide
There is disclosed a method of forming crystalline tantalum pentoxide on a ruthenium-containing material having an oxygen-containing surface wherein the...
2011/0300720 Plasma treatment of substrates prior to deposition
A plasma processing chamber particularly useful for pre-treating low-k dielectric films and refractory metal films subject to oxidation prior to deposition of...
2011/0300719 FILM FORMATION METHOD AND FILM FORMATION APPARATUS
When an object to be processed is transferred into a process chamber capable of keeping a vacuum and an interior of the process chamber is kept in a vacuum...
2011/0300718 ON-WAFER CRYSTALLIZATION FOR PURE-SILICA-ZEOLITE ULTRA LOW-K FILMS
An on-wafer crystallization method of spin-coating a silicon wafer with a low-k dielectric zeolite material which includes the steps of forming a synthesis...
2011/0300717 METHOD FOR CONTROLLING DANGLING BONDS IN FLUOROCARBON FILMS
Embodiments of the invention describe methods for forming fluorocarbon (CF) films for semiconductor devices. According to one embodiment, the method includes...
2011/0300716 METHOD OF IMPROVING FILM NON-UNIFORMITY AND THROUGHPUT
Methods, apparatus, and systems for depositing materials with gaseous precursors are provided. In certain implementations, the methods involve providing a wafer...
2011/0300715 INTEGRATED METHOD AND SYSTEM FOR MANUFACTURING MONOLITHIC PANELS OF CRYSTALLINE SOLAR CELLS
A method for fabricating a photovoltaic (PV) cell panel wherein all PV cells are formed simultaneously on a two-dimensional array of monocrystalline silicon...
2011/0300714 PLASMA PROCESSING CHAMBER COMPONENT HAVING ADAPTIVE THERMAL CONDUCTOR
An assembly comprises a component of a plasma process chamber, a thermal source and a polymer composite therebetween exhibiting a phase transition between a...
2011/0300713 OVERLAY VERNIER KEY AND METHOD FOR FABRICATING THE SAME
Methods are disclosed for fabricating an overlay vernier key. A method includes forming a pattern layer and an insulating layer over a semiconductor substrate....
2011/0300712 Methods of Forming a Photoresist Pattern Using Plasma Treatment of Photoresist Patterns
Methods of forming a photoresist pattern include forming a first photoresist pattern on a substrate and treating the first photoresist pattern with plasma that...
2011/0300711 METHOD AND SYSTEM FOR PATTERNING A SUBSTRATE
A method of patterning a substrate comprises providing an array of resist features defined by a first pitch and a first gap width between adjacent resist...
2011/0300710 Method for Forming Through-Base Wafer Vias for Fabrication of Stacked Devices
An effective chemical mechanical planarization (CMP) method is provided for forming vias in silicon wafers for the fabrication of stacked devices using TSV...
2011/0300709 METHOD OF SEMICONDUCTOR WAFER BACK PROCESSING, METHOD OF SUBSTRATE BACK PROCESSING, AND RADIATION-CURABLE...
The present invention relates to a method of semiconductor wafer back processing, which includes applying a radiation-curable pressure-sensitive adhesive sheet...
2011/0300708 THROUGH-SILICON VIA STRUCTURE AND METHOD FOR MAKING THE SAME
A through-silicon via structure includes a substrate with a first side and a second side, a through-silicon hole connecting the first side and the second side...
2011/0300707 Metallization and Its Use In, In Particular, an IGBT or a Diode
A method of fabricating a power semiconductor component having a semiconductor body having at least two main surfaces includes applying a layer of a...
2011/0300706 METHOD FOR FABRICATING INTERCONNECTION STRUCTURE
A method for fabricating an interconnection structure includes the following steps. Firstly, a substrate having a first conductive layer thereon is provided....
2011/0300705 MANUFACTURING METHOD OF BUMP STRUCTURE WITH ANNULAR SUPPORT
A manufacturing method of a bump structure with an annular support includes the following steps. A substrate including pads and a passivation layer is provided....
2011/0300704 SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS WITH STRESS BUFFER SPACERS AND METHODS OF FABRICATING THE SAME
A semiconductor device includes an inorganic insulating layer on a semiconductor substrate, a contact plug that extends through the inorganic insulating layer...
2011/0300703 SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
This semiconductor memory device comprises a semiconductor substrate, a plurality of tunnel insulator films formed on the semiconductor substrate along a first...
