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Patent # Description
2016/0133801 LED MIXING CHAMBER WITH REFLECTIVE WALLS FORMED IN SLOTS
A relatively large substrate has a reflective surface, such as a diffusive white surface. LED dies, either as bare LED dies or packaged LED dies, are mounted...
2016/0133800 LIGHT EMITTING APPARATUS AND PRODUCTION METHOD THEREOF
A light emitting apparatus includes an electrically insulating base member; a first electrically conductive pattern portion and a second electrically...
2016/0133799 FLUORIDE PHOSPHOR AND LIGHT EMITTING DEVICE, AND METHODS OF MANUFACTURING THE SAME
A fluoride phosphor may include: a fluoride represented by a composition formula: A.sub.xMF.sub.y:Mn.sub.z.sup.4+, where A is at least one selected from among...
2016/0133798 OPTOELECTRONIC COMPONENT INCLUDING A CONVERSION ELEMENT AND METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT...
An optoelectronic component includes a layer sequence having an active layer that emits electromagnetic primary radiation during operation, at least one...
2016/0133797 SMD Type LED Package Device, Method for Manufacturing the Same, and Light-Emitting Apparatus
Disclosed is a SMD type LED package device, a method for manufacturing the same, and a light-emitting apparatus, wherein the surface-mount-device (SMD) type...
2016/0133796 LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
A light-emitting device comprises a light-emitting structure capable of emitting a light; an electrode formed on a side of the light-emitting structure; a...
2016/0133795 METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE
Provided is a method of manufacturing a light-emitting device, the method including: a step of providing a conductive material on both surfaces of a base...
2016/0133794 OPTOELECTRONIC SEMICONDUCTOR CHIP
An optoelectronic semiconductor chip includes a multiplicity of active regions arranged at a distance from one another, and a continuous current spreading...
2016/0133793 SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING SAME
According to one embodiment, a semiconductor light emitting element includes a conductive substrate, a bonding portion, an intermediate metal film, a first...
2016/0133792 SEMICONDUCTOR SUBSTRATE AND METHOD OF FABRICATING THE SAME
A semiconductor substrate includes a substrate including a plurality of semispherical protrusions disposed at an interval on a first plane of the substrate,...
2016/0133791 LIGHT EMITTING DIODE WITH NANOSTRUCTURED LAYER AND METHODS OF MAKING AND USING
A light emitting diode has a plurality of layers including at least two semiconductor layers. A first layer of the plurality of layers has a nanostructured...
2016/0133790 Textured phosphor conversion layer light emitting diode
This invention is related to LED Light Extraction for optoelectronic applications. More particularly the invention relates to (Al, Ga, In)N combined with...
2016/0133789 LIGHT-EMITTING DEVICE HAVING A PATTERNED SURFACE
A light-emitting device comprises a substrate having a top surface and a plurality of patterned units protruding from the top surface; and a light-emitting...
2016/0133788 SEMICONDUCTOR LIGHT-EMITTING DEVICES AND SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGES
Semiconductor light-emitting devices, and semiconductor light-emitting packages, include at least one light-emitting structure including a first ...
2016/0133787 Diode-Based Devices and Methods for Making the Same
In accordance with an embodiment, a diode comprises a substrate, a dielectric material including an opening that exposes a portion of the substrate, the...
2016/0133786 Non-Crystalline Materials Having Complete Photonic, Electronic or Phononic Bandgaps
The invention provides an article of manufacture, and methods of designing and making the article. The article permits or prohibits waves of energy, especially...
2016/0133785 DEEP ULTRAVIOLET LED AND METHOD FOR MANUFACTURING THE SAME
A deep ultraviolet LED with a design wavelength of .lamda. is provided that includes a reflecting electrode layer, a metal layer, a p-type GaN contact layer,...
2016/0133784 METHOD OF MANUFACTURING SEMICONDUCTOR CHIPS
A method of manufacturing semiconductor chips includes: forming grooves on a front face side of a substrate; and forming grooves on a back face side of the...
