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Patent # Description
2016/0190120 FIN RESISTOR WITH OVERLYING GATE STRUCTURE
A resistor device includes a resistor body doped with a first type of dopant, an insulating layer disposed above the resistor body, and at least one gate...
2016/0190119 DISPLAY PANEL INCLUDING STATIC ELECTRICITY PREVENTING PATTERN AND DISPLAY DEVICE HAVING THE SAME
The present invention relates to a display panel including a static electricity preventing pattern and a display device having the same. An aspect of the...
2016/0190118 POWER SWITCH DEVICE
A power switch device includes a transistor and an ESD protection circuit. The transistor includes a source, a drain, and a gate, wherein a well region is...
2016/0190117 Slim bezel and display having the same
A bezel of a display includes source lines with a same length, gate in panel (GIP) lines, and at least two customized integrated circuit (IC) chips arranged...
2016/0190116 PHOTOMASK AND SEMICONDUCTOR STRUCTURE
Provided is a semiconductor structure. The semiconductor structure is formed on a substrate, and includes a first region and a second region surrounded by the...
2016/0190115 Method of Manufacturing Semiconductor Device
Reliability of a semiconductor device is improved. A method of manufacturing the semiconductor device includes a step of cutting a tab suspension lead from a...
2016/0190114 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor device comprises a substrate, a patterned conductive layer, a first transistor structure and a second transistor structure. The patterned...
2016/0190113 PASSIVE COMPONENTS IN VIAS IN A STACKED INTEGRATED CIRCUIT PACKAGE
Integrated passive component in a stacked integrated circuit package are described. In one embodiment an apparatus has a substrate, a first die coupled to the...
2016/0190112 CARRIER ARRAY AND LIGHT EMITTING DIODE PACKAGE
A carrier array adapted for carrying a plurality of chips is provided. The carrier array includes a lead frame, controllers and first packages. The lead frame...
2016/0190111 LIGHT EMITTING DEVICE
A light emitting device includes: at least one first light emitting element configured to emit ultraviolet light; at least one second light emitting element...
2016/0190110 Method for Producing an Optoelectronic Semiconductor Chip
A method for producing an optoelectronic semiconductor chip is disclosed. A semiconductor body has a pixel area, which has at least two different subpixel...
2016/0190109 STACK SEMICONDUCTOR PACKAGE
A stack semiconductor package includes a first semiconductor package having a first package substrate and a first semiconductor chip mounted on the first...
2016/0190108 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Disclosed herein is a semiconductor package in which a semiconductor chip and a mounting device are packaged together. The semiconductor package includes a...
2016/0190107 CHIP PACKAGE-IN-PACKAGE
An electronic package includes an interposer, a die attached to a first side of the interposer, an embedded electronic package attached to a second side of the...
2016/0190106 LIGHT EMITTING DEVICE
A light emitting device, includes: three light emitting elements with different emission colors; and a package including a plurality of lead frames to...
2016/0190105 DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE
A display device according to an embodiment of the present disclosure may include a lower substrate disposed with a line electrode at an upper portion thereof,...
2016/0190104 METHODS OF FORMING 3-D INTEGRATED SEMICONDUCTOR DEVICES HAVING INTERMEDIATE HEAT SPREADING CAPABILITIES
In a method of forming a three-dimensional semiconductor device, a first chip is provided that includes a first substrate, a first device layer positioned on...
2016/0190103 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
A semiconductor devise includes a first substrate and a second substrate which are bonded each other. A first substrate includes an insulating first surface...
2016/0190102 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The ...
2016/0190101 FUNCTIONAL BLOCK STACKED 3DIC AND METHOD OF MAKING SAME
An embodiment device package includes a fan-out redistribution layer (RDL), a device over and bonded to the fan-out RDL, and a molding compound over the...
2016/0190100 STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS IN ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATE
A microelectronic assembly can include a circuit panel having first and second panel contacts at respective first and second surfaces thereof, and first and...
2016/0190099 PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
The present invention provides a package structure and fabrication method thereof. The method includes providing a first carrier having a metal layer; forming...
2016/0190098 Devices and Methods of Packaging Semiconductor Devices
Devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a device includes a first semiconductor device and a second...
2016/0190097 SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Embodiments of the present disclosure provide a semiconductor device, a semiconductor package, and a method for manufacturing a semiconductor device. The...
2016/0190096 Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device...
2016/0190095 SEMICONDUCTOR PACKAGES AND RELATED METHODS
Methods of forming a semiconductor package. Implementations include providing a leadframe, coupling a semiconductor die or an electronic component to the...
2016/0190094 ADHESIVE FOR ELECTRONIC COMPONENT
An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from...
2016/0190093 THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
A method may include the steps of directly bonding a semiconductor device having a substrate to an element; and removing a portion of the substrate to expose a...
2016/0190092 METHOD FOR APPLYING A BONDING LAYER
A method for applying a bonding layer that is comprised of a basic layer and a protective layer on a substrate with the following method steps: application of...
2016/0190091 LASER ASSISTED TRANSFER WELDING PROCESS
A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target...
2016/0190090 Bump-on-Trace Interconnect
Disclosed herein is a bump-on-trace interconnect with a wetted trace sidewall and a method for fabricating the same. A first substrate having conductive bump...
2016/0190089 Wafer to Wafer Bonding Process and Structures
Bonded structures and method of forming the same are provided. A conductive layer is formed on a first surface of a bonded structure, the bonded structure...
2016/0190088 Die Bonder and Methods of Using the Same
A method includes bringing into contact respective first sides of a plurality of dies and a die attach film on a major surface of a carrier wafer, and...
2016/0190087 CHIP-STACKING APPARATUS
A chip-stacking apparatus for stacking a chip on a substrate is provided. The chip-stacking apparatus includes a substrate support configured to carry the...
2016/0190086 PACKAGED SEMICONDUCTOR DEVICES HAVING RIBBON WIRES
A packaged semiconductor device, such as a power QFN device, has (rectangular) ribbon wires, instead of circular bond wires. A proximal end of each ribbon wire...
2016/0190085 MANUFACTURING METHOD OF SEMICONDUCTOR MODULE
A manufacturing method of a semiconductor module, includes: forming a Ni plating layer on a surface of a first lead frame; forming a Au plating layer on a...
2016/0190084 METHOD FOR PRODUCING AN INTEGRATED CIRCUIT PACKAGE AND APPARATUS PRODUCED THEREBY
A processor-implemented method and integrated circuit package are provided. According to an implementation, a method of producing a chip package includes...
2016/0190083 FLIP CHIP SCHEME AND METHOD OF FORMING FLIP CHIP SCHEME
The present invention provides a flip chip scheme and a method of forming the flip chip scheme. The flip chip scheme comprises: a plurality of bumps, some of...
2016/0190082 CONTACT AREA DESIGN FOR SOLDER BONDING
A package component includes a dielectric layer and a metal pad over the dielectric layer. A plurality of openings is disposed in the metal pad. The first...
2016/0190081 DISPLAY DEVICE AND ARRAY SUBSTRATE FOR DISPLAY DEVICE
An array substrate for a display device can include a substrate, a pad positioned on the substrate, an insulating layer positioned on the pad and including a...
2016/0190080 SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
The present invention provides a semiconductor structure and a method of fabricating the same. The method includes: providing a chip having conductive pads,...
2016/0190079 SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE HAVING THE SAME
The present disclosure relates to a semiconductor package structure including a semiconductor substrate, a semiconductor chip and a conductive material. The...
2016/0190078 INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION AND METHOD OF MANUFACTURE THEREOF
A method of manufacture of an integrated circuit system includes: providing a semiconductor wafer with a bond pad; attaching a detachable carrier to the...
2016/0190077 SEMICONDUCTOR STRUCTURE WITH UBM LAYER AND METHOD OF FABRICATING THE SAME
A semiconductor structure with an under bump metallization (UBM) layer is provided. The semiconductor structure at least includes a substrate, a metal pad...
2016/0190076 CHIP PART
A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which...
2016/0190075 HIGH FREQUENCY INTEGRATED CIRCUIT AND PACKAGING FOR SAME
An integrated circuit can include a group of bond pads alternating between bond pads configured to provide a return path and bond pads configured to provide a...
2016/0190074 FUSE PACKAGE AND LIGHT EMITTING DEVICE MODULE USING THE SAME
A fuse package may include a first lead frame, a second lead frame spaced apart from the first lead frame, a package body configured to cover at least a...
2016/0190073 STRESS RELIEF STRUCTURES IN PACKAGE ASSEMBLIES
A semiconductor package structure includes a substrate; and a die region having a plurality of dies disposed on the substrate. A first die of the plurality of...
2016/0190072 STACKED SEMICONDUCTOR PACKAGES WITH CANTILEVER PADS
One or more embodiments are directed to semiconductor packages, including stacked packages, with one or more cantilever pads. In one embodiment a recess is...
2016/0190071 INTEGRATED CIRCUIT BONDING WITH INTERPOSER DIE
A method of bonding components is disclosed. One embodiment of such a method includes applying both heat and pressure to a stack of components that includes an...
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