Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2016/0141308 DISPLAY DEVICE
By applying an AC pulse to a gate of a transistor which easily deteriorates, a shift in threshold voltage of the transistor is suppressed. However, in a case...
2016/0141307 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF
A method of manufacturing an array substrate includes applying a first color filter and a second color filter over a first and second pixel regions...
2016/0141306 METHOD FOR MANUFACTURING ARRAY SUBSTRATE, ARRAY SUBSTRATE THEREOR AND DISPLAY DEVICE
The present disclosure provides a method for manufacturing an array substrate, an array substrate and a display device. The method includes: forming a gate...
2016/0141305 ARRAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
An array substrate comprises a TFT, a data line, a gate line and a passivation layer covering the TFT, the data line and the gate line. The array substrate...
2016/0141304 METHOD TO MATCH SOI TRANSISTORS USING A LOCAL HEATER ELEMENT
An integrated circuit with a matched transistor pair with a matching resistance heater coupled to each transistor of the matched transistor pair. A method for...
2016/0141303 SEMICONDUCTOR MEMORY DEVICE
According to an embodiment, a semiconductor memory device comprises: a semiconductor substrate; a memory cell array configured having a plurality of memory...
2016/0141302 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device includes stacked groups each including interlayer insulating patterns and conductive patterns and stacked in at least two tiers, wherein...
2016/0141301 THREE DIMENSIONAL NON-VOLATILE MEMORY WITH SEPARATE SOURCE LINES
A three dimensional stacked non-volatile memory device comprises alternating dielectric layers and conductive layers in a stack, a plurality of bit lines below...
2016/0141300 THREE-DIMENSIONAL MEMORY AND METHOD FOR MANUFACTURING THE SAME
A three-dimensional (3D) memory and a method for manufacturing the same are disclosed. According to one embodiment, the 3D memory comprises a thin-film...
2016/0141299 VERTICAL AND 3D MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME
A memory device is described, which includes a block of memory cells comprising a plurality of stacks of horizontal active lines such as NAND string channel...
2016/0141298 STI RECESS METHOD TO EMBED NVM MEMORY IN HKMG REPLACEMENT GATE TECHNOLOGY
The present disclosure relates to a structure and method for reducing contact over-etching and high contact resistance (Rc) on an embedded flash memory HKMG...
2016/0141297 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
In one embodiment, a semiconductor device includes a substrate, and first to fourth interconnects provided on the substrate to be adjacent to one another. The...
2016/0141296 RELIABLE NON-VOLATILE MEMORY DEVICE
Device and method for forming a device are disclosed. The method includes providing a substrate prepared with a memoir), cell region. At least first and second...
2016/0141295 ONE TIME PROGRAMMABLE MEMORY CELL AND METHOD FOR PROGRAMMING AND READING A MEMORY ARRAY COMPRISING THE SAME
A one time programmable (OTP) memory cell includes a select gate transistor, a following gate transistor, and an antifuse varactor. The select gate transistor...
2016/0141294 THREE-DIMENSIONAL MEMORY STRUCTURE WITH MULTI-COMPONENT CONTACT VIA STRUCTURE AND METHOD OF MAKING THEREOF
A contact via structure can include a ruthenium portion formed by selective deposition of ruthenium on a semiconductor surface at the bottom of a contact...
2016/0141293 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
According to one embodiment, a semiconductor memory device includes a memory cell; and a peripheral transistor. The memory cell includes a first channel, a...
2016/0141292 CMOS Gate Stack Structures and Processes
A semiconductor device includes a substrate having a semiconducting surface having formed therein a first active region and a second active region, where the...
2016/0141291 METAL SEGMENTS AS LANDING PADS AND LOCAL INTERCONNECTS IN AN IC DEVICE
Methods for utilizing metal segments of an additional metal layer as landing pads for vias and also as local interconnects between contacts in an IC device and...
2016/0141290 METHOD OF FORMING A MEMORY CAPACITOR STRUCTURE USING A SELF-ASSEMBLY PATTERN
A capacitor structure and method of forming thereof on a substrate is described. The capacitor structure includes a substrate having a plurality of capacitor...
2016/0141289 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
To provide a semiconductor device having improved reliability. An element isolation region comprised mainly of silicon oxide is buried in a trench formed in a...
2016/0141288 FIN SHAPE STRUCTURE
A fin shaped structure and a method of forming the same. The method includes providing a substrate having a first fin structure and a second fin structure....
2016/0141287 ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT, STRUCTURE AND METHOD OF MAKING THE SAME
An ESD structure, including a first conductive type substrate, a second conductive type well region in the substrate, first/second doped regions (the first...
2016/0141286 Carrier For An Optoelectronic Semiconductor Chip And Optoelectronic Component
A carrier (1) for an optoelectronic semiconductor chip comprising: (2) base body (10), which comprises a first main surface (10a) and a second main surface...
2016/0141285 ELECTROSTATIC DISCHARGE (ESD) PROTECTION DEVICE
An electrostatic discharge (ESD) protection device includes a semiconductor substrate and a pair of first well regions formed in the semiconductor substrate,...
2016/0141284 SEMICONDUCTOR DEVICE
A transistor (2) is provided on a semiconductor substrate (8). A temperature detection diode (4) for monitoring temperature of an upper surface of the...
2016/0141283 INTEGRATED THINFILM RESISTOR AND MIM CAPACITOR WITH A LOW SERIAL RESISTANCE
An electronic device comprising a semiconductor structure having a back end capacitor and a back end thin film resistor and a method of manufacturing the same....
2016/0141282 METHOD OF FABRICATING MULTI-SUBSTRATE SEMICONDUCTOR DEVICES
A first insulating layer is formed on a substrate. An opening is formed in the first insulating layer. A barrier layer is formed on the first insulating layer...
2016/0141281 FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING EMBEDDED SEMICONDUCTOR ELEMENTS
A semiconductor package is disclosed, which includes: a carrier having at least an opening; a plurality of conductive traces formed on the carrier and in the...
2016/0141280 Device-Embedded Image Sensor, And Wafer-Level Method For Fabricating Same
A device-embedded image sensor includes an image sensor formed in a first semiconductor substrate; a top conductive pad formed on a top surface of the first...
2016/0141279 METHODS FOR PERFORMING EXTENDED WAFER-LEVEL PACKAGING (eWLP) AND eWLP DEVICES MADE BY THE METHODS
Embedded Wafer-Level Packaging (eWLP) devices, packages and assemblies and methods of making them are provided. The eWLP methods allow back side electrical...
2016/0141278 LIGHT EMITTING DEVICE
A light emitting device includes a substrate, a plurality of micro light emitting chips and a plurality of conductive bumps. The substrate has a plurality of...
2016/0141277 ARRANGEMENT AND METHOD FOR GENERATING MIXED LIGHT
The invention relates to an arrangement for generating mixed light, which comprises three semiconductor chips, emitting in the blue spectral range, of three...
2016/0141276 LIGHT-EMITTING STRUCTURE FOR PROVIDING PREDETERMINED WHITENESS
A light-emitting structure for providing a predetermined whiteness includes a substrate and a light-emitting unit. The light-emitting unit includes a plurality...
2016/0141275 SEMICONDUCTOR POWER MODULE USING DISCRETE SEMICONDUCTOR COMPONENTS
An electronic power module is disclosed. The module includes a baseplate and a plurality of internally isolated discrete electronic devices mounted to the...
2016/0141274 NOVEL SEMICONDUCTOR DEVICE AND STRUCTURE
An Integrated Circuit device, including: a base wafer including single crystal, the base wafer including a plurality of first transistors; at least one metal...
2016/0141273 SEMICONDUCTOR DEVICE
This semiconductor device is formed by stacking a plurality of semiconductor chips that each have a plurality of bump electrodes, each of the plurality of...
2016/0141272 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
A semiconductor device which is provided with: a wiring substrate which has a first region, and a relay pad and a connection pad that are arranged outside the...
2016/0141271 SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
A semiconductor package including a lower package and an upper package provided may be provided. The lower package includes a lower package substrate, a lower...
2016/0141270 STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH IMPROVED THERMAL PERFORMANCE AND ASSOCIATED SYSTEMS AND METHODS
Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods are disclosed herein. In one embodiment, a...
2016/0141269 MULTI-CHIP SEMICONDUCTOR DEVICE
A multi-chip semiconductor device includes a plate-shaped first semiconductor chip having a first connection portion in which a first semiconductor chip...
2016/0141268 METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS
A method for manufacturing a semiconductor-apparatus, including an encapsulating step of a device mounting surface of a substrate having semiconductor-devices...
2016/0141267 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
There is provided a semiconductor device, including a semiconductor substrate, an interlayer insulating layer formed on the semiconductor substrate, a bonding...
2016/0141266 METHOD OF BONDING WITH SILVER PASTE
A method for bonding with a silver paste includes coating a semiconductor device or a substrate with the silver paste. The silver paste contains a plurality of...
2016/0141265 BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING A RELEASE LAYER
An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die...
2016/0141264 FLIP-CHIP BONDER WITH INDUCTION COILS
A method and apparatus for flip chip bonding using conductive and inductive heating to heat a plurality of solder bumps located between a chip carrier and a chip.
2016/0141263 SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE
According to at least one embodiment of the present invention, a wafer-to-wafer semiconductor device includes a first wafer substrate having a first bonding...
2016/0141262 REDISTRIBUTION FILM FOR IC PACKAGE
A redistribution film for IC package is disclosed, which comprises a top redistribution layer configured on top of a bottom redistribution layer. The top...
2016/0141261 Ball Amount Process in the Manufacturing of Integrated Circuit
An integrated circuit structure includes a semiconductor substrate, a metal pad over the semiconductor substrate, a passivation layer including a portion over...
2016/0141260 PRE-PACKAGE AND METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE USING THE SAME
Methods of fabricating semiconductor packages are provided. One of the methods includes forming a protection layer including metal on a first surface of a...
2016/0141259 Method of forming a bondpad and bondpad
Various embodiments provide a method of forming a bondpad, wherein the method comprises providing a raw bondpad, and forming a recess structure at a contact...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.