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Patent # Description
2016/0181494 Method of Fabricating A Flip Chip Light Emitting Diode (FCLED) Die Having N-Conductor Layer
A method for fabricating a flip chip light emitting diode (FCLED) die includes forming an epitaxial stack on a carrier substrate having an n-type confinement...
2016/0181493 LIGHT EMITTING DEVICE
A light emitting device, includes: a package equipped with a lead having an upper surface and a lower surface, and a metal board and a plating layer, the upper...
2016/0181492 LIGHT EMITTING DEVICE
A light emitting device includes: a package equipped with a lead that has an upper surface and a lower surface, and has a metal board and a plating layer...
2016/0181491 OPTOELECTRONIC SEMICONDUCTOR COMPONENT
An optoelectronic semiconductor component including an optoelectronic semiconductor chip having a first surface, wherein the first surface is a radiation...
2016/0181490 Light Emitting Diode Packaging Structure
A packaging structure of a vertical LED chip includes at least a support system, a glue cup that connects to periphery of the support system, a LED chip with...
2016/0181489 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE
A light emitting device includes a light emitting layer, a substrate that is transparent to an emission wavelength of the light emitting layer and positioned...
2016/0181488 SEMICONDUCTOR LIGHT EMITTING DEVICE
A semiconductor light emitting device including a plurality of light emitting elements can be miniaturized while enabling to emit light with high luminance....
2016/0181487 PHOTON EXTRACTION FROM NITRIDE ULTRAVIOLET LIGHT-EMITTING DEVICES
In various embodiments, a rigid lens is attached to a light-emitting semiconductor die via a layer of encapsulant having a thickness insufficient to prevent...
2016/0181486 LIGHT OUTPUT DEVICE AND METHOD OF MANUFACTURE
A light output device and manufacturing method in which an array of LEDs is embedded in an encapsulation layer. An array of cavities (or regions of different...
2016/0181485 WAVELENGTH CONVERSION FILM AND LIGHT EMITTING DEVICE PACKAGE INCLUDING THE SAME
A wavelength conversion film is provided and may include a first layer including a wavelength conversion material and an encapsulant encapsulating the...
2016/0181484 OXYNITRIDE-BASED PHOSPHOR AND WHITE LIGHT EMITTING DEVICE INCLUDING THE SAME
There is provided an oxynitride-based phosphor comprising a .beta.-type Si.sub.3N.sub.4 crystal structure and represented by a compositional formula of...
2016/0181483 METHOD OF PRODUCING A CONVERTER ELEMENT AND AN OPTOELECTRONIC COMPONENT, CONVERTER ELEMENT AND OPTOELECTRONIC...
A method of producing a converter element for an optoelectronic component includes arranging a plurality of converter laminae on a carrier, forming a molded...
2016/0181482 LUMINESCENT COATINGS AND DEVICES
A method of combining a first phosphor material and a second phosphor material and devices made therefrom. The method includes providing a first phosphor...
2016/0181481 Method for Producing a Conversion Lamina and Conversion Lamina
A method for producing at least one conversion lamina for a radiation-emitting semiconductor component is specified. A base material including a conversion...
2016/0181480 Composite Substrate for Light Emitting Diodes
A low-cost device for packaging LED dies provides superior reflectivity and thermal conductivity without covering entire surfaces of an LED luminaire with an...
2016/0181479 LIGHT EMITTING DEVICE AND LIGHTING SYSTEM
A light emitting device includes a body having a cavity and a step difference structure around the cavity, a plurality of electrodes in the cavity, a light...
2016/0181478 SEMICONDUCTOR LIGHT EMITTING DEVICE AND FABRICATION METHOD OF THE SEMICONDUCTOR LIGHT EMITTING DEVICE
A semiconductor light emitting device which can control of current density and can optimize current density and in which a rise in luminosity is possible, and...
2016/0181477 LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME
A light emitting diode includes an n-type semiconductor layer disposed on a substrate; a p-type semiconductor layer disposed on a portion of the n-type...
2016/0181476 MICRO LED WITH DIELECTRIC SIDE MIRROR
LEDs and an electronic device are disclosed. In an embodiment an LED includes a p-n diode and a dielectric mirror spanning along a lateral sidewall of the p-n...
2016/0181475 SEMICONDUCTOR LIGHT-EMITTING DEVICE
A semiconductor light-emitting device including a first type doped semiconductor layer, a second type doped semiconductor layer, a light-emitting layer, and a...
2016/0181474 OPTOELECTRONIC DEVICES INCORPORATING SINGLE CRYSTALLINE ALUMINUM NITRIDE SUBSTRATE
The invention provides an optoelectronic device adapted to emit ultraviolet light, including an aluminum nitride single crystalline substrate, wherein the...
2016/0181473 LIGHT EMITTING DEVICE
A light emitting device including a light emitting element that has a peak light emission wavelength of from 400 nm to 455 nm, a first fluorescent material...
2016/0181472 SEMICONDUCTOR LIGHT-EMITTING DEVICE
A semiconductor light-emitting device including an N-type semiconductor layer, a plurality of P-type semiconductor layers, a light-emitting layer, and a...
2016/0181471 Optoelectronic Semiconductor Chip Comprising a Multi-Quantum Well Comprising at Least One High Barrier Layer
An optoelectronic semiconductor chip includes a p-type semiconductor region, an n-type semiconductor region, and an active layer embodied as a multi-quantum...
2016/0181470 HIGH PEAK POWER QUANTUM CASCADE SUPERLUMINESCENT EMITTER
A high power quantum cascade superluminescent emitter employs low reflectivity facets including a tilted cleaved facet, a rounded shaped wet-etched sloped...
