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Patent # Description
2016/0172349 MICROELECTRONIC DEVICE PACKAGES, STACKED MICROELECTRONIC DEVICE PACKAGES, AND METHODS FOR MANUFACTURING...
A stackable microelectronic package includes a first microelectronic die attached to and electrically connecting with a first substrate. A second ...
2016/0172348 Pre-Applying Supporting Materials Between Bonded Package Components
A structure includes a first package component, and a second package component over and bonded to the first package component. A supporting material is...
2016/0172347 ELECTRONIC DEVICE MOUNTED ON A SUBSTRATE
A device includes: a substrate; and a functional element mounted, the functional element including electrodes. The substrate includes a support substrate, and...
2016/0172346 DISPLAY DEVICE HAVING FILM SUBSTRATE
A display device comprises: a film substrate; display pixels; a flexible printed circuit board and/or a driver integrated circuit; a protective resin that...
2016/0172345 Multi-Chips in System level and Wafer level Package Structure
A multi-chips in system level and wafer level package structure includes a package substrate having a plurality of through holes a multi-chips with different...
2016/0172344 LOW PROFILE REINFORCED PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE
The present disclosure provides semiconductor packages and methods for fabricating PoP semiconductor packages. The PoP semiconductor package may comprise a...
2016/0172343 Light-Emitting Diode Device
A light-emitting diode device is disclosed. The light-emitting diode device includes a transparent substrate with a first surface, a second surface opposite to...
2016/0172342 LIGHT-EMITTING DEVICE
A light-emitting device includes a substrate; a light-emitting unit formed on the substrate, comprising a first conductivity type semiconductor; a second...
2016/0172341 LIGHT EMITTING DEVICE
A light emitting device includes a substrate, a plurality of micro light emitting chips, a plurality of reflective structures and a plurality of conductive...
2016/0172340 LIGHT-EMITTING DIODE DISPLAY SCREEN
A Light Emitting Diode (LED) display screen includes: an LED display screen substrate (200), an output end of the driving circuit includes: a first positive...
2016/0172339 LED LAMP USING ULTRA-SMALL LED ELECTRODE ASSEMBLY
Provided is an LED lamp using a nano-scale LED electrode assembly. The LED lamp using the nano-scale LED electrode assembly may solve limitations in which,...
2016/0172338 SILICON PACKAGE FOR EMBEDDED ELECTRONIC SYSTEM HAVING STACKED SEMICONDUCTOR CHIPS
An electronic system comprises a first chip of single-crystalline semiconductor shaped as a hexahedron and including a first electronic device embedded in a...
2016/0172337 SEMICONDUCTOR PACKAGE DEVICES INCLUDING INTERPOSER OPENINGS FOR HEAT TRANSFER MEMBER
A semiconductor package device includes a lower package, an interposer disposed on the lower package and including a ground layer and at least one opening, and...
2016/0172336 INDEPENDENT CONTROL OF STACKED ELECTRONIC MODULES
Apparatus and methods are disclosed to allow independent control of stacked memory modules. In one embodiment, an apparatus may comprise first, second, and...
2016/0172335 SEMICONDUCTOR DEVICE
A semiconductor device includes a supporting member, a first semiconductor chip on the supporting member and including an overheating detection circuit, a...
2016/0172334 STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE
A chip package structure and a method for forming a chip package are provided. The chip package structure includes a first package which includes at least a...
2016/0172333 Integrated Circuit Package and Methods of Forming Same
A method for forming integrated circuit packages is presented. A first plurality of first tier stacks are mounted to the substrate, wherein the substrate has...
2016/0172332 MEMORY MODULE IN A PACKAGE
A microelectronic package can include a substrate having first and second opposed surfaces, at least two pairs of microelectronic elements, and a plurality of...
2016/0172331 SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF STACKED CHIPS
A semiconductor package may include a substrate having a first surface and a second surface facing away from the first surface, a window defined through a...
2016/0172330 Tunable OLED Lighting Source
Described herein are devices and methods related to lighting systems that are color tunable and have a long lifetime. In certain embodiments, the device...
2016/0172329 Interconnect Structures for Wafer Level Package and Methods of Forming Same
A method for forming a device package includes forming a molding compound around a plurality of dies and laminating a polymer layer over the dies. A top...
2016/0172328 BONDING MATERIAL AND BONDING METHOD USING THE SAME
A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material...
2016/0172327 Low-Temperature Bonding and Sealing With Spaced Nanorods
The present disclosure provides improved systems and methods for low-temperature bonding and/or sealing with spaced nanorods. In exemplary embodiments, the...
2016/0172326 BONDING METHOD AND BONDING STRUCTURE FORMED USING THE SAME
In view of the problems in all existing bonding methods, such as high temperature, high pressure, and high surface modification cost, etc., the present...
2016/0172325 METHOD FOR MAKING AN ELECTRICAL CONNECTION IN A BLIND VIA AND ELECTRICAL CONNECTION OBTAINED
Method comprising steps as follows: a) depositing a meltable ball on a first conducting zone located in a blind hole formed on a first face of a first...
2016/0172324 ALIGNMENT OF THREE DIMENSIONAL INTEGRATED CIRCUIT COMPONENTS
A method for aligning a chip onto a substrate is disclosed. The method includes, depositing a ferrofluid, onto a substrate that has one or more pads that...
2016/0172323 PICTURE FRAME STIFFENERS FOR MICROELECTRONIC PACKAGES
A microelectronic package may be formed with a picture frame stiffener surrounding a microelectronic die for reducing warpage of the microelectronic package....
2016/0172322 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes forming a barrier metal film on a surface of at least one of a first electrode of a wiring board and...
2016/0172321 METHOD AND STRUCTURE FOR WAFER-LEVEL PACKAGING
A method for wafer-level packaging includes providing a substrate having a conductive metal pad formed on the surface of the substrate; forming a metal core on...
2016/0172320 MAGNETIC INTERMETALLIC COMPOUND INTERCONNECT
The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used...
2016/0172319 COMPACT SEMICONDUCTOR PACKAGE AND RELATED METHODS
A method of forming a semiconductor package includes providing a substrate having one or more conductive elements disposed therein. Each conductive element...
2016/0172318 SEMICONDUCTOR DEVICES WITH IMPEDANCE MATCHING-CIRCUITS
Embodiments of semiconductor devices (e.g., RF devices) include a substrate, an isolation structure, an active device, a lead, and a circuit. The isolation...
2016/0172317 INTEGRATED MILLIMETER-WAVE CHIP PACKAGE
An integrated millimeter-wave chip package structure including an interposer structure, a millimeter-wave chip and a substrate is provided. The interposer...
2016/0172316 MOLD FOR RESIN SEALING, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR DEVICE
Provided is a mold for resin sealing manufactured inexpensively. Processing for cavities for the mold is performed by high-speed rotary cutting with a round...
2016/0172315 PECVD PROTECTIVE LAYERS FOR SEMICONDUCTOR DEVICES
A semiconductor device includes a plasma-enhanced chemical vapor deposition (PECVD) protective layer configured to prevent failure of the semiconductor device...
2016/0172314 STRUCTURE TO PREVENT DEEP TRENCH MOAT CHARGING AND MOAT ISOLATION FAILS
A semiconductor structure is provided that includes a semiconductor on insulator (SOI) substrate comprising a bottom semiconductor layer, an epitaxial...
2016/0172313 SUBSTRATE WITH A SUPPORTING PLATE AND FABRICATION METHOD THEREOF
A method for forming a substrate with a supporting plate includes forming a substrate including an active area and an edge area. The active area is surrounded...
2016/0172312 WAFER PROCESSING METHOD
A wafer is divided into individual device chips along a plurality of scheduled division lines. A protective film is formed by coating liquid-state resin, which...
2016/0172311 IC WITH INSULATING TRENCH AND RELATED METHODS
An IC may include a semiconductor substrate having circuitry formed in the substrate, an interconnect layer above the semiconductor substrate and having an...
2016/0172310 METHODS AND DEVICES OF LAMINATED INTEGRATIONS OF SEMICONDUCTOR CHIPS, MAGNETICS, AND CAPACITANCE
Semiconductor chip laminates and inductive, capacitive, and electromagnetic shielding laminate structures that can be integrated together to form electronic...
2016/0172309 EMI/RFI SHIELDING FOR SEMICONDUCTOR DEVICE PACKAGES
An encapsulated semiconductor device package with an overlying conductive EMI or RFI shield in contact with an end of a grounded conductive component at a...
2016/0172308 OVERLAY MARK
An overlay mark applied to a LELE-type double patterning lithography (DPL) process including a first lithography step, a first etching step, a second...
2016/0172307 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Reading reliability of a code formed in a semiconductor device is improved. A manufacturing method of semiconductor devices according to one embodiment...
2016/0172306 METHOD OF MARKING A SEMICONDUCTOR PACKAGE
A method of making a semiconductor device can include providing a wafer comprising a plurality of semiconductor die, wherein each semiconductor die comprises...
2016/0172305 CONDUCTIVE STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
An opening is formed in an insulating film being a formation site, vertical and parallel CNTs are formed, tip portions of the CNTs are inserted into the...
2016/0172304 SEMICONDUCTOR DEVICE INCLUDING AIR GAPS AND METHOD OF FABRICATING THE SAME
This technology provides a semiconductor device and a method of fabricating the same, which may reduce parasitic capacitance between adjacent conductive...
2016/0172303 Contact Critical Dimension Control
In a method for manufacturing a semiconductor device, a dielectric layer is formed on a substrate, and a contact hole is formed from the dielectric layer to...
2016/0172302 PACKAGE ON PACKAGE (POP) DEVICE COMPRISING A HIGH PERFORMANCE INTER PACKAGE CONNECTION
A package on package (PoP) device includes a first package and a second package. The first package includes a first package substrate, a die coupled to the...
2016/0172301 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
A semiconductor device includes a first insulating film located on the semiconductor substrate and including a first contact hole; a contact plug located in...
2016/0172300 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having a gate structure thereon and an...
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