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SEMICONDUCTOR STRUCTURE WITH SELF-ALIGNED WELLS AND MULTIPLE CHANNEL
Embodiments of the present invention provide a semiconductor structure having a strain relaxed buffer, and method of fabrication. A strain relaxed buffer is...
FINFET FORMATION PROCESS AND STRUCTURE
A FinFET and methods for forming a FinFET are disclosed. In a method, first trenches are formed in a substrate. First isolation regions are then formed in the...
SUBSTRATE DIVIDING METHOD
A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method...
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma...
WAFER PROCESSING METHOD
A wafer is divided into individual devices along division lines formed on the front side of the wafer. A protective tape having an adhesive layer is attached...
METHOD FOR PRODUCING INTERCONNECTIONS FOR 3D INTEGRATED CIRCUIT
Method for producing one or more connection elements for integrated circuit including the formation of sacrificial elements passing through a porous layer...
INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF
A method for forming an interconnect structure is provided. The method includes providing a substrate with a surface; and forming a metal layer covering the...
MULTILEVEL MASK CIRCUIT FABRICATION AND MULTILAYER CIRCUIT
Circuit fabrication uses a multilevel mask to pattern a first conductor layer of a multilayer circuit. The first conductor patterning is to provide electrical...
Device and Method for Reducing Contact Resistance of a Metal
A method of fabricating an integrated circuit includes depositing a cap layer on a substrate; depositing a dielectric layer on the cap layer; and forming a...
Early Bit Line Air Gap Formation
Dummy bit lines of are formed in a sacrificial layer at locations where bit lines are to be formed, with bit lines separated by trenches that extend through...
ETCH STOP LAYER IN INTEGRATED CIRCUITS
An integrated circuit structure includes a dielectric layer and an etch stop layer. The etch stop layer includes a first sub layer including a metal nitride...
Semiconductor Device and Method of Forming Same
Semiconductor devices and methods of forming the same are disclosed. A dielectric layer is formed over an underlying layer. A first mask layer and a second...
MOSFETs with Channels on Nothing and Methods for Forming the Same
A method includes performing an epitaxy to grow a semiconductor layer, which includes a top portion over a semiconductor region. The semiconductor region is...
FINFET SEMICONDUCTOR DEVICE HAVING LOCAL BURIED OXIDE
There is set forth herein in one embodiment a FinFET semiconductor device having a fin extending from a bulk silicon substrate, wherein there is formed wrapped...
DEVICE ISOLATION STRUCTURE AND MANUFACTURE METHOD
A method for forming a semiconductor device includes forming a buried doped layer in a semiconductor substrate and forming a plurality of first trenches that...
T-SHAPED FIN ISOLATION REGION AND METHODS OF FABRICATION
Semiconductor devices and fabrication methods are provided having an isolation feature within a fin structure which, for instance, facilitates isolating...
Retainer, Method For Producing Same And Use Thereof
A retainer has a coating composed of silicon carbide, glassy carbon or pyrolytic carbon on its surface. A method for producing the retainer and the use of the...
SUBSTRATE HOLDING METHOD, SUBSTRATE HOLDING APPARATUS, EXPOSURE APPARATUS
AND EXPOSURE METHOD
A wafer holding apparatus for holding a wafer including a wafer holder on which the wafer is placed; and a lift pin that is configured to be lifted up and down...
SEMICONDUCTOR MANUFACTURING APPARATUS
A semiconductor manufacturing apparatus includes: a collet which sucks a semiconductor chip having a main surface on which a bump is formed, and an actuator...
A method includes receiving a wafer stack having at least two wafers bonded together. At least one blade is inserted between a first wafer of the at least two...
ELECTROSTATIC CHUCK ASSEMBLY FOR HIGH TEMPERATURE PROCESSES
An electrostatic chuck assembly includes a puck and a cooling plate. The puck includes an electrically insulative upper puck plate comprising one or more...
ESC ASSEMBLY INCLUDING AN ELECTRICALLY CONDUCTIVE GASKET FOR UNIFORM RF
POWER DELIVERY THERETHROUGH
A substrate processing apparatus for processing substrates comprises a processing chamber in which a substrate is processed. A process gas source is adapted to...
APPARATUS FOR THE VACUUM TREATMENT OF SUBSTRATES
The invention relates to an apparatus for the vacuum treatment of substrates (130), comprising a vacuum chamber (1) having a plasma device (160) of a process...
An end effector according to the present invention includes: a hand; a substrate holder provided on the hand; a mapping detector provided at distal end...
WAFER TRANSFER METHOD AND SYSTEM
A wafer transfer method includes the following steps. An initial position of a first wafer in a wafer cassette is detected. A picking entry position in the...