2016/0133783 GROUP III NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE AND PRODUCTION METHOD THEREFOR
To provide a Group III nitride semiconductor light-emitting device production method, which is intended to grow a flat light-emitting layer without reducing...
2016/0133782 SUBSTRATE CARRIER SYSTEM UTILIZING ELECTROSTATIC CHUCKING TO ACCOMMODATE SUBSTRATE SIZE HETEROGENEITY
Embodiments of improved substrate carriers are provided herein. In some embodiments, a substrate carrier, includes: a multi-layered disk having upper and lower...
2016/0133781 REUSABLE SUBSTRATE CARRIER
In some embodiments, a substrate carrier for holding a plurality of substrates comprises a disk formed of a continuous material to a nominal dimension which is...
2016/0133780 COMPOSITION FOR MANUFACTURING ELECTRODE OF SOLAR CELL, METHOD OF MANUFACTURING SAME ELECTRODE, AND SOLAR CELL...
A composition for manufacturing an electrode of a solar cell, comprising metal nanoparticles dispersed in a dispersive medium, wherein the metal nanoparticles...
2016/0133779 METHOD FOR MANUFACTURING CRYSTALLINE SILICON-BASED SOLAR CELL AND METHOD FOR MANUFACTURING CRYSTALLINE...
A method for manufacturing a crystalline silicon-based solar cell having a photoelectric conversion section includes a silicon-based layer of an opposite...
2016/0133778 DYNAMIC SUPPORT SYSTEM FOR QUARTZ PROCESS CHAMBER
One embodiment of the present invention provides a support system for providing dynamic support to a deposition reactor. The system includes a coupling...
2016/0133777 Optically Assist-Triggered Wide Bandgap Thyristors Having Positive Temperature Coefficients
A thyristor includes a first conductivity type semiconductor layer, a first conductivity type carrier injection layer on the semiconductor layer, a second...
2016/0133776 RADIATION DETECTOR MANUFACTURED BY DICING A SEMICONDUCTOR WAFER AND DICING METHOD THEREFOR
An embodiment relates to a group II-VI semiconductor radiation detector, and an embodiment relates to a method for producing same. An embodiment of the present...
2016/0133775 SOLAR CELL STACK
A solar cell stack, having a first semiconductor solar cell having a p-n junction made of a first material with a first lattice constant, and a second...
2016/0133774 SOLAR CELL WITH DIELECTRIC BACK REFLECTIVE COATING
In a method for producing a solar cell, a layer stack of dielectric layers is applied to a back of a solar cell substrate and the layer stack is heated and is...
2016/0133773 MONOLITHIC MULTIPLE SOLAR CELLS
A monolithic multiple solar cell includes at least three partial cells, with a semiconductor mirror placed between two partial cells. The aim of the invention...
2016/0133772 CONCENTRATING OPTICAL WAVEGUIDE AND CONTAINMENT CHAMBER SYSTEM
In embodiments of the present invention improved capabilities are described for a concentrating optical waveguide and containment facility comprising wide...
2016/0133771 TIR CONCENTRATOR OPTICS
The HCPV industry has converged on the use of relatively inexpensive Fresnel refractive optics to concentrate sunlight to 500-1000 suns or more. One...
2016/0133770 MONOLITHIC MULTIPLE SOLAR CELLS
A monolithic multiple solar cell includes at least three partial cells, with a semiconductor mirror placed between two partial cells. The aim of the invention...
2016/0133769 INTEGRATED DIODE ASSEMBLIES FOR PHOTOVOLTAIC MODULES
Provided are bypass diode assemblies for use in photovoltaic modules. Also provided are methods of fabricating such assemblies and a method of fabricating...
2016/0133768 INK COMPOSITION FOR MANUFACTURING LIGHT ABSORPTION LAYER OF SOLAR CELLS AND METHOD OF MANUFACTURING THIN FILM...
Disclosed are an ink composition for manufacturing a light absorption layer of solar cells and a method of manufacturing a thin film using the same....
2016/0133767 SOLAR CELL EMITTER REGION FABRICATION USING ION IMPLANTATION
Methods of fabricating solar cell emitter regions using ion implantation, and resulting solar cells, are described. In an example, a back contact solar cell...
2016/0133766 THREE-LAYER CORE-SHELL NANOPARTICLES FOR MANUFACTURING SOLAR CELL LIGHT ABSORPTION LAYER AND METHOD OF...
Disclosed are three-layer core-shell structure nanoparticles used to form a light absorption layer of solar cells including a core including a copper...
2016/0133765 SOLAR CELL AND METHOD OF MANUFACTURE THEREOF, AND SOLAR CELL MODULE
Disclosed is a solar cell having a collecting electrode on one main surface of a photoelectric conversion section. The collecting electrode includes a first...
2016/0133764 METHOD OF MANUFACTURING ELECTRICAL DEVICE
A method of manufacturing an electrical device comprising steps of: preparing a substrate; applying a conductive paste onto the substrate, wherein the...
2016/0133763 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF AND IMAGING APPARATUS
A semiconductor device for converting incident light into an electric current includes a semiconductor substrate; an electrode embedded in the semiconductor...
2016/0133762 MONOLITHIC INTEGRATION OF PLENOPTIC LENSES ON PHOTOSENSOR SUBSTRATES
The invention relates to the monolithic integration of a plenoptic structure on an image sensor, using a material with a low refractive index on the substrate...
2016/0133761 SOLAR CELL MODULE AND METHOD FOR PRODUCING SOLAR CELL MODULE
Provided is a solar cell module which has a high anti-glare property and is capable of maintaining power output at a high level. In a solar cell module with a...
2016/0133760 LEAD WIRE FOR SOLAR CELL, MANUFACTURING METHOD AND STORAGE METHOD THEREOF, AND SOLAR CELL
A solar cell lead wire includes a molten solder plated layer on a strip-shaped conductive material. The thickness of the oxide film on a surface to the molten...
2016/0133759 FOIL TRIM APPROACHES FOR FOIL-BASED METALLIZATION OF SOLAR CELLS
Foil trim approaches for the foil-based metallization of solar cells and the resulting solar cells are described. For example, a method involves attaching a...
2016/0133758 DUAL STACK VARACTOR
Embodiments include apparatuses and methods related to vertically stacked varactors. Specifically two varactors may be constructed of vertically stacked layers...
2016/0133757 DIODE
A diode has a multiple p-n junction body, anode and cathode electrodes, a short-circuit electrode, a guard ring, and an insulation film. The multiple p-n...
2016/0133756 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
To provide a highly reliable semiconductor device exhibiting stable electrical characteristics. To fabricate a highly reliable semiconductor device. Included...
2016/0133755 LOW TEMPERATURE POLY-SILICON THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF, ARRAY SUBSTRATE AND DISPLAY...
A low temperature poly-silicon thin film transistor and its manufacturing method, an array substrate and a display device are provided. The method comprises:...
2016/0133754 THIN FILM TRANSISTOR SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND LIQUID CRYSTAL DISPLAY PANEL HAVING THE SAME
A thin film transistor substrate includes a substrate, a bottom gate on the substrate, a first insulating layer on the substrate and on the bottom gate, a...
2016/0133753 SEMICONDUCTOR DEVICES CONTAINING AN EPITAXIAL PEROVSKITE/DOPED STRONTIUM TITANATE STRUCTURE
Semiconductor devices are provided such as, ferroelectric transistors and floating gate transistors, that include an epitaxial perovskite/doped strontium...
2016/0133752 3D MEMORY
Three-dimensional memory cells and methods of making and using the memory cells are discussed generally herein. In one or more embodiments, a three-dimensional...
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