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Patent # Description
2016/0126459 ORGANIC FILM TRANSISTOR, ORGANIC SEMICONDUCTOR FILM, ORGANIC SEMICONDUCTOR MATERIAL AND APPLICATION OF THESE
An organic film transistor containing a compound, which is composed of n repeating units represented by Formula (1-1), (1-2), or (101), in a semiconductor...
2016/0126458 METHOD OF MANUFACTURING ORGANIC ELECTROLUMINESCENCE DISPLAY APPARATUS AND ORGANIC ELECTROLUMINESCENCE DISPLAY...
A method includes: (a) preparing the organic electroluminescence display apparatus including: plural elements in which a reflective anode, an organic layer...
2016/0126457 LASER CRYSTALLIZATION SYSTEM, LASER CRYSTALLIZATION METHOD, AND METHOD OF FABRICATING DISPLAY DEVICE
A laser crystallization system, including an output unit configured to generate output laser light, an optical unit configured to split the output laser light...
2016/0126456 DONOR SUBSTRATE
A donor substrate including: a light-transmitting base substrate; an insulation layer disposed on an upper surface of the light-transmitting base substrate,...
2016/0126455 CONCAVE WORD LINE AND CONVEX INTERLAYER DIELECTRIC FOR PROTECTING A READ/WRITE LAYER
An alternating stack of electrically conductive layers and electrically insulating layers is formed over global bit lines formed on a substrate. The...
2016/0126454 ISOLATION OF MAGNETIC LAYERS DURING ETCH IN A MAGNETORESISTIVE DEVICE
Methods for manufacturing magnetoresistive devices are presented in which isolation of magnetic layers in the magnetoresistive stack is achieved by oxidizing...
2016/0126453 THERMALLY TOLERANT PERPENDICULAR MAGNETIC ANISOTROPY COUPLED ELEMENTS FOR SPIN-TRANSFER TORQUE SWITCHING DEVICE
Perpendicular magnetic anisotropy (PMA) type magnetic random access memory cells are constructed with a composite PMA layer to provide a magnetic tunnel...
2016/0126452 BALANCING ENERGY BARRIER BETWEEN STATES IN PERPENDICULAR MAGNETIC TUNNEL JUNCTIONS
Techniques are disclosed for enhancing performance of a perpendicular magnetic tunnel junction (MTJ) by implementing an additional ferromagnetic layer therein....
2016/0126451 Method of Making Thick Film Transducer Arrays
Various embodiments provide processes of fabrication to form acoustically and electrically isolated elements of a transducer array. For example, a cutting...
2016/0126450 DIAPHRAGM ACTUATOR AND METHOD FOR PRODUCING A DIAPHRAGM ACTUATOR
A diaphragm actuator has a first frame part and a second frame part, between which at least two diaphragm layers are disposed in a stacked manner and formed as...
2016/0126449 VIBRATOR AND ULTRASONIC MOTOR
This invention prevents an adhesive portion between a piezoelectric element and a conducting member of a small vibrator from peeling off. In a vibrator, a...
2016/0126448 INTEGRATING A PIEZORESISTIVE ELEMENT IN A PIEZOELECTRONIC TRANSISTOR
A semiconductor device, a piezoelectronic transistor (PET) device, and a method of fabricating the PET device are described. The method includes forming a...
2016/0126447 PIEZOELECTRONIC TRANSISTOR WITH CO-PLANAR COMMON AND GATE ELECTRODES
A method of forming a piezoelectronic transistor (PET), the PET, and a semiconductor device including the PET are described. The method includes forming a...
2016/0126446 PASSIVATION AND ALIGNMENT OF PIEZOELECTRONIC TRANSISTOR PIEZORESISTOR
A method of forming a piezoelectronic transistor (PET) device, the PET device, and a semiconductor including the PET device are described. The method includes...
2016/0126445 ULTRASONIC PROBE AS WELL AS ELECTRONIC APPARATUS AND ULTRASONIC IMAGING APPARATUS
An ultrasonic probe is provided that makes it possible to increase the shock resistance of a board of an ultrasonic device unit. An ultrasonic probe includes a...
2016/0126444 PIEZOELECTRIC ACTUATOR
The invention relates to a piezoelectric actuator (1) which acts as micromechanical actuating element. Thus, the piezoelectric actuator (1) has a piezoelectric...
2016/0126443 PACKAGED DEVICE INCLUDING CAVITY PACKAGE WITH ELASTIC LAYER WITHIN MOLDING COMPOUND
A device includes a substrate; a cavity package having a first surface attached to the substrate, the cavity package enclosing an electronic circuit; an...
2016/0126442 THERMOELECTRIC POWER GENERATOR
Disclosure is related to a thermoelectric power generator. The generator essentially includes a thermoelectric thin-film element which is such as a thin film...
2016/0126441 Structures, System and Method for Converting Electromagnetic Radiation to Electrical Energy
A substrate, resonant structures, a ground plane, a thermal optimization layer and energy transfer structures are combined to receive and convert incoming...
2016/0126440 METHOD OF PRODUCING NANOPARTICLES, METHOD OF PRODUCING THERMOELECTRIC MATERIAL, AND THERMOELECTRIC MATERIAL
A method of producing nanoparticles in a base material made of a semiconductor material including a base material element, each nanoparticle including the base...
2016/0126439 P-TYPE HIGH-PERFORMANCE THERMOELECTRIC MATERIAL WITH REVERSIBLE PHASE CHANGE AND PREPARATION METHOD THEREFOR
The present invention relates to a P-type high-performance thermoelectric material featuring reversible phase change, and a preparation method therefor. The...
2016/0126438 THERMOELECTRIC DEVICE
The present invention is directed to a thermoelectric device that includes a plurality of thermoelectric couples positioned between a top plate and a bottom...