2016/0181469 SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor light-emitting device including a first N-type semiconductor layer, a P-type semiconductor layer, and a light-emitting layer is provided. The...
2016/0181468 Variable Composition Transparent Conductive Oxide Layer and Methods of Forming Thereof
Provided are light emitting diodes (LEDs) and methods of fabricating such LEDs. An LED may include a transparent conductive oxide (TCO) layer having a varying...
2016/0181467 Methods For Forming A Transparent Oxide Layer For A Photovoltaic Device
A method of manufacturing a transparent oxide layer is provided. The manufacturing method includes disposing a cadmium tin oxide layer on a support, placing...
2016/0181466 Solar Cell, Manufacturing Method Therefor, Solar-Cell Module, and Manufacturing Method Therefor
Provided is a solar cell including a photoelectric conversion section having a first principal surface and a second principal surface, and a collecting...
2016/0181465 ION IMPLANT SYSTEM HAVING GRID ASSEMBLY
An ion implantation system having a grid assembly. The system includes a plasma source configured to provide plasma in a plasma region; a first grid plate...
2016/0181464 METHOD OF FORMING AN INVERTED METAMORPHIC MULTIJUNCTION SOLAR CELL WITH DBR LAYER ADJACENT TO THE TOP SUBCELL
A multijunction solar cell comprising an upper first solar subcell having a first band gap; a middle second solar subcell adjacent to the first solar subcell...
2016/0181463 METHODS OF TREATING A SEMICONDUCTOR LAYER
Methods for treating a semiconductor layer including a semiconductor material are presented. A method includes contacting at least a portion of the...
2016/0181462 APPARATUS AND METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT
The present invention relates to an apparatus for manufacturing an integrated circuit (10) having a thick film metal layer (14). A layer of metal paste (14) is...
2016/0181461 MANUFACTURING METHOD FOR SOLAR CELL
Provided is a method for manufacturing a solar cell with improved output characteristics. A hydrogen radical treatment, in which ions are not used, is...
2016/0181460 Avalance Photodiode
An avalanche photodiode includes a P-type contact layer, a light absorption layer, a compositionally-graded symmetrical multiplication layer, and an N-type...
2016/0181459 METHOD FOR INCREASING THE DYNAMIC RANGE OF A SILICON PHOTOMULTIPLIER
A method for increasing the dynamic range of a silicon photomultiplier (SiPM) in particular with regard to the detection of high radiation intensities,...
2016/0181458 Cross-Talk Suppression in Geiger-Mode Avalanche Photodiodes
An avalanche photodiode detector is provided with a substrate including an array of avalanche photodiodes. An optical interface surface of the substrate is...
2016/0181457 N-TYPE/P-TYPE MONOLITHIC SILICON WAFER
A process for fabricating a wafer of thickness, including at least (i) providing a monolithic substrate made of p-doped silicon; (ii) forming crystal defects...
2016/0181456 Low-Cost and High-Efficiency Tandem Photovoltaic Cells
Tandem solar cells are provided that are more cost-efficient manner and can reach much higher power conversion efficiency compared to previous technologies. In...
2016/0181455 SILICON WAFER HAVING COMPLEX STRUCTURE, FABRICATION METHOD THEREFOR AND SOLAR CELL USING SAME
Disclosed are a silicon wafer having a complex structure, a method of fabricating the same, and a solar cell using the same, wherein the silicon wafer is...
2016/0181454 SOLAR CELL MODULE AND METHOD FOR MANUFACTURING THE SAME
A solar cell module and a method for manufacturing the same are discussed. The solar cell module includes a front transparent substrate and a back substrate...
2016/0181453 PHOTODETECTOR CELL AND SOLAR PANEL WITH DUAL METAL CONTACTS AND RELATED METHODS
A photodetector cell may include a substrate, and a first contact carried by the substrate and having a first work function value. The photodetector cell may...
2016/0181452 COMPOUND SOLAR CELL AND METHOD FOR FORMING THIN FILM HAVING SULFIDE SINGLE-CRYSTAL NANOPARTICLES
A compound solar cell includes a substrate, a first electrode located on the substrate, a Group VI absorption layer located on the first electrode, and a...
2016/0181451 BISMUTH FERRITE THIN-FILM SOLAR CELL AND METHOD OF MANUFACTURING THE SAME
A bismuth ferrite thin-film solar cell and a method of manufacturing the same control the quantity of Fe.sup.2+ defected in the bismuth ferrite thin-film by...
2016/0181450 MULTI-LAYER SPUTTERED METAL SEED FOR SOLAR CELL CONDUCTIVE CONTACT
Multi-layer sputtered metal seed for solar cell conductive contacts and methods of forming solar cell conductive contacts are described. In an example, a solar...
2016/0181449 Plasmonic Photovoltaic Devices
This disclosure provides embodiments of photovoltaic devices. The devices include a light-absorbing anode comprised of an electrically conductive material...
2016/0181448 PHOTODETECTOR WITH SURFACE PLASMON RESONANCE
Methods and structures for providing single-color or multi-color photo-detectors leveraging plasmon resonance for performance benefits. In one example, a...
2016/0181447 LASER BEAM SHAPING FOR FOIL-BASED METALLIZATION OF SOLAR CELLS
Approaches for foil-based metallization of solar cells and the resulting solar cells are described. For example, a method of fabricating a solar cell involves...
2016/0181446 PHOTOVOLTAIC MODULE
A photovoltaic module includes an encapsulated photovoltaic element and an infrared-transmissive decorative overlay simulating conventional roofing.
2016/0181445 SILICON PHOTONICS INTEGRATION METHOD AND STRUCTURE
Approaches for silicon photonics integration are provided. A method includes: forming at least one encapsulating layer over and around a photodetector;...
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