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Patent # Description
2012/0068375 PLASTIC OBJECT FOR USE IN PERSONAL HYGIENE
A unitary two component article for personal hygiene, such as a toothbrush, wherein the same is formed by injection molding of two differing plastic materials....
2012/0068374 METHOD FOR MAKING A REINFORCEMENT PROVIDED WITH AT LEAST ONE ADHESIVE SURFACE CAPABLE OF BEING REPOSITIONED AND...
A method for making a fiber reinforcement designed in particular to be incorporated in at least one matrix, characterized in that it includes performing the...
2012/0068373 IN AN INJECTION MOLDING MACHINE, A METHOD OF CONTROLLING AN UPSTREAM MELT PREPARATION DEVICE
A method (300, 400) of controlling a melt preparation device (102, 110) is provided. The melt preparation device (102, 110) is located upstream from a melt...
2012/0068372 NANOIMPRINT TEMPLATE AND PATTERN TRANSCRIPTION APPARATUS
According to one embodiment, a nanoimprint template using a pattern transcription to a substrate by a nanoimprint technique, the template includes a...
2012/0068371 PROCESSES FOR IMPROVED OPTICAL FILMS
A method of forming an optical film results in a film having a useful central 60% portion with a caliper variation of about 5% or less of an average thickness...
2012/0068370 Method for Producing Wafer Lens, and Method and Apparatus for Producing Wafer Lens Laminate
Disclosed is a method for producing a wafer lens, wherein misalignment between a glass substrate and a molding mold is suppressed from occurring. The method for...
2012/0068369 METHOD FOR PRODUCING A LIGHT SOURCE HAVING A DIODE LASER AND A PLURALITY OF OPTICAL FIBERS
A method is described for producing a light source, in particular a light source for optically exciting a laser device, for example a laser device of a laser...
2012/0068368 METHOD FOR MANUFACTURING OPTICAL DIFFRACTION ELEMENT
If an optical lens base having a diffraction grating on the surface is made of a resin, a corrosion reaction is produced between the optical lens base and a...
2012/0068367 VACUUM ACTIVATED POWER TOWER
The Present Invention is a modular tower structure comprising a common up-flow column topped with a covered header to which multiple independent down-flow and...
2012/0068366 SELECTIVE ETCH CHEMISTRIES FOR FORMING HIGH ASPECT RATIO FEATURES AND ASSOCIATED STRUCTURES
An interlevel dielectric layer, such as a silicon oxide layer, is selectively etched using a plasma etch chemistry including a silicon species and a halide...
2012/0068365 METAL CAN IMPEDANCE CONTROL STRUCTURE
A microelectronic assembly includes an interconnection element, element contacts, first and second metal layers, conductive elements, and first and second...
2012/0068364 Device and Method for Manufacturing a Device
A device includes a semiconductor material having a first surface. A first material is applied to the first surface and a fiber material is embedded in the...
2012/0068363 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIE PADDLES AND METHOD OF MANUFACTURE THEREOF
A method of manufacture of an integrated circuit packaging system includes: forming a package paddle group having a first package paddle electrically isolated...
2012/0068362 SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR MEMBER AND MOUNTING MEMBER
A semiconductor device including: a semiconductor member having thereon a plurality of interconnect pads: and a mounting member having a plurality of electrode...
2012/0068361 STACKED MULTI-DIE PACKAGES WITH IMPEDANCE CONTROL
A microelectronic assembly may include microelectronic devices arranged in a stack and having device contacts exposed at respective front surfaces. Signal...
2012/0068360 Stacked Semiconductor Device Assembly
The semiconductor device system includes multiple stacked substantially identical semiconductor devices each including a first side and an opposing second side....
2012/0068359 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device comprises: a core substrate; at least one insulating layer and at least one wiring layer which are disposed on each of a first surface of...
2012/0068358 SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
A semiconductor package includes: a semiconductor substrate; an inner insulator layer formed on the substrate; at least one internal wiring extending from a...
2012/0068357 SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR DEVICE
According to one embodiment, a semiconductor device includes a base, a semiconductor element, an electrode terminal, a connecting member and a joining material....
2012/0068356 Component having a VIA
A component having a via includes: (i) a first layer having a first via portion, a first trench structure, and a first surrounding layer portion, the first via...
2012/0068355 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device including two silicon wafers stacked and bonded together with bumps of one wafer electrically coupled with those of the other wafer, in...
2012/0068354 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
According to one embodiment, a semiconductor memory device includes a multilayer body, a second electrode film provided on the multilayer body, a second...
2012/0068353 Semiconductor Device and Method of Forming Dam Material With Openings Around Semiconductor Die for Mold...
A semiconductor wafer contains a plurality of semiconductor die separated by saw streets. A dam material is formed over the saw streets around each of the...
2012/0068352 STACKED CHIP ASSEMBLY HAVING VERTICAL VIAS
An assembly and method of making same are provided. The assembly can be formed by stacking a first semiconductor element atop a second semiconductor element and...
2012/0068351 CHIP ASSEMBLY HAVING VIA INTERCONNECTS JOINED BY PLATING
An assembly and method of making same are provided. The assembly can be formed by juxtaposing a first electrically conductive element overlying a major surface...