2016/0126437 LIGHT-EMITTING DEVICE
The present invention discloses a light-emitting device which maximizes the optical efficiency and heat-radiation as well as facilitates thin film-type...
2016/0126436 P-N SEPARATION METAL FILL FOR FLIP CHIP LEDS
A light emitting diode (LED) structure has semiconductor layers, including a p-type layer, an active layer, and an n-type layer. The p-type layer has a bottom...
2016/0126435 LIGHT EMITTING DEVICE
A light emitting device includes an electrically conductive member, a light emitting element, a wire, and a sealing member. The wire contains gold and silver...
2016/0126434 LIGHT EMITTING DEVICE AND ADAPTIVE DRIVING BEAM HEADLAMP SYSTEM
A light emitting device includes a substrate, a plurality of first wiring members, a plurality of second wiring members and a plurality of light emitting...
2016/0126433 LIGHT-EMITTING DEVICE
This disclosure discloses a method for making a light-emitting device, comprising steps of: providing a substrate; forming a light-emitting stack on the...
2016/0126432 METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE
A method of manufacturing a semiconductor light emitting device package includes providing a wafer and forming, on the wafer, a semiconductor laminate...
2016/0126431 CURABLE COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR
A curable composition according to the present invention for sealing optical semiconductor includes components (A), (B), and (C). Another curable composition...
2016/0126430 LIGHT-EMITTING DEVICE WITH HARDENED ENCAPSULANT ISLANDS
In one embodiment, a light-emitting device having a light source die, a substantially transparent encapsulant surrounding the light source die, and a second...
2016/0126429 Light emitting diode laminated with a phosphor sheet and manufacturing method thereof
A method for laminating a film over a light emitting diode (LED), where the thickness of a portion of the film disposed over the top surface of the LED is...
2016/0126428 LIGHT EMITTING DEVICE
A light emitting device is provided which includes a light emitting element, a phosphor, and a sealing member. The light emitting element has a light emission...
2016/0126427 An LED Module and its Manufacturing Process
The present invention relates to the technical field of illuminating lamp, especially to an LED module and its manufacturing process. The LED module of the...
2016/0126426 LIGHT EMITTING MODULE
An embodiment relates to a light emitting module. A light emitting module according to an embodiment comprises: a light source unit comprising a light emitting...
2016/0126425 LED AND LED PACKAGING METHOD THEREOF
An LED is provided, the LED comprising a lighting assembly and a light bead. The light bead encases the lighting assembly. A cross-section of an upper portion...
2016/0126424 LIGHT-EMITTING DIODE LIGHTING DEVICE
A light-emitting diode (LED) lighting device includes a substrate, a first bottom electrode, a second bottom electrode, a first bottom transparent isolation...
2016/0126423 LIGHT EMITTING DEVICE
Disclosed is a light emitting device which includes a light emitting structure including a first conductive semiconductor layer, an active layer, and a second...
2016/0126422 SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor light-emitting device of the present disclosure includes a plurality of semiconductor layers; a first inclined face having a first slope inside...
2016/0126421 COMPOSITE ELECTRODE, ARRAY SUBSTRATE AND DISPLAY DEVICE
A composite electrode comprises at least one graphene layer and at least one doping layer, and two adjacent layers are not both the doping layer; wherein the...
2016/0126420 WHITE LIGHT-EMITTING ELEMENT
A white light-emitting device of the present invention includes a substrate (101); a diamond semiconductor layer (105) provided on the substrate (101), in...
2016/0126419 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
There is provided a semiconductor light-emitting device including a base layer formed of a first conductivity-type semiconductor material, and a plurality of...
2016/0126418 SEMICONDUCTOR LIGHT-EMITTING DEVICE HAVING A PHOTONIC CRYSTAL PATTERN FORMED THEREON, AND METHOD FOR...
The present invention relates to a semiconductor light-emitting device having a two-stage photonic crystal pattern formed thereon, and to a method for...
2016/0126417 Light Emitting, Photovoltaic Or Other Electronic Apparatus and System
The present invention provides an electronic apparatus, such as a lighting device comprised of light emitting diodes (LEDs) or a power generating apparatus...
2016/0126416 OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
The invention relates to an optoelectronic device and to the method for manufacturing same. The optoelectronic device (45), according to the invention...
2016/0126415 METHOD FOR PRODUCING LIGHT-EMITTING DEVICE AND METHOD FOR PRODUCING GROUP III NITRIDE SEMICONDUCTOR
On the well layer, a first InGaN protective layer is formed at the same temperature employed for the well layer through MOCVD. TMI is pulse supplied. A TMI...
2016/0126414 Chip Substrate and Chip Package Module
A chip substrate includes conductive portions, insulation portions, cavities and a heat dissipating portion. The insulation portions are alternately bonded to...
2016/0126413 LIGHT EMITTING DEVICE AND LIGHTING SYSTEM
Disclosed are a light emitting device, a method of manufacturing a light emitting device, a light emitting device package and a lighting system. The light...
2016/0126412 NANOSTRUCTURE SEMICONDUCTOR LIGHT EMITTING DEVICE
There is provided a nanostructure semiconductor light emitting device may including: a base layer formed of a first conductivity-type semiconductor, an...
2016/0126411 SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING THE SAME
According to one embodiment, a light emitting element includes n-type and p-type semiconductor layers and a light emitting unit. The light emitting unit is...
2016/0126410 SEMICONDUCTOR STRUCTURES HAVING ACTIVE REGIONS INCLUDING INDIUM GALLIUM NITRIDE, METHODS OF FORMING SUCH...
Semiconductor structures include an active region between a plurality of layers of InGaN. The active region may be at least substantially comprised by InGaN....
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