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Patent # Description
2016/0111635 DURABLE MINIATURE GAS COMPOSITION DETECTOR HAVING FAST RESPONSE TIME
A miniature oxygen sensor makes use of paramagnetic properties of oxygen gas to provide a fast response time, low power consumption, improved accuracy and...
2016/0111634 AMORPHOUS ALLOY SPACER FOR PERPENDICULAR MTJS
A perpendicular magnetic tunnel junction (MTJ) apparatus includes a tunnel magnetoresistance (TMR) enhancement buffer layer deposited between the tunnel...
2016/0111633 Method and Device for Huge Magnetoresistance in Graphene-Based Magnetic Tunnel Junctions with Segmented Potentials
A graphene-based magnetic tunnel junction is disclosed. The magnetic tunnel junction can enhance the tunnel magnetoresistance ratio and a device including the...
2016/0111632 MEMORY CELLS, SEMICONDUCTOR DEVICES, AND METHODS OF FABRICATION
A magnetic cell includes magnetic, secondary oxide, and getter seed regions. During formation, a diffusive species is transferred from a precursor magnetic...
2016/0111631 VERTICAL HALL SENSORS WITH REDUCED OFFSET ERROR
A semiconductor chip for measuring a magnetic field based on the Hall effect. The semiconductor chip comprises an electrically conductive well having a first...
2016/0111630 SEMICONDUCTOR DEVICE HAVING MAGNETIC SHIELD LAYER SURROUNDING MRAM CHIP
A semiconductor device includes a MRAM chip including a semiconductor substrate and a memory cell array area includes magnetoresistive elements which are...
2016/0111629 INTEGRATED CIRCUIT STRUCTURES WITH SPIN TORQUE TRANSFER MAGNETIC RANDOM ACCESS MEMORY AND METHODS FOR...
A method for fabricating an STT-MRAM integrated circuit includes forming a fixed layer over a bottom electrode layer, forming a silicon oxide layer a hardmask...
2016/0111628 PIEZOELECTRIC ELEMENT, METHOD FOR MANUFACTURING THE SAME, AND PIEZOELECTRIC ELEMENT-APPLIED DEVICE
A piezoelectric element has, from a substrate side, a first electrode, a piezoelectric layer containing a composite oxide of an ABO.sub.3 type perovskite...
2016/0111627 VIBRATION DEVICE
A vibration device that includes a vibration portion, a support portion connected to the vibration portion, a bending-vibrating portion connected to the...
2016/0111626 FLEXIBLE CONDUCTIVE MATERIAL AND TRANSDUCER
A flexible conductive material of the present invention is formed by dispersing a conductive agent containing carbon nanotubes in a matrix that contains a...
2016/0111625 Method of Fabricating Piezoelectric MEMS Devices
A single photo mask can be used to define the three critical layers for the piezoelectric MEMS device, specifically the top electrode layer, the piezoelectric...
2016/0111624 THERMOELECTRIC DEVICE TECHNOLOGY
A thermoelectric device for use with solar cells or other heat sources. A substrate has a manufactured surface with a plurality of highland features and...
2016/0111623 THERMOELECTRIC MODULE APPARATUS
Provided is a thermoelectric module apparatus including: a pipe-shaped housing having a hole that is longitudinally formed; a thermoelectric module coupled to...
2016/0111622 FLEXIBLE THERMOELECTRIC MODULE APPARATUS
The present invention relates to a flexible thermoelectric module apparatus, and more particularly, to a flexible thermoelectric module apparatus including a...
2016/0111621 Heat Conversion Device
Provided is a heat conversion device, including: a housing; a thermoelectric module received in the housing and including a thermoelectric semiconductor...
2016/0111620 METHODS AND DEVICES FOR CONTROLLING THERMAL CONDUCTIVITY AND THERMOELECTRIC POWER OF SEMICONDUCTOR NANOWIRES
Methods and devices for controlling thermal conductivity and thermoelectric power of semiconductor nanowires are described. The thermal conductivity and the...
2016/0111619 HIGH PERFORMANCE HIGH TEMPERATURE THERMOELECTRIC COMPOSITES WITH METALLIC INCLUSIONS
The present invention provides a composite thermoelectric material. The composite thermoelectric material can include a semiconductor material comprising a...
2016/0111618 OPTOELECTRONIC DEVICE INCLUDING IMPROVED THERMAL MANAGEMENT
A heterostructure for use in fabricating an optoelectronic device with improved thermal management is provided. The heterostructure can include a plurality of...
2016/0111617 LIGHT EMITTING DIODE PACKAGE
A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a...
2016/0111616 WAFER LEVEL PACKAGING OF ELECTRONIC DEVICE
Wafer level packaging of LED devices is accomplished using a bottom wafer that includes one or more vias. A passivation layer is placed over the top surface of...
2016/0111615 Method for Producing a Plurality of Optoelectronic Semiconductor Chips, and Optoelectronic Semiconductor Chip
An optoelectronic semiconductor chip includes a semiconductor body that has a semiconductor layer sequence and at least one opening that extends through a...
2016/0111614 LIGHT EMITTING DEVICE PACKAGE AND LIGHTING APPARATUS INCLUDING THE PACKAGE
Embodiments provide a light emitting device package including a substrate, a light emitting structure disposed under the substrate and including a first...
2016/0111613 LIGHT-EMITTING DIODE AND METHOD FOR MANUFACTURING SAME
A light-emitting diode includes a support substrate, a semiconductor stack disposed on the support substrate, the semiconductor stack including a p-type...
2016/0111612 LIGHT EMITTING DIODE HAVING MIRROR PROTECTION LAYER AND METHOD FOR MANUFACTURING MIRROR PROTECTION LAYER
The present invention includes an N-type semiconductor layer, an active layer, a P-type semiconductor layer, a metal mirror layer, a protection adhesive layer...