2012/0068350 SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS EMPLOYING THE SAME
A semiconductor package, an electronic device, and an electronic system employing the same are provided. The semiconductor package includes a printed circuit...
2012/0068349 TAPE PACKAGE
A tape package providing a plurality of input and output portions each having a minimum pitch. The tape package includes a tape wiring substrate including first...
2012/0068348 Interconnect Regions
Some embodiments include interconnect regions. The regions may contain, along a cross section, a closed-shape interior region having an electrically conductive...
2012/0068347 METHOD FOR PROCESSING SEMICONDUCTOR STRUCTURE AND DEVICE BASED ON THE SAME
Methods for fabricating a device and related device structures are provided herein. According to one embodiment, a method for fabricating a device includes the...
2012/0068346 STRUCTURE FOR NANO-SCALE METALLIZATION AND METHOD FOR FABRICATING SAME
A method for forming structure aligned with features underlying an opaque layer is provided for an interconnect structure, such as an integrated circuit. In one...
2012/0068345 LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
In various embodiments, a layer stack is provided. The layer stack may include a carrier; a first metal disposed over the carrier; a second metal disposed over...
2012/0068344 INTERCONNECT STRUCTURE WITH A PLANAR INTERFACE BETWEEN A SELECTIVE CONDUCTIVE CAP AND A DIELECTRIC CAP LAYER
A selective conductive cap is deposited on exposed metal surfaces of a metal line by electroless plating selective to exposed underlying dielectric surfaces of...
2012/0068343 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
According to one embodiment, a semiconductor device includes a semiconductor substrate, an interlayer dielectric film, a contact hole, a contact plug and a...
2012/0068342 ELECTRICALLY CONDUCTIVE ADHESIVE FOR TEMPORARY BONDING
The present disclosure relates to the field of fabricating microelectronic devices, wherein a conductive adhesive is used as a temporary microelectronic wafer...
2012/0068341 Method for Depackaging Prepackaged Integrated Circuit Die and a Product from the Method
A method for providing a known good integrated circuit die having enhanced planarity from a prepackaged integrated circuit die having a surface warpage such as...
2012/0068340 Ball grid array semiconductor package and method of manufacturing the same
Provided is a BGA semiconductor package including: a substrate on which a semiconductor device is mounted; an adhesive for adhering the semiconductor device and...
2012/0068339 VLSI Package for High Performance Integrated Circuit
A packaged integrated circuit is presented for placement on a printed circuit board (PCB) layer providing power lines and data access channels. The packaged...
2012/0068338 IMPEDANCE CONTROLLED PACKAGES WITH METAL SHEET OR 2-LAYER RDL
A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may...
2012/0068337 Semiconductor Device and Method of Forming Composite Bump-on-Lead Interconnection
A semiconductor device has a semiconductor die mounted to a substrate with a plurality of composite interconnects formed between interconnect sites on the...
2012/0068336 Method for Fabricating a Neo-Layer Using Stud Bumped Bare Die
A method for fabricating a stackable integrated circuit layer and a device made from the method are disclosed. A stud bump is defined on the contact pad of an...
2012/0068335 PRINTED CIRCUIT BOARD HAVING HEXAGONALLY ALIGNED BUMP PADS FOR SUBSTRATE OF SEMICONDUCTOR PACKAGE, AND...
Provided are a printed circuit board (PCB) having hexagonally aligned bump pads as a substrate of a semiconductor package, and a semiconductor package including...
2012/0068334 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Semiconductor devices of embodiments include a plurality of solder bumps electrically connected on a plurality of electrode pads disposed on a semiconductor...
2012/0068333 Wire Bond Through-Via Structure and Method
A stackable integrated circuit chip layer and module device that avoids the use of electrically conductive elements on the external surfaces of a layer...
2012/0068332 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POST AND METHOD OF MANUFACTURE THEREOF
A method of manufacture of an integrated circuit packaging system includes: providing a stack substrate with a component side; connecting an integrated circuit...
2012/0068331 Microsprings Partially Embedded In A Laminate Structure And Methods For Producing Same
At least one microspring has applied thereover a laminate structure to provide: mechanical protection during handling and wafer processing, a spring spacer...
2012/0068330 STAGED VIA FORMATION FROM BOTH SIDES OF CHIP
A method of fabricating a semiconductor assembly can include providing a semiconductor element having a front surface, a rear surface, and a plurality of...
2012/0068329 SEMICONDUCTOR DEVICE
The present invention provides a semiconductor device capable of selecting a desired circuit (step-down circuit (or step-up/step-down circuit) and step-up...
2012/0068328 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ACTIVE SURFACE HEAT REMOVAL AND METHOD OF MANUFACTURE THEREOF
A method of manufacture of an integrated circuit packaging system includes: providing an interconnect structure having a structure bottom side, a structure top...
2012/0068327 MULTI-FUNCTION AND SHIELDED 3D INTERCONNECTS
A microelectronic unit includes a semiconductor element consisting essentially of semiconductor material and having a front surface, a rear surface, a plurality...
2012/0068326 ANTI-TAMPER MICROCHIP PACKAGE BASED ON THERMAL NANOFLUIDS OR FLUIDS
A tamper-resistant microchip package contains fluid- or nanofluid-filled capsules, channels, or reservoirs, wherein the fluids, either alone or in combination,...
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