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Patent # Description
2012/0086117 PACKAGE WITH EMBEDDED CHIP AND METHOD OF FABRICATING THE SAME
A package embedded with a chip and a method of fabricating the package of embedded chip. The package of embedded chip includes a dielectric layer having a first...
2012/0086116 ELECTRONIC COMPONENT DEVICE, METHOD OF MANUFACTURING THE SAME AND WIRING SUBSTRATE
An electronic component device includes a substrate, an electrode post made of a metal material, provide to stand on the substrate, and an electronic component...
2012/0086115 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER INTERCONNECTIONS AND METHOD OF MANUFACTURE THEREOF
A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit; mounting a routing structure having a functional...
2012/0086114 MILLIMETER DEVICES ON AN INTEGRATED CIRCUIT
An integrated circuit (IC) device arrangement includes a substrate, an IC die coupled to the substrate, an antenna coupled to the IC die, and a first wirelessly...
2012/0086113 FLEXIBLE CIRCUITS AND METHODS FOR MAKING THE SAME
Embodiments of the invention relate to a method for creating a flexible circuit, including defining a cavity in a top surface of a substrate before disposing a...
2012/0086112 Multi-Component Electronic System Having Leadframe with Support-Free Cantilever Leads
A pallet (501) supporting a half-etched leadframe with cantilever-type leads (403) without metallic supports during the step of attaching components (510) to...
2012/0086111 SEMICONDUCTOR DEVICE
The present invention reduces the occurrence of fracture in external terminal connecting sections and improves the reliability of secondary packaging of a...
2012/0086110 IC PACKAGE
An IC package which can avoid electromagnetic waves leaked from a side surface of the IC package includes: an electric circuit board on which an IC chip is...
2012/0086109 Semiconductor Device Including Shielding Layer And Fabrication Method Thereof
Example embodiments relate to a semiconductor device. The semiconductor device may include a first semiconductor chip including a semiconductor substrate, a...
2012/0086108 CHIP LEVEL EMI SHIELDING STRUCTURE AND MANUFACTURE METHOD THEREOF
A chip level EMI shielding structure and manufacture method thereof are provided. The chip level EMI shielding structure includes a semiconductor substrate, at...
2012/0086107 SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE
A semiconductor device manufacturing method includes loading a substrate, on which a high-k film is formed, into a processing chamber, performing a reforming...
2012/0086106 METHOD FOR INCREASING THE AREA OF NON-POLAR AND SEMI-POLAR NITRIDE SUBSTRATES
A method for fabricating a high quality freestanding nonpolar and semipolar nitride substrate with increased surface area, comprising stacking multiple films by...
2012/0086105 SEMICONDUCTOR DEVICE HAVING CAPACITOR CAPABLE OF REDUCING ADDITIONAL PROCESSES AND ITS MANUFACTURE METHOD
A first capacitor recess and a wiring trench are formed through an interlayer insulating film. A lower electrode fills the first capacitor recess, and a first...
2012/0086104 ATOMIC LAYER DEPOSITION OF CRYSTALLINE PrCaMnO (PCMO) AND RELATED STRUCTURES AND METHODS
Methods of forming a PrCaMnO (PCMO) material by atomic layer deposition. The methods include separately exposing a surface of a substrate to a ...
2012/0086103 TECHNIQUE TO CREATE A BURIED PLATE IN EMBEDDED DYNAMIC RANDOM ACCESS MEMORY DEVICE
A method for forming a trench structure is provided for a semiconductor and/or memory device, such as an DRAM device. In one embodiment, the method for forming...
2012/0086102 Integrated Circuits with Magnetic Core Inductors and Methods of Fabrications Thereof
In one embodiment, a method of forming a semiconductor device includes forming a first inductor coil within and/or over a substrate. The first inductor coil is...
2012/0086101 INTEGRATED CIRCUIT AND INTERCONNECT, AND METHOD OF FABRICATING SAME
The disclosure relates generally to integrated circuits (IC), IC interconnects, and methods of fabricating the same, and more particularly, high performance...
2012/0086100 CMOS STRUCTURE AND METHOD OF MANUFACTURE
CMOS structures with a replacement substrate and methods of manufacture are disclosed herein. The method includes forming a device on a temporary substrate. The...
2012/0086099 SCHOTTKY DIODE
An integrated circuit device and method for fabricating the integrated circuit device is disclosed. The integrated circuit device includes a substrate, a...
2012/0086098 IONIC ISOLATION RING
There has been very little (if any) attention to address contamination diffusion within an integrated circuit (IC) because there are very few applications where...
2012/0086097 FRONT-SIDE ILLUMINATED, BACK-SIDE CONTACT DOUBLE-SIDED PN-JUNCTION PHOTODIODE ARRAYS
The present application is a photodiode detector array for use in computerized tomography (CT) and non-CT applications. Specifically, the present application is...
2012/0086096 CONDENSER LENS-COUPLED PHOTOCONDUCTIVE ANTENNA DEVICE FOR TERAHERTZ WAVE GENERATION AND DETECTION AND...
Provided are a condenser lens-coupled photoconductive antenna device for terahertz wave generation and detection and a fabricating method thereof. A condenser...
2012/0086095 Photoelectric Conversion Device and Image Pick-Up Device
A photoelectric conversion device includes a semiconductor substrate, an insulating layer provided on the semiconductor substrate, an electrode provided on the...
2012/0086094 SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD OF SOLID-STATE IMAGING DEVICE, AND ELECTRONIC EQUIPMENT
A solid-state imaging device includes: a substrate; a wiring layer formed on a front side of the substrate in which pixels are formed; a surface electrode pad...
2012/0086093 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS
A solid-state imaging device includes a plurality of pixels formed on a semiconductor substrate and include a photoelectric conversion unit; a color filter on...
2012/0086092 SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS
A solid-state imaging device includes a substrate in which a plurality of pixels including photoelectric converters are formed, a wiring layer that includes...
2012/0086091 BACKSIDE IMAGE SENSOR
A backside image sensor including an assembly of pixels, each pixel including, in a vertical stack, a photosensitive area and a filtering element topping the...
2012/0086090 METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTEGRATED CIRCUITS
Methods and apparatus provide a sensor including a component coupled to the leadframe such that the component is an integrated part of the IC package.
2012/0086089 MAGNETIC TUNNEL JUNCTION DEVICE AND FABRICATION
A magnetic tunnel junction (MTJ) device and fabrication method is disclosed. A particular embodiment includes a magnetic tunnel junction structure above a...
2012/0086088 ELECTRONIC COMPONENT
An electronic component includes: a first substrate having a through-hole; a second substrate opposite the first substrate; a sealing member surrounding a...
2012/0086087 SOI-BASED CMUT DEVICE WITH BURIED ELECTRODES
A muli-layer stacked micro-electro-mechanical (MEMS) device that acts as a capacitive micromachined ultrasonic transducer (CMUT) with a hermetically sealed...
2012/0086086 MEMS DEVICE AND COMPOSITE SUBSTRATE FOR AN MEMS DEVICE
An MEMS device and a composite substrate for an MEMS device are provided. The MEMS device comprises a first silicon structure layer and a second silicon...
2012/0086085 METHOD OF FABRICATING DUAL HIGH-K METAL GATE FOR MOS DEVICES
The present disclosure provides a method of fabricating a semiconductor device. The method includes providing a semiconductor substrate having a first region...
2012/0086084 SEMICONDUCTOR DEVICE
A semiconductor device comprise a memory cell region and a peripheral circuit region on a semiconductor substrate, and a metal laminating wiring extending over...
2012/0086083 DEVICES WITH GATE-TO-GATE ISOLATION STRUCTURES AND METHODS OF MANUFACTURE
Devices having gate-to-gate isolation structures and methods of manufacture are provided. The method includes forming a plurality of isolation structures in a...
2012/0086082 DUAL PORT STATIC RANDOM ACCESS MEMORY CELL LAYOUT
A dual port static random access memory cell has pull-down transistors, pull-up transistors, and pass transistors. A first active region has a first pull-down...
2012/0086081 SEMICONDUCTOR DEVICE
A semiconductor device includes a thin-film diode (1) and a protection circuit with a protection diode (20). The thin-film diode (1) includes: a semiconductor...
2012/0086080 LOW-VOLTAGE STRUCTURE FOR HIGH-VOLTAGE ELECTROSTATIC DISCHARGE PROTECTION
An electrostatic discharge (ESD) protected device may include a substrate, an N+ doped buried layer, an N-type well region and a P-type well region. The N+...
2012/0086079 SEMICONDUCTOR DEVICE
A semiconductor device includes: a first semiconductor layer of a first conductivity type; an insulation layer on the first semiconductor layer; a second...
2012/0086078 DEVICES WITH GATE-TO-GATE ISOLATION STRUCTURES AND METHODS OF MANUFACTURE
Devices having gate-to-gate isolation structures and methods of manufacture are provided. The method includes forming a plurality of isolation structures in pad...
2012/0086077 FET STRUCTURES WITH TRENCH IMPLANTATION TO IMPROVE BACK CHANNEL LEAKAGE AND BODY RESISTANCE
An FET structure on a semiconductor substrate which includes forming recesses for a source and a drain of the gate structure on a semiconductor substrate, halo...
2012/0086076 SUPER-JUNCTION SEMICONDUCTOR DEVICE
Provision of a super-junction semiconductor device capable of reducing rises in transient on-resistance at the time of repeated switching operation. A...
2012/0086075 DEVICE WITH ALUMINUM SURFACE PROTECTION
A semiconductor structure with a metal gate structure includes a first type field-effect transistor having a first gate including: a high k dielectric material...
2012/0086074 Semiconductor Devices And Methods of Forming The Same
Semiconductor devices and methods of forming the same may be provided. The semiconductor devices may include a trench in a substrate. The semiconductor devices...
2012/0086073 POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
A vertical power semiconductor device includes a first semiconductor layer of a first conductivity type formed in both a cell section and a termination section,...
2012/0086072 THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND RELATED METHOD OF MANUFACTURE
A method of manufacturing a three-dimensional semiconductor memory device comprises forming a thin layer structure by alternately stacking first and second...
2012/0086071 STRESS MEMORIZATION PROCESS IMPROVEMENT FOR IMPROVED TECHNOLOGY PERFORMANCE
Semiconductor substrate with a deformed gate region and a method for the fabrication thereof. The semiconductor substrate has improved device performance...
2012/0086070 FABRICATION METHOD AND STRUCTURE OF SEMICONDUCTOR NON-VOLATILE MEMORY DEVICE
A non-volatile semiconductor memory device with good write/erase characteristics is provided. A selection gate is formed on a p-type well of a semiconductor...
2012/0086069 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
In one embodiment, a nonvolatile semiconductor memory device includes a substrate; a tunnel insulating film on the substrate; a charge storage layer on the...
2012/0086068 METHOD FOR DEPOSITING A DIELECTRIC ONTO A FLOATING GATE FOR STRAINED SEMICONDUCTOR DEVICES
A method for forming a semiconductor device and a corresponding device are provided. The method includes forming a floating gate device in a process with dual...
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