2016/0111611 EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, AND LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE,...
An optical semiconductor device includes a metal lead frame including first and second plate portions, an optical semiconductor element mounted on the metal...
2016/0111610 LIGHT EMITTING DEVICE AND RESIN COMPOSITION
Provided a light emitting device comprising: a package; a light emitting element disposed in the package; an encapsulation member that covers the light...
2016/0111609 Conversion LED with High Color Rendition Index
Conversion LED emits primary radiation (peak wavelength 435 nm to 455 nm) and has a luminescent substance-containing layer positioned to intercept the primary...
2016/0111608 THIN FILM WAVELENGTH CONVERTERS AND METHODS FOR MAKING THE SAME
Thin film wavelength converters and methods for making the same are disclosed. In some embodiments, the thin film converters include a first thin film layer of...
2016/0111607 PHOSPHOR SHEET, LIGHT-EMITTING DEVICE HAVING THE PHOSPHOR SHEET AND METHOD OF MANUFACTURING THE SAME
A light-emitting device includes a substrate including a first electrode and a second electrode, a light-emitting diode (LED) chip electrically connected to...
2016/0111606 LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
Disclosed are a light-emitting device and a manufacturing method thereof. A light-emitting device according to a preferred embodiment of the disclosure...
2016/0111605 METHOD FOR TRANSFERRING LIGHT-EMITTING ELEMENTS ONTO A PACKAGE SUBSTRATE
A method for transferring light-emitting elements onto a package substrate includes: providing a light-emitting unit including a supporting substrate and a...
2016/0111604 METHOD FOR EXPANDING SPACINGS IN LIGHT-EMITTING ELEMENT ARRAY AND LIGHT-EMITTING ELEMENT ARRAY UNIT
A method for expanding spacings in a light-emitting element array includes the following steps of: providing a light-emitting element array unit including a...
2016/0111603 Indium Zinc Oxide for Transparent Conductive Oxide Layer and Methods of Forming Thereof
Provided are light emitting diodes (LEDs) and methods of fabricating such LEDs. Specifically, an LED has an epitaxial stack and current distribution layer...
2016/0111602 LIGHT-EMITTING DIODE CHIP
A light-emitting diode (LED) chip is disclosed. The chip includes a light-emitting diode and an electrode layer on the light-emitting diode. The electrode...
2016/0111601 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING APPARATUS INCLUDING THE PACKAGE
Embodiments provide a light emitting device including a substrate, a light emitting structure including a first conductive semiconductor layer, an active...
2016/0111600 LIGHT EMITTING DIODE, METHOD OF FABRICATING THE SAME AND LED MODULE HAVING THE SAME
A light emitting diode is provided to include a first conductive-type semiconductor layer; a mesa including a second conductive-type semiconductor layer...
2016/0111599 LED ELEMENT
In order to achieve appropriate light distribution using light distribution characteristics resulting from diffraction while improving light extraction...
2016/0111598 LIGHT EMITTING DEVICE HAVING LIGHT EXTRACTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
A light emitting device including a support layer; a reflective electrode disposed on the support layer; an ohmic electrode disposed on the reflective...
2016/0111597 GRAPHICAL MICROSTRUCTURE OF LIGHT EMITTING DIODE SUBSTRATE
The invention relates to a patterned microstructure of a light emitting diode (LED) substrate. The substrate is provided with patterned microstructures...
2016/0111596 LIGHTING SYSTEM
A lighting system includes a lighting unit comprising at least one lighting device, a sensing unit configured to measure at least one of atmospheric...
2016/0111595 SEMICONDUCTOR LIGHT EMITTING DEVICE
A semiconductor light emitting device may include: a first conductivity-type semiconductor layer; an active layer disposed on the first conductivity-type...
2016/0111594 Optoelectronic Component And Method For The Production Thereof
An optoelectronic device (10, 1010) having a semiconductor layer structure (100, 1100) comprising a first light-active layer (140) and a second light-active...
2016/0111593 OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
An optoelectronic device comprises a substrate; pads on a surface of the substrate; semiconductor elements, each element resting on a pad; a portion covering...
2016/0111592 LIGHT EMITTING DEVICES AND METHODS OF MANUFACTURING THE SAME
Light emitting devices and methods of manufacturing the light emitting devices. The light emitting devices include a silicon substrate; a metal buffer layer on...
2016/0111591 LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
A method of fabricating a light-emitting device, the method including forming a first resin comprising a phosphor inside a cavity of a package body on which a...
2016/0111590 Manufacturing Method of Semiconductor Film, Manufacturing Method of Semiconductor Device, and Manufacturing...
A method for forming an amorphous semiconductor which contains an impurity element and has low resistivity and a method for manufacturing a semiconductor...
2016/0111589 LOW-COST SOLAR CELL METALLIZATION OVER TCO AND METHODS OF THEIR FABRICATION
Methods for fabricating busbar and finger metallization over TCO are disclosed. Rather than using expensive and relatively resistive silver paste, a high...
2016/0111588 ENCAPSULATED FLEXIBLE ELECTRONIC DEVICE, AND CORRESPONDING MANUFACTURING METHOD
The disclosure relates to an encapsulated flexible electronic device comprising a flexible electronic device, wherein the flexible electronic device is...
2016/0111587 INFRA RED DETECTORS AND METHODS OF MANUFACTURE
A method of forming infra red detector arrays is described, starting with the manufacture of a wafer. The wafer is formed from a GaAs or GaAs/Si substrate...
2016/0111586 Method and Apparatus For Reduction of Solar Cell LID
Reduction of solar wafer LID by exposure to continuous or intermittent High-Intensity full-spectrum Light Radiation, HILR, by an Enhanced Light Source, ELS,...
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