Wafer Transfer System
A wafer transport system includes a pod that contains one or more wafers in an enclosed environment, a substrate transport surface that extends substantially...
EQUIPMENT FRONT END MODULE FOR TRANSFERRING WAFERS AND METHOD OF
An EFEM useful for transferring wafers to and from wafer processing modules comprises an enclosure having a controlled environment therein bounded by a front...
REDUCED CAPACITY CARRIER, TRANSPORT, LOAD PORT, BUFFER SYSTEM
In accordance with an exemplary embodiment a semiconductor workpiece processing system having at least one processing tool for processing semiconductor...
INTEGRATED SUBSTRATE DEFECT DETECTION USING PRECISION COATING
Apparatuses and methods for improved substrate defect detection is provided. Substrate defects may be detected, possibly with defect detection equipment such...
Implementations of the present disclosure generally relate to an improved lamphead assembly for use in a thermal processing chamber. In one implementation, a...
APPARATUS FOR ADJUSTABLE LIGHT SOURCE
Apparatus for adjusting the position of lamp modules of a processing chamber are disclosed herein. Implementations generally include a process chamber...
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND STORAGE
There is provided a substrate processing apparatus of performing a predetermined substrate process on a plurality of target substrates under a vacuum...
SUBSTRATE LIQUID PROCESSING APPARATUS, SUBSTRATE LIQUID PROCESSING METHOD,
AND COMPUTER-READABLE STORAGE MEDIUM...
Disclosed is a substrate liquid processing apparatus. The apparatus includes: a pure water supply unit (a rinse liquid supply unit) configured to supply pure...
Systems and Methods for Wet Processing Substrates with Rotating Splash
Embodiments provided herein provide systems and methods for wet processing substrates with a rotating splash shield. The systems include a fluid dispenser...
CORELESS PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
A coreless packaging substrate includes: a circuit buildup structure having at least a dielectric layer, a wiring layer and a plurality of conductive elements,...
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes the steps of placing, on a heat sink made of a metal, a semiconductor element and a frame surrounding...
Methods of Fabricating Tape Film Packages
A tape film package is provided including an insulating pattern; a via contact in a via hole in the insulating pattern; first interconnection patterns...
ETCHING METHOD USING PLASMA, AND METHOD OF FABRICATING SEMICONDUCTOR
DEVICE INCLUDING THE ETCHING METHOD
An etching method using plasma includes generating plasma by supplying process gases to at least one remote plasma source (RPS) and applying power to the at...
ITERATIVE SELF-ALIGNED PATTERNING
A method for self-aligned patterning includes providing a substrate, forming a patterned mandrel layer that includes a plurality of mandrel features, the...
SUBSTRATE PROCESSING APPARATUS, LINKED PROCESSING SYSTEM, AND SUBSTRATE
A substrate processing apparatus comprises: a substrate holding unit configured to hold and rotate a substrate; an etching unit configured to etch a surface of...
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
A method for fabricating a semiconductor device is provided. The method includes the following steps. A substrate including a memory cell region and a...
USE OF ION BEAM ETCHING TO GENERATE GATE-ALL-AROUND STRUCTURE
Various embodiments herein relate to methods and apparatus for performing anisotropic ion beam etching to form arrays of channels. The channels may be formed...
MANUFACTURING METHOD OF WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE
A manufacturing method of wafer level chip scale package structure is provided. Firstly, a wafer including a plurality of semiconductor devices is provided. An...
CHARGE TRAPPING SPLIT GATE EMBEDDED FLASH MEMORY AND ASSOCIATED METHODS
Semiconductor devices and methods of manufacturing such devices are described herein. According to embodiments, the semiconductor device can be made by forming...
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
The present disclosure relates to a semiconductor memory, device and a method of forming a semiconductor memory device. The method of manufacturing a...
CMOS Vt CONTROL INTEGRATION BY MODIFICATION OF METAL-CONTAINING GATE
A method of forming a semiconductor device is disclosed in various embodiments. The method includes providing a substrate containing first and second device...
Semiconductor Device and Method for Forming a Semiconductor Device
A method includes forming an emitter at the first side of a semiconductor substrate by doping, wherein the dopant concentration is higher in the emitter than...
LOW-K DAMAGE REPAIR AND PORE SEALING AGENTS WITH PHOTOSENSITIVE END GROUPS
Methods of repairing damaged low-k dielectric films using UV-activated photosensitive organic compounds are described herein. Methods of sealing pores by...
METHOD FOR FORMING MULTI-LAYER FILM AND PATTERNING PROCESS
A method for forming multi-layer film on substrate, which includes steps (1) forming under layer film on substrate by applying under layer film material...
Method of Semiconductor Device Fabrication
A method of fabricating a semiconductor device is disclosed. The method includes forming a dielectric layer over a substrate, forming a hard mask (HM) layer...