2011/0300702 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
An insulating film is formed on a semiconductor substrate. A metal sacrificial film is formed on the insulating film. Then, the sacrificial film is selectively...
2011/0300701 APPARATUS HAVING A DIELECTRIC CONTAINING SCANDIUM AND GADOLINIUM
Apparatus having a dielectric containing scandium and gadolinium can provide a reliable structure with a high dielectric constant (high k). In an embodiment, a...
2011/0300700 SEMICONDUCTOR DEVICE HAVING A HIGH ASPECT RATIO ISOLATION TRENCH AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device having high aspect ratio isolation trenches and a method for manufacturing the same is presented. The semiconductor device includes a...
2011/0300699 FABRICATION OF A MEMORY WITH TWO SELF-ALIGNED INDEPENDENT GATES
A method for making a micro-electronic non-volatile memory device provided with transistors having gates placed side by side, the method comprising the steps...
2011/0300698 METHODS FOR FORMING A GATE AND A SHALLOW TRENCH ISOLATION REGION AND FOR PLANARIZING AN ETCHED SURFACE OF...
A method for forming a gate, which can improve the etching uniformity of the sidewalls of the gate, includes the following steps: forming a dielectric layer on...
2011/0300697 METHOD OF FABRICATING SEMICONDUCTOR DEVICE
Disclosed is a method of fabricating a semiconductor device, including the steps of forming a diffusion preventing mask on a surface of a semiconductor...
2011/0300696 METHOD FOR DAMAGE-FREE JUNCTION FORMATION
Embodiments of this doping method may be used to improve junction formation. An implant species, such as helium or another noble gas, is implanted into a...
2011/0300695 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING APPARATUS
A method of manufacturing a semiconductor device includes the steps of loading a substrate into a processing chamber; processing the substrate by supplying...
2011/0300694 ELECTRODE CIRCUIT, FILM FORMATION DEVICE, ELECTRODE UNIT, AND FILM FORMATION METHOD
An electrode circuit for plasma CVD includes: an alternating-current source; a matching circuit that is connected to the alternating-current source; and...
2011/0300693 Semiconductor Devices
Provided is a semiconductor device. The semiconductor device includes a semiconductor substrate, a first isolation dielectric pattern on the semiconductor...
2011/0300692 METHOD FOR DIVIDING A SEMICONDUCTOR FILM FORMED ON A SUBSTRATE INTO PLURAL REGIONS BY MULTIPLE LASER BEAM...
The present invention relates to a method for dividing a semiconductor film formed on a substrate into plural regions by multiple laser beam irradiation using a...
2011/0300691 WORKPIECE CUTTING METHOD
Fractures (17a, 17b) are generated from modified regions (7a, 7b) to front and rear faces (12a, 12b) of a object to be processed (1), respectively, while an...
2011/0300690 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
To provide a method of manufacturing a semiconductor device in which the space between semiconductor films transferred at plural locations is narrowed. A first...
2011/0300689 Methods of Forming Trench Isolation in the Fabrication of Integrated Circuitry and Methods of Fabricating...
First and second isolation trenches are formed into semiconductive material of a semiconductor substrate. The first isolation trench has a narrowest outermost...
2011/0300688 METHODS FOR FORMING A GATE AND A SHALLOW TRENCH ISOLATION REGION AND FOR PLANARIZING AN ETCHED SURFACE OF...
A method for forming a gate, which can improve the etching uniformity of the sidewalls of the gate, includes the following steps: forming a dielectric layer on...
2011/0300687 NANO-DIMENSIONAL NON-VOLATILE MEMORY CELLS
A non-volatile memory cell that includes a first electrode; a second electrode; and an electrical contact region that electrically connects the first electrode...
2011/0300686 Methods of Fabricating Non-Volatile Memory Devices
Methods of forming non-volatile memory devices include forming a semiconductor layer having a first impurity region of first conductivity type extending...
2011/0300685 METHODS FOR FABRICATING PHASE CHANGE MEMORY DEVICES
Provided is a method for fabricating a phase change memory device. The method includes forming a plurality of bottom electrodes on a substrate, forming a first...
2011/0300684 METHOD FABRICATING PHASE-CHANGE SEMICONDUCTOR MEMORY DEVICE
A method of fabricating a phase change memory having a unit memory cell is described. The unit memory cell includes a phase change element connected to a...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.