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Patent # Description
2016/0192520 MODULAR ELEMENTS EMPLOYING LATCHES WITH FLEXURE BEARINGS
Modular elements employing latches with flexure bearings are disclosed. A modular element may include a chassis body supporting electronic components. The body...
2016/0192519 DISPLAY APPARATUS
Provided is a display apparatus. The display apparatus includes a display panel for displaying an image, a back cover mounted on a rear surface of the display...
2016/0192518 OBJECT DETECTION DEVICE
An object detection device includes: an object detection portion which detects an object around a vehicle; a support member by which the object detection...
2016/0192517 CASING, ELECTRONIC DEVICE EMPLOYING SAME AND MANUFACTURING METHOD
A casing includes a cover and a frame coupled to the cover. The frame includes a base body and a plurality of non-conductive portions. The base body defines a...
2016/0192516 Mobile Electronic Device Armband Carrier
An Armband composed of a stretchable compression, see-through material fabrication incorporates a pocket for receiving a mobile electronic device in an...
2016/0192515 CIRCUIT BOARD ASSEMBLY AND ASSEMBLING METHOD THEREOF
A circuit board assembly includes a casing, a first circuit board, a second circuit board, plural connectors and at least one fastening element. The casing...
2016/0192514 ELECTRONIC APPARATUS HAVING A MOLDED RESIN HOUSING
An electronic apparatus includes a substrate having an edge including a non-flat portion, a plurality of electronic units disposed on a surface of the...
2016/0192513 Suspended Segmented Display Array
A suspended segmented display array in one embodiment includes multiple cables offset from a wall via standoff members. Adjacent display panels attach to...
2016/0192512 DISPLAY
A display which thickness is allowed to be reduced is provided. A display includes: a display panel; and a back-face member having rigidity and provided on a...
2016/0192511 IMAGE DISPLAY APPARATUS
Provided is an image display apparatus. The image display apparatus includes a display panel displaying an image through a display area, a plurality of...
2016/0192510 INJECTION-MOLDED CASE FOR ELECTRONIC COMMUNICATION PRODUCTS
The present utility model provides a twice injection-molded frame structure for electronic communication products, which comprises a metal housing connected by...
2016/0192509 Modular Casings
A modular casing for electronic equipment comprises edge portions and corner portions. Each corner portion is interlocked with adjacent edge portions to form a...
2016/0192508 FORMATION OF DIELECTRIC WITH SMOOTH SURFACE
Embodiments of the present disclosure are directed towards techniques and configurations for formation of a dielectric with a smooth surface. In one...
2016/0192507 ELECTRODEPOSITED CONTACT TERMINAL FOR USE AS AN ELECTRICAL CONNECTOR OR SEMICONDUCTOR PACKAGING SUBSTRATE
An electrical connectors with electrodeposited terminals that are grown in place by electroplating cavities formed in a series of resist layers. The resist...
2016/0192506 BACK-DRILLING METHOD FOR A PIN-IN-HOLE PCB COMPONENT PROCESS, AND A PCB ASSEMBLY PRODUCED THEREBY
An approach for through-hole component soldering for a PCB, and a resulting PCB assembly, that eliminates protruding solder joints, is provided. The approach...
2016/0192505 THIN FAN, ELECTRONIC SYSTEM AND MANUFACTURING METHOD OF THIN FAN
A manufacturing method of the thin fan includes the steps of: providing a plastic material containing a plurality of metal particles; processing the plastic...
2016/0192504 SINGLE MOLECULE DETECTION
Disclosed herein is a method comprising patterning a second electrode of each of a plurality of electrode pairs onto a substrate; patterning a strip of a...
2016/0192503 METHOD FOR PRODUCING CERAMIC CIRCUIT BOARD
A method for producing a ceramic circuit board comprising the steps of bonding a metal sheet to a ceramic substrate via a brazing material containing Ag to...
2016/0192502 GERMANIUM OXIDE PRE-CLEAN MODULE AND PROCESS
In some embodiments, a method for integrated circuit fabrication includes removing oxide material from a surface of a substrate, where the surface includes...
2016/0192501 METHOD OF MANUFACTURING A FLEXIBLE AND/OR STRETCHABLE ELECTRONIC DEVICE
A method of manufacturing a flexible electronic device is provided. The method includes a) filtering a mixture including an electrically conducting...
2016/0192500 Electronic Devices and Methods of Manufacturing Electronic Devices
Disclosed are a foldable and spreadable electronic device and a method of manufacturing the electronic device. The electronic device may include a flexible...
2016/0192499 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
A manufacturing method of an electronic device includes the following steps. A circuit board and at least one electronic component are provided, wherein the...
2016/0192498 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT
A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board,...
2016/0192497 ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF
An electronic component module including a first board; a plurality of first electronic components disposed on a first surface of the first board; a second...
2016/0192496 CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND METHODS OF FABRICATING SAME
A contact pad includes a solder-wettable porous network (310) which wicks the molten solder (130) and thus restricts the lateral spread of the solder, thus...
2016/0192495 SEMICONDUCTOR DEVICE
A semiconductor device including: a plurality of semiconductor units each constituting a three-level inverter circuit; and a connection unit electrically...
2016/0192494 Electrical contact arrangement for an electric motor and method for producing the same
Electrical contact arrangement for an electric motor and method for producing same. The present invention relates to an electrical contact arrangement for an...
2016/0192493 Circuit board assembly, control device for a cooler fan module and method
The present invention relates to a circuit board assembly, comprising a circuit board which has a first and a second solder region, which is galvanically...
2016/0192492 CIRCUIT MODULE SYSTEM
A circuit module system includes a first and a second circuit module, the first circuit module includes a first circuit board and a first connecting housing,...
2016/0192491 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper...
2016/0192490 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin...
2016/0192489 POWER SUPPLY BOARD
A power supply board includes: a first board including a top surface on which a processor is capable of being mounted, a bottom surface located on an opposite...
2016/0192488 CIRCUIT BOARD, MULTILAYERED SUBSTRATE HAVING THE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE CIRCUIT BOARD
Disclosed is a circuit board that includes a core portion having a first via disposed therein in the general shape of an hourglass. The circuit board...
2016/0192487 Via Transition and Method of Fabricating the Same
The present disclosure provides a via transition, comprising: two end segments; high-impedance segments and low-impedance segments. The high-impedance segments...
2016/0192486 CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
A circuit board disclosed herein includes: two substrates opposed to each other, where a dielectric being interposed between the two substrates; a through hole...
2016/0192485 ELECTRONIC ENTITY WITH COUPLING INTEGRATED BETWEEN A MICROCIRCUIT AND AN ANTENNA AND METHOD OF FABRICATION
An electronic entity includes a module formed of a support film carrying, on an internal face, a microcircuit and a first coupling coil, and a body including a...
2016/0192484 NANOTUBE DISPERSANTS AND DISPERSANT FREE NANOTUBE FILMS THEREFROM
A degradable polymeric nanotube (NT) dispersant comprises a multiplicity of NT associative groups that are connected to a polymer backbone by a linking group...
2016/0192483 TRANSPARENT ELECTRODES AND ELECTRONIC DEVICES INCLUDING THE SAME
A transparent electrode includes: a substrate; an electrically conductive layer disposed on the substrate and including a plurality of nano-sized conductors;...
2016/0192482 PATTERNED CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME
A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble...
2016/0192481 IMPLEMENTING CONFORMAL COATING COMPOSITION FOR HIGH CURRENT CIRCUIT APPLICATIONS
A method and structure are provided for implementing a conformal coating composition for high current applications. A copper particulate filler material layer...
2016/0192480 ELECTRONIC DEVICE INCLUDING TRANSPARENT AND FLEXIBLE MICA SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
An electronic device including a transparent and flexible mica substrate and a method of manufacturing the electronic device are provided, in which the method...
2016/0192479 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT
A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board,...
2016/0192478 FLEXIBLE ELECTRONIC DEVICE
According to embodiments of the disclosure, a flexible electronic device is provided. The flexible electronic device includes a flexible substrate, at least...
2016/0192477 Conductive Transparent Substrate Manufacturing Method, and Conductive Transparent Substrate
Provided herein is a method for manufacturing a conductive transparent substrate, the method including forming a plurality of main electrodes on the substrate...
2016/0192476 WARPAGE-PREVENTING STRUCTURE OF SUBSTRATE
The present invention relates to a warpage-preventing structure for reducing the warpage of the substrate itself, the warpage which results from the difference...
2016/0192475 WIRING BOARD
The wiring board in the present invention includes: an insulating board; external connection pads for a differential signal and external connection pads for...
2016/0192474 MULTILAYER STRUCTURE FOR ACCOMMODATING ELECTRONICS AND RELATED METHOD OF MANUFACTURE
Multilayer structure (200) for electronic devices, including a flexible substrate film (102) for accommodating electronics, a number of electrical elements...
2016/0192473 CIRCUIT BOARD
A circuit board includes a first insulating layer having an upper surface on which mounting regions of electronic components and wiring patterns are provided,...
2016/0192472 DEVICE AND METHOD FOR DETERMINING THE TEMPERATURE OF A HEAT SINK
A method for determining the temperature of a heat source and an electronic unit, including a printed-circuit board equipped with a sensor and a heat sink, the...
2016/0192471 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
A circuit board and a method of manufacturing the same are disclosed. The circuit board includes an insulating part, a thermally conductive structure...
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