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Patent # Description
2016/0104667 SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND PROCESS FOR MANUFACTURING
A semiconductor package substrate includes a core portion, an upper circuit layer and a plurality of pillars. The pillars are disposed on and project upward...
2016/0104666 POWER OVERLAY STRUCTURE HAVING WIREBONDS AND METHOD OF MANUFACTURING SAME
A power overlay (POL) structure includes a power device having at least one upper contact pad disposed on an upper surface of the power device, and a POL...
2016/0104665 Power Converter Package with Integrated Output Inductor
In one implementation, a semiconductor package includes a first patterned conductive carrier including partially etched segments. The semiconductor package...
2016/0104664 SEMICONDUCTOR DEVICE HAVING A PLURALITY OF CIRCUITS ARRANGED ON A SIDE OF A SEMICONDUCTOR CHIP
A semiconductor device includes a base member and a first semiconductor chip mounted over the base member. The first semiconductor chip including a first...
2016/0104663 PATTERNED LEAD FRAME
A lead frame having a plurality of concentric lead frame rings configured to receive and support a variety of integrated circuit die having a variety of sizes....
2016/0104662 METHOD AND SYSTEM FOR EXTENDING DIE SIZE AND PACKAGED SEMICONDUCTOR DEVICES INCORPORATING THE SAME
A packaged semiconductor device includes a die flag and a plurality of lead frame fingers each having a proximate end spaced apart from the die flag. A first...
2016/0104661 A SEMICONDUCTOR PACKAGE OF A FLIPPED MOSFET
The invention relates to a semiconductor package of a flip chip and a method for making the semiconductor package. The semiconductor chip comprises a...
2016/0104660 SEMICONDUCTOR STRUCTURE
A semiconductor structure and a method for fabricating the same are provided. The semiconductor structure includes a wafer substrate having a top surface and a...
2016/0104659 Stacked Semiconductor Package and Manufacturing Method Thereof
A stacked semiconductor package and a manufacturing method thereof. For example and without limitation, various aspects of this disclosure provide a...
2016/0104658 PEDESTAL SURFACE FOR MOSFET MODULE
An electronic package connectable to an electric machine includes a cooling tower having a metallic wall with a radially outer wall surface. The radially outer...
2016/0104657 Thermally Conductive Sheet, Method for Producing Same, and Semiconductor Device
A thermally conductive sheet, which contains: a binder; carbon fibers; and an inorganic filler, wherein the thermally conductive sheet is to be sandwiched...
2016/0104656 ELECTRONIC DEVICE WITH REDISTRIBUTION LAYER AND STIFFENERS AND RELATED METHODS
An electronic device may include an integrated circuit (IC), electrically conductive connectors coupled to the IC, and a heat sink layer adjacent the IC and...
2016/0104655 BONDING SHEET AND MANUFACTURING METHOD THEREOF, AND HEAT DISSIPATION MECHANISM AND MANUFACTURING METHOD THEREOF
A CNT-metal composite structure is formed by forming a plurality of CNTs which stand side by side from a base substance, forming a sheet-shaped support film...
2016/0104654 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
A semiconductor module having a plurality of cooling fins and a fixing cooling fin longer than the plurality of cooling fins, the fixing cooling fin having a...
2016/0104653 ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin,...
2016/0104652 PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
A method for fabricating a package structure is provided, which includes the steps of: forming a wiring layer on a carrier by electroplating; disposing at...
2016/0104651 POWER SEMICONDUCTOR DEVICE
A power semiconductor device includes an insulating substrate, a semiconductor element, a case, and a wiring member. The case forms a container body having a...
2016/0104650 ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC DEVICE
An electronic component housing package has an input/output member that is bonded to a hole part of a frame body via a brazing material. This input/output...
2016/0104649 SUBSTRATE STORAGE CONTAINER
A handling member includes: a substantially plate-like handling member main body that is arranged along a pair of the side walls, respectively; a circular...
2016/0104648 SYSTEMS AND METHODS FOR INTERNAL SURFACE CONDITIONING IN PLASMA PROCESSING EQUIPMENT
A method of conditioning internal surfaces of a plasma source includes flowing first source gases into a plasma generation cavity of the plasma source that is...
2016/0104647 MANUFACTURING METHOD OF A SEMICONDUCTOR STRUCTURE
A manufacturing method of a semiconductor structure is provided. The manufacturing method includes the following steps. A substrate is provided. A fin...
2016/0104646 METHOD FOR FORMING SEMICONDUCTOR DEVICE
A manufacturing method for forming a semiconductor device includes: first, a substrate is provided, a fin structure is formed on the substrate, and a plurality...
2016/0104645 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate; forming a plurality of gate structures on...
2016/0104644 PROCESS FOR INTEGRATED CIRCUIT FABRICATION INCLUDING A UNIFORM DEPTH TUNGSTEN RECESS TECHNIQUE
Dummy gates are removed from a pre-metal layer to produce a first opening (with a first length) and a second opening (with a second length longer than the...
2016/0104643 WAFER PROCESSING METHOD
A method of processing a wafer having a device area where a plurality of devices are formed and a peripheral marginal area surrounding the device area on the...
2016/0104642 SELF-ALIGNED VIA AND PLUG PATTERNING WITH PHOTOBUCKETS FOR BACK END OF LINE (BEOL) INTERCONNECTS
Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects is described. In an example, an interconnect structure for an...
2016/0104641 METHOD FOR FORMING CONTACT HOLES IN A SEMICONDUCTOR DEVICE
A method for forming a semiconductor device includes forming a device structure having a floating gate, control gate, sidewall spacers, and source and drain...
2016/0104640 METHOD FOR PROCESSING A CARRIER
According to various embodiments, a method for processing a carrier may include: co-depositing at least one metal from a first source and carbon from a second...
2016/0104639 SURFACE TREATMENT TO IMPROVE CCTBA BASED CVD CO NUCLEATION ON DIELECTRIC SUBSTRATE
Embodiments of the present invention generally relate to a method of forming a cobalt layer on a dielectric material without incubation delay. Prior to...
2016/0104638 SEMICONDUCTOR STRUCTURE INCLUDING A LAYER OF A FIRST METAL BETWEEN A DIFFUSION BARRIER LAYER AND A SECOND METAL...
A method includes providing a semiconductor structure including a recess. The recess includes at least one of a contact via and a trench. A layer of a first...
2016/0104637 METHOD FOR MANUFACTURING A CONTACT STRUCTURE USED TO ELECTRICALLY CONNECT A SEMICONDUCTOR DEVICE
A method for manufacturing contact structure includes the steps of: providing a substrate having the semiconductor device and an interlayer dielectric thereon,...
2016/0104636 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Manufacturing stability of a semiconductor device is improved. A method of manufacturing a semiconductor device includes the steps of: forming an etching...
2016/0104635 TEMPORARY BONDING LAMINATES FOR USED IN MANUFACTURE OF SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING...
Provided is temporary bonding laminates for used in a manufacture of semiconductor devices, by which a member to be processed can be temporarily supported...
2016/0104634 PLATEN ASSEMBLY
A platen assembly includes a base and a clamping layer fixed to the base. A portion of the base that faces the clamping layer and a portion of the clamping...
2016/0104633 CASSETTE FIXTURE FOR HOLDING FILM FRAMES WITH AFFIXED THIN SUBSTRATES DURING LIQUID CHEMICAL BATCH REMOVAL OF...
The invention describes the ability to conduct multiple carrier substrate removal practices simultaneously. The fixture design is slotted in a manner to hold...
2016/0104632 NON-UNIFORM SUBSTRATE STACKUP
Some embodiments described herein include apparatuses and methods of forming such apparatuses. One such embodiment may include a routing arrangement having...
2016/0104631 Electronic Module and Method for Producing an Electronic Module
One aspect of the invention relates to an electronic module comprising a module housing and an electrically conductive connection element. The connection...
2016/0104630 NOVEL METHOD TO ETCH COPPER BARRIER FILM
A method of opening a barrier film below copper structures in a stack is provided. A pulsed gas is provided into a plasma processing chamber, wherein the...
2016/0104629 APPARATUS AND A METHOD FOR TREATING A SUBSTRATE
A substrate treating method may include jetting a fluid containing an abrasive onto a substrate, and polishing the substrate using the jetted fluid.
2016/0104628 Self-Aligned Patterning using Directed Self-Assembly of Block Copolymers
Techniques herein provide methods for self-aligned etching that use existing features for patterning or registering a pattern, without damaging existing...
2016/0104627 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate; forming a fin-shaped structure on the...
2016/0104626 METHODS FOR SINGULATING SEMICONDUCTOR WAFER
Methods for dicing a wafer is presented. The method includes providing a wafer having first and second major surfaces. The wafer is prepared with a plurality...
2016/0104625 SYSTEMS AND METHODS FOR HORIZONTAL INTEGRATION OF ACCELERATION SENSOR STRUCTURES
Embodiments relate to integrated circuit sensors, and more particularly to sensors integrated in an integrated circuit structure and methods for producing the...
2016/0104624 Methods For Depositing Fluorine/Carbon-Free Conformal Tungsten
Provided are atomic layer deposition methods to deposit a tungsten film or tungsten-containing film using a tungsten-containing reactive gas comprising one or...
2016/0104623 METHODS FOR FORMING SEMICONDUCTOR DEVICE
A method for forming a semiconductor device includes forming first and second hard mask layers overlying a semiconductor substrate and forming trenches through...
2016/0104622 Method for Manufacturing a Semiconductor Wafer, and Semiconductor Device Having a Low Concentration of...
A method for manufacturing a substrate wafer 100 includes providing a device wafer (110) having a first side (111) and a second side (112); subjecting the...
2016/0104621 SEMICONDUCTOR DEVICE HAVING COMMON CONTACT AND GATE PROPERTIES
In one aspect there is set forth herein a semiconductor device wherein a contact conductive layer and a gate conductive layer include a common conductive...
2016/0104620 METHOD FOR MANUFACTURING SUBSTRATE
A method for manufacturing a substrate is provided. The method includes irradiating a single crystal substrate with a beam of laser or charged particles while...
2016/0104619 Self-aligned Double Patterning
A system and method for a semiconductor device are provided. An embodiment comprises a dielectric layer and masking layers over the dielectric layer. A thin...
2016/0104618 METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device is provided. The method includes forming a molding layer and a supporter layer on a semiconductor substrate,...
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