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METHODS OF FORMING BURIED VERTICAL CAPACITORS AND STRUCTURES FORMED
Methods of forming passive elements under a device layer are described. Those methods and structures may include forming at least one passive structure, such...
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
A semiconductor device includes an interlayer insulating film formed on a substrate and including a trench, a gate insulating film formed in the trench, a work...
CMOS TRANSISTOR, SEMICONDUCTOR DEVICE INCLUDING THE TRANSISTOR, AND
SEMICONDUCTOR MODULE INCLUDING THE DEVICE
Provided are a CMOS transistor, a semiconductor device having the transistor, and a semiconductor module having the device. The CMOS transistor may include...
SEMICONDUCTOR INTERGRATED CIRCUIT AND LOGIC CIRCUIT
Disclosed herein is a driver circuit including first and second n-channel transistors connected together in series between first and second nodes. The first...
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a fin which comprises long sides and a first short...
METHOD AND DEVICE FOR A FINFET
A method of forming a semiconductor device includes providing a semiconductor substrate. The semiconductor substrate includes a plurality of fins formed...
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES
A semiconductor integrated circuit device may include a standard cell region on a surface of a substrate and a first active region on the surface of the...
SEMICONDUCTOR DEVICE STRUCTURE
A semiconductor device structure having at least one thin-film resistor structure is provided. Through the metal plug(s) or metal wirings located on different...
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE
A three-dimensional (3D) semiconductor device is provided, comprising a substrate having a staircase region comprising N steps, wherein N is an integer one or...
HIGH CURRENT, LOW SWITCHING LOSS SiC POWER MODULE
A power module includes a housing with an interior chamber and multiple switch modules mounted within the interior chamber of the housing. The switch modules...
SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF
The present disclosure provides a semiconductor device and formation method thereof. A shallow trench isolation structure is formed in a semiconductor...
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Performance of a semiconductor device is improved without increasing an area size of a semiconductor chip. For example, a source electrode of a power...
GATE DIELECTRIC PROTECTION FOR TRANSISTORS
At least one method, apparatus and system disclosed herein involves forming a device comprising a transistor comprising an active gate and at least one...
Semiconductor Device Having Overload Current Carrying Capability
A semiconductor device includes a semiconductor region having charge carriers of a first conductivity type, a transistor cell in the semiconductor region, and...
LOW LEAKAGE BIDIRECTIONAL CLAMPS AND METHODS OF FORMING THE SAME
Low leakage bidirectional clamps and methods of forming the same are provided. In certain configurations, a bidirectional clamp includes a first p-well region,...
A first impurity diffusion region is provided within a semiconductor substrate, a second impurity diffusion region is provided within the first impurity...
A display panel including a plurality of sub-pixel groups arranged repeatedly to form a pixel array. Each of the sub-pixel groups includes a plurality of first...
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
A fabrication method of a semiconductor package is disclosed, which includes the steps of: disposing a plurality of first semiconductor elements on an...
The semiconductor device 100 comprises a first semiconductor element 113 provided on a face on one side of a flat plate shaped interconnect component 101, an...
INVERTED OPTICAL DEVICE
Inverted optical device. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The...
LED Packaging Structure
A light emitting diode (LED) packaging structure including a metal pad, an electric static discharge (ESD) protection element and an LED chip is provided. The...
PACKAGE WITH LOW STRESS REGION FOR AN ELECTRONIC COMPONENT
A device package includes a substrate having an active surface. Electrical connection bumps are deposited on the active surface and are arranged in an array...
THREE DIMENSIONAL INTEGRATED CIRCUIT
A method comprises providing a first substrate having dielectric structures and conductive structures. Ions are implanted into the first substrate, the ions...
LIGHT-EMITTING ASSEMBLIES COMPRISING AN ARRAY OF LIGHT-EMITTING DIODES
HAVING AN OPTIMIZED LENS CONFIGURATION
Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a...
METHODS OF MANUFACTURING WIDE BAND GAP SEMICONDUCTOR DEVICE AND
SEMICONDUCTOR MODULE, AND WIDE BAND GAP...
A method of manufacturing a wide band gap semiconductor device includes the steps of preparing a wide band gap semiconductor substrate, separating the wide...
SEMICONDUCTOR SYSTEM, DEVICE AND STRUCTURE
An Integrated Circuit device, including: a base wafer including single crystal, the base wafer including a plurality of first transistors; at least one metal...
FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)
Methods for forming a semiconductor device structure are provided. The method includes providing a first semiconductor wafer and a second semiconductor wafer....
Integrated Semiconductor Device And Wafer Level Method Of Fabricating The
The present disclosure provides one embodiment of a stacked semiconductor device. The stacked semiconductor device includes a first substrate; a first bond pad...
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
In a semiconductor device formed by mounting a chip laminate including a semiconductor chip having a small diameter and a semiconductor chip having a large...
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
The present invention provides a semiconductor device with an improved yield ratio and reduced height and manufacturing cost; and a method of manufacturing the...
SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME
A semiconductor package comprising: a semiconductor chip; a connection pillar that is disposed adjacent to the semiconductor chip; a first heat dissipation...
Methods and Apparatus of Packaging with Interposers
Methods and apparatus for forming a semiconductor device package on an interposer using a micro-bump layer are disclosed. The micro-bump layer may comprise...
BONDING PROCESS USING TEMPERATURE CONTROLLED CURVATURE CHANGE
A first substrate including a radius of curvature and a stressor layer is first provided. An outermost bowed, e.g., curved, surface of the first substrate is...
METHOD FOR MANUFACTURING ELECTRONIC DEVICE BY USING FLIP-CHIP BONDING
An electronic device is manufactured by providing a substrate on which a pad including an organic solderability preservative (OSP) film is formed, mounting a...
Integrated Circuit Structure Having Dies with Connectors
An embodiment is an integrated circuit structure including a first die having a bump structure, and a second die having a pad structure. The first die is...
Semiconductor chip and method of processing a semiconductor chip
Various embodiments provide a semiconductor chip, wherein the semiconductor chip comprises a first contact area and a second contact area both formed at a...
DICING METHOD FOR POWER TRANSISTORS
Some embodiments relate to a method of dicing a semiconductor wafer. The semiconductor wafer that includes a device structure that is formed within a device...
Semiconductor Package and Method of Manufacturing the Same
A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and...
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD FOR SAME
According to the embodiments, a semiconductor device includes a substrate, a plurality of insulating layers, a lower shield plate, a semiconductor device, an...
SEMICONDUCTOR DIE AND DIE CUTTING METHOD
The present disclosure provides die cutting methods and semiconductor dies. A semiconductor substrate has a test region, isolation regions, and core regions. A...
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A method for manufacturing a semiconductor device is provided. The method comprises the steps of: providing a transparent substrate having a visible region and...
SEMICONDUCTOR DEVICE WITH REDUCED VIA RESISTANCE
A semiconductor interconnect structure that has a first portion included in an upper interconnect level and a second portion included in a lower interconnect...
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
A method includes forming a multilayered film including a conductive layer mainly containing aluminum, and a barrier metal layer formed thereon, forming a hard...
ELECTRONIC PACKAGE AND METHOD OF CONNECTING A FIRST DIE TO A SECOND DIE TO
FORM AN ELECTRONIC PACKAGE
Some embodiments relate to an electronic package. The electronic package includes a substrate that includes a plurality of buildup layers. A first die is...
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
The present disclosure provides a semiconductor device and fabrication method thereof. A dielectric layer is formed on a first surface of a semiconductor...
INTEGRATED CIRCUITS WITH ELECTRONIC FUSE STRUCTURES
Integrated circuits including electronic fuse structures are disclosed. In some examples, the electronic fuse structure includes a fuse part and first and...
SIZE-FILTERED MULTIMETAL STRUCTURES
A size-filtered metