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Patent # Description
2016/0183394 ELECTRONIC ASSEMBLY HAVING A CIRCUIT BOARD WITH A SHOCK ABSORBER DEVICE
An electronic assembly including a printed circuit board (PCB), a housing, and a shock absorbing device that is intermediate the printed circuit board and the...
2016/0183393 MOUNTING APPARATUS FOR ELECTRONIC DEVICE AND USE THEREOF
Mounting apparatus for securing an electronic device to facilitate operation of the device by a user in a hands-free manner are disclosed herein, as well as...
2016/0183392 Electronic Device Holder
An electronic device holder for storing and organizing electronic devices. The electronic device holder includes a main pocket having a front panel and a rear...
2016/0183391 METHODS AND DEVICES FOR MINIATURIZATION OF HIGH DENSITY WAFER BASED ELECTRONIC 3D MULTI-CHIP MODULES
Techniques for constructing a multi-chip module semiconductor device are provided herein. The techniques include placing electronic modules on a first surface...
2016/0183390 HOUSING AND WEARABLE ELECTRONIC DEVICE USING THE SAME
A shock and water resistant housing for a wearable device includes a first housing and a second housing assembled with the first housing, the first housing...
2016/0183389 MOTOR CONTROL APPARATUS
A motor control apparatus includes a motor, a motor controller, and a connection line. The motor is mounted to a vehicle and has a metal housing. The motor...
2016/0183388 DISPLAY DEVICE AND DISPLAY DEVICE MANUFACTURING METHOD
A display device is provided which suppresses cost increases attributable to design changes and so forth for things disposed on the inside of a product when a...
2016/0183387 DISPLAY DEVICE
A display device includes: a display panel; a flexible printed circuit board (FPCB) attached to the display panel; and an intermediate frame including a...
2016/0183386 TECHNIQUES FOR CONTROLLING EQUIVALENT SERIES RESISTANCE OF A CAPACITOR
Methods and apparatus for controlling an equivalent-series resistance (ESR) of a capacitor are provided. An exemplary apparatus includes a substrate having a...
2016/0183385 METHOD FOR PRODUCING FILM AND FLEXIBLE METAL-CLAD LAMINATE
A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a...
2016/0183384 ELECTRICAL DEVICES AND METHODS FOR MANUFACTURING SAME
An electrical device for soldering to a circuit board with a solder includes a capacitor, a lead frame including a solder dam, and a solder joint electrically...
2016/0183383 Method for Contacting and Rewiring an Electronic Component Embedded into a Printed Circuit Board
A method for contacting and rewiring an electronic component embedded in a PCB in the following manner is disclosed. A first permanent resist layer is applied to...
2016/0183382 CAPACITIVE IMAGE SENSOR WITH SELECTABLE FUNCTION ELECTRODES
In an example, a capacitive image sensor comprises a first sensor electrode, a second sensor electrode, and a third sensor electrode. The first sensor...
2016/0183381 Electronic Component and Overmolding Process
Electronic components and overmolding processes are disclosed. The electronic component, such as, an antenna, includes a substrate, an overmolding bonded to at...
2016/0183380 SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED WIRING BOARD, COPPER...
The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil,...
2016/0183379 SUBSTRATE COMPRISING AN EMBEDDED CAPACITOR
A substrate that includes a first dielectric layer and a capacitor embedded in the first dielectric layer. The capacitor includes a base portion, a first...
2016/0183378 SUBSTRATE COMPRISING EMBEDDED ELONGATED CAPACITOR
A substrate that includes a first dielectric layer and a capacitor embedded in the first dielectric layer. The capacitor includes a first terminal, a second...
2016/0183377 DIELECTRIC FILMLESS ELECTRONIC MODULE AND METHOD FOR MANUFACTURING SAME
The invention relates to an electronic module comprising a first metal layer including at least one contact pad or a conductive pad for connection or...
2016/0183376 ELECTRONIC PACKAGES WITH PRE-DEFINED VIA PATTERNS AND METHODS OF MAKING AND USING THE SAME
An electronic package is provided. The electronic package includes a substrate and a plurality of vias defined by a corresponding plurality of pre-defined via...
2016/0183375 SOCKET LOADING ELEMENT AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS
Embodiments of the present disclosure are directed towards a socket loading element and associated techniques and configurations. In one embodiment, an...
2016/0183374 CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES
Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The...
2016/0183373 HIGH DENSITY AC COUPLING/DC BLOCKING PIN-FIELD ARRAY
Implementations of the present disclosure involve an apparatus and/or method for a large array of AC coupling/DC blocking capacitors on a printed circuit board...
2016/0183372 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
A printed circuit board includes: at least one insulating layer; and a pattern layer disposed on at least one surface of the at least one insulating layer,...
2016/0183371 MICROVIA STRUCTURE OF FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Disclosed urea microvia structure of a flexible circuit board and a manufacturing method thereof. A first through hole is formed in a first conductive layer of...
2016/0183370 Zero-Misalignment Via-Pad Structures
A photoresist is deposited on a seed layer on a substrate. A first region of the photoresist is removed to expose a first portion of the seed layer to form a...
2016/0183369 LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL
Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a...
2016/0183368 POLYAMIDE FILMS AND PROCESS FOR PREPARATION
The invention relates to a stretched polymer film made of a polyamide composition comprising a semi-crystalline semi-aromatic polyamide (PPA), wherein the PPA...
2016/0183367 INTEGRATED SYSTEM OF AN ELECTRONIC MODULE AND CONDUCTIVE FABRIC AND METHOD OF MAKING THE SAME
An electronic module assembly and method of assembling an electronic module to a conductive fabric are provided. An electronic module assembly comprises a...
2016/0183366 FLEXIBLE PRINTED BOARD
A flexible printed board electrically connected to an electronic component (for example, a liquid crystal panel) by thermal compression bonding, including a...
2016/0183365 RECONFIGURABLE ELECTRONIC SUBSTRATE
The present disclosure relates to the fabrication of electrical components and, in particular to the use of a reconfigurable substrate to which a flexible...
2016/0183364 DEVICE INCLUDING STRETCHABLE DISPLAY AND METHOD OF CONTROLLING THE DEVICE
A device including a stretchable display and a method of controlling the device are disclosed. In one aspect, the device includes a stretchable display...
2016/0183363 FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
A flexible printed circuit board and a method of manufacturing the same are disclosed. A flexible printed circuit board having a flexible region and a rigid...
2016/0183362 PATTERNED METALLIZATION HANDLE LAYER FOR CONTROLLED SPALLING
A handle substrate having at least one metallization region is provided on a stressor layer that is located above a base substrate such that the at least one...
2016/0183361 MICROELECTRONIC SUBSTRATES HAVING COPPER ALLOY CONDUCTIVE ROUTE STRUCTURES
Microelectronic substrates having copper alloy conductive routes to reduce warpage due to differing coefficient of thermal expansion of the components used to...
2016/0183360 PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE UTILIZING THE SAME
A printed circuit board for an electronic device includes first and second sets of differential vias. Each set of differential vias comprises two vias. A first...
2016/0183359 FLEXIBLE ELECTRICAL CONDUCTOR DEVICE
A flexible conductor device (1) includes an electrically insulating flexible carrier substrate (2) and a printed electrical conductor (12) situated on the...
2016/0183358 PATTERNED METALLIZATION HANDLE LAYER FOR CONTROLLED SPALLING
A handle substrate having at least one metallization region is provided on a stressor layer that is located above a base substrate such that the at least one...
2016/0183357 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
A printed circuit board includes a first printed circuit substrate and a second printed circuit substrate. The first printed circuit substrate includes a...
2016/0183356 DEVICE FOR PRODUCING LASER-COOLED ATOMS
The device for producing laser-cooled atoms comprises a two dimensional trap or a three-dimensional trap, or a combination of two- and three-dimensional traps....
2016/0183355 SELECTING SCANNING VOLTAGES FOR DUAL ENERGY CT SCANNING
A method and apparatus for selecting high and low energy scanning voltages for a dual energy CT scanner are provided. The method may comprise: setting a...
2016/0183354 FAULT DETECTION DEVICE FOR STREETLAMP LIGHTING SYSTEM AND METHOD OF OPERATING THE SAME
Various embodiments may relate to a fault detection device for streetlamp lighting system. The streetlamp lighting system includes multiple load groups which...
2016/0183353 A LIGHTING DEVICE AND LUMINAIRE COMPRISING AN INTEGRATED ANTENNA
The invention provides a lighting device (100) and a luminaire (200). The lighting device comprises a light emitter (110) thermally connected to a heat sink...
2016/0183352 MULTI-ZONE CONTROL SYSTEM
A multi-zone control system is provided. The multi-zone control system may include a system unit, zone wiring, a plurality of zone connection terminals and a...
2016/0183351 SYSTEM, METHOD, AND APPARATUS FOR POWERING INTELLIGENT LIGHTING NETWORKS
The present invention relates to a system, method, and apparatus for powering intelligent lighting networks. The power for the intelligent lighting network is...
2016/0183350 METHODS AND APPARATUS FOR APPLYING LIGHTING TO AN OBJECT
Disclosed are methods and apparatus for lighting control. Initial lighting may be applied to an object in response to identifying presence of the object. The...
2016/0183349 ILLUMINATION APPARATUS AND STORAGE MEDIUM
There is provided an illumination apparatus including an illumination unit, a reception unit, and a control unit configured to control illumination of the...
2016/0183348 ELECTRONIC BALLAST HAVING A BI-FUNCTIONAL CONTROL INPUT AND A METHOD FOR OPERATING AT LEAST ONE LIGHTING MEANS
An electronic ballast for operating an illuminant includes a control input for coupling to a control device designed to act as a current sink in a continuous...
2016/0183347 MULTI-MASTER 0-10V DIMMING CONTROLLER WITH REMASTERING CAPABILITY
A 0-10V dimming system includes at least two dimming controllers, at least one luminaire electrically connected to the dimming controllers, a control source...
2016/0183346 BACKLIT LUMINOUS STRUCTURE
The present disclosure relates generally to a backlit luminous structure. The backlit luminous structure includes a substrate, such as a two dimensional or...
2016/0183345 ELECTRONIC BALLAST FOR OPERATING AT LEAST A FIRST AND A SECOND CASCADE OF LEDS
Various embodiments may relate to an electronic ballast for operating at least a first and a second cascade of LEDs, wherein the first cascade of LEDs is...
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