Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2016/0133501 LOW TEMPERATURE ADHESIVE RESINS FOR WAFER BONDING
A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an...
2016/0133500 SEMICONDUCTOR WAFER PROTECTIVE FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
According to the present invention, there is provided a semiconductor wafer protective film including a substrate layer (A) and an adhesive layer (C) formed on...
2016/0133499 ADHESIVE RESINS FOR WAFER BONDING
An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide...
2016/0133498 LOW TEMPERATURE ADHESIVE RESINS FOR WAFER BONDING
A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an...
2016/0133497 MULTI-LAYER LASER DEBONDING STRUCTURE WITH TUNABLE ABSORPTION
The absorption properties of both an adhesive layer and an ablation layer are employed to facilitate debonding of a device wafer and a glass handler without...
2016/0133496 SEMICONDUCTOR BONDING WITH COMPLIANT RESIN AND UTILIZING HYDROGEN IMPLANTATION FOR TRANSFER-WAFER REMOVAL
A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion...
2016/0133495 MULTI-LAYER LASER DEBONDING STRUCTURE WITH TUNABLE ABSORPTION
The absorption properties of both an adhesive layer and an ablation layer are employed to facilitate debonding of a device wafer and a glass handler without...
2016/0133494 SUBSTRATE TRANSFER CHAMBER
Embodiments of substrate transfer chambers are provided herein. In some embodiments, a substrate transfer chamber includes a body having an interior volume,...
2016/0133493 SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus including a frame, a first SCARA arm connected to the frame, including an end effector, configured to extend and retract along...
2016/0133492 Article Transport Facility
An article transport facility includes a connecting actuator device for moving an eject portion of an inactive gas supplying device relative to a support...
2016/0133491 MULTI-CASSETTE CARRYING CASE
Embodiments of multi-cassette carrying cases are provided herein. In some embodiments a multi-cassette carrying case includes: a body having an inner volume; a...
2016/0133490 METHODS AND APPARATUS FOR TRANSFERRING A SUBSTRATE
Embodiments method and apparatus for transferring a substrate are provided herein. In some embodiments, a substrate cassette includes a body having an upper...
2016/0133489 Processing System Containing An Isolation Region separating a Deposition chamber from a treatment chamber
An apparatus and method for processing a substrate in a processing system containing a deposition chamber, a treatment chamber, and an isolation region,...
2016/0133488 Article Transport Vehicle
An article transport vehicle is provided in which it is difficult for the transported article support portions to interfere with the supported portion of the...
2016/0133487 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Suppressed is damage of a semiconductor wafer due to charging of a cleaning liquid used in a single wafer type wafer cleaning step. A chemical solution discharged...
2016/0133486 Double Layer Release Temporary Bond and Debond Processes and Systems
A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of...
2016/0133485 SYSTEMS AND METHODS FOR IN-LINE MEASUREMENT OF PRE-UNDERFILL WETTING ANGLE
Systems and method for determining whether to apply a liquid adhesive to a chip substrate based on a measured wetting angle are disclosed. According to the...
2016/0133484 Method of Manufacturing Semiconductor Device
Provided is a semiconductor device with improved reliability that achieves the reduction in size. A semiconductor wafer is provided that has a first insulating...
2016/0133483 MANUFACTURING METHOD OF INTERPOSED SUBSTRATE
A manufacturing method of an interposed substrate is provided. A metal-stacked layer comprising a first metal layer, an etching stop layer and a second metal...
2016/0133482 System and Method for an Improved Interconnect Structure
Presented herein are an interconnect structure and method for forming the same. The interconnect structure comprises a contact pad disposed over a substrate...
2016/0133481 THERMAL DOPING BY VACANCY FORMATION IN NANOCRYSTALS
The invention generally relates to methods of thermal doping by vacancy formation in nanocrystals, devices and uses thereof.
2016/0133480 METHODS FOR FORMING A SELF-ALIGNED CONTACT VIA SELECTIVE LATERAL ETCH
In some embodiments methods of processing a substrate include: providing a substrate having a contact structure formed on the substrate, wherein the contact...
2016/0133479 ISOLATION STRUCTURE INTEGRATED WITH SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A method for manufacturing an isolation structure integrated with semiconductor device includes following steps. A substrate is provided. A plurality of...
2016/0133478 METHODS FOR ETCHING SUBSTRATE AND SEMICONDUCTOR DEVICES
A method of etching a substrate using a metal-assisted chemical etching process is provided. The method may include forming a metal catalytic layer to a...
2016/0133477 METHODS OF FORMING RELIEF IMAGES
In a preferred aspect, methods are provided that comprise a) providing a semiconductor substrate comprising a patterned mask over a layer to be patterned; b)...
2016/0133476 FABRICATION METHOD OF SEMICONDUCTOR PIECE
A fabrication method of a semiconductor piece includes forming a groove that has a first groove portion, and a second groove portion which is a groove portion...
2016/0133475 PREPARATION METHOD OF A GERMANIUM-BASED SCHOTTKY JUNCTION
The present invention discloses a preparation method of a germanium-based Schottky junction, comprising, cleaning a surface of N-type germanium-based...
2016/0133474 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having gate structure thereon, wherein the...
2016/0133473 LTPS TFT Having Dual Gate Structure and Method for Forming LTPS TFT
The present invention proposes a low temperature poly-silicon thin-film transistor having a dual-gate structure and a method for forming the low temperature...
2016/0133472 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes forming an interlayer insulating layer including a first trench and a second trench on a substrate,...
2016/0133471 ELECTROLESS PLATING PROCESS AND TIN-SILVER PLATING SOLUTION THEREIN
An electroless plating process includes providing a semiconductor substrate which has a substrate and a copper pillar disposed on the substrate; providing a...
2016/0133470 METHODS OF FORMING TITANIUM-ALUMINUM LAYERS FOR GATE ELECTRODES AND RELATED SEMICONDUCTOR DEVICES
Methods of forming a semiconductor device are provided in which a first titanium-aluminum layer is formed in a recess. A first titanium layer is formed in the...
2016/0133469 METHOD FOR ION IMPLANTATION
A method for an ion implantation is provided. First, a non-parallel ion beam is provided. Thereafter, a relative motion between a workpiece and the...
2016/0133468 DAMAGE-FREE SELF-LIMITING THROUGH-SUBSTRATE LASER ABLATION
A first substrate, bonded to a second substrate by a material, is provided. The first substrate is transparent to at least some wavelengths of electromagnetic...
2016/0133467 Method For Improving Critical Dimension Variability
Methods of processing a workpiece are disclosed. Variability of the critical dimension of semiconductor structures may be affected by the critical dimension of...
2016/0133466 METHOD OF POLISHING SiC SUBSTRATE
A method of polishing a SiC substrate by supplying a polishing liquid and bringing a polishing pad into contact with the SiC substrate is provided. The...
2016/0133465 METHOD FOR PRODUCING SiC SUBSTRATE
A method that includes at least a CMP step of subjecting both a Si surface (1a) and a C surface (1b) of an SiC substrate (1) to double-sided polishing using a...
2016/0133464 Method of Patterning Incorporating Overlay Error Protection
Techniques herein include use of a spacer processes for patterning flows during microfabrication for creating hardmasks, features, contact openings, etc....
2016/0133463 METAL HALIDE SOLID-STATE SURFACE TREATMENT FOR NANOCRYSTAL MATERIALS
Methods of treating nanocrystal and/or quantum dot devices are described. The methods include contacting the nanocrystals and/or quantum dots with a solution...
2016/0133462 SYSTEM FOR MANUFACTURING GRAPHENE ON A SUBSTRATE
A method and apparatus for manufacturing a lattice structure of a material on a substrate, wherein the process may be performed at atmospheric pressure, may...
2016/0133461 METHOD TO GROW A SEMI-CONDUCTING SIC LAYER
A method to grow a semi insulating SiC layer. The method may include growing the semi insulating SiC layer on a substrate, and creating deep defects in the...
2016/0133460 Atomic Layer Deposition Of Films Comprising Si(C)N Using Hydrazine, Azide And/Or Silyl Amine Derivatives
Provided are methods for the deposition of films comprising Si(C)N via atomic layer deposition processes. The methods include exposure of a substrate surface...
2016/0133459 METHODS FOR CONTROLLING FIN RECESS LOADING
A method of processing a substrate includes depositing an oxide material on a substrate having a first region, a second region and a plurality of features,...
2016/0133458 Generalization Of Shot Definitions For Mask And Wafer Writing Tools
Techniques for reducing the number of shots required by a radiation beam writing tool to write a pattern, such as fractured layout design, onto a substrate....
2016/0133457 VAPOR PHASE GROWTH APPARATUS, STORAGE CONTAINER, AND VAPOR PHASE GROWTH METHOD
A vapor phase growth apparatus according to one embodiment includes a reaction chamber, a storage container storing organic metal, a thermostatic bath storing...
2016/0133456 APPARATUS AND METHOD FOR TREATING A SUBSTRATE
Disclosed is an apparatus and method for treating a substrate. The method includes supplying cleaning particles to the substrate to clean the substrate. The...
2016/0133455 WAFER CLEANING APPARATUS AND WAFER CLEANING METHOD USING THE SAME
The object of the present invention is to provide a wafer cleaning apparatus that reduces the amount of dissolved oxygen, without using hydrogen peroxide, to...
2016/0133454 SYSTEM AND METHOD FOR TREATING A SUBSTRATE
Disclosed are systems and methods for treating a substrate. The method may include supplying supercritical carbon dioxide into a chamber to treat a substrate....
2016/0133453 AMALGAM BALLS HAVING AN ALLOY COATING
Energy-saving lamps contain a gas filling of mercury vapour and argon in a gas discharge bulb. Amalgam balls are used for filling the gas discharge bulb with...
2016/0133452 DUAL FIELD MULTIPOLE CONVERGING ION GUIDES, HYPERBOLIC ION GUIDES, AND RELATED METHODS
An ion guide generates a first RF field of Nth order where N is an integer equal to or greater than 2, and a second RF field of 2Nth order superimposed on the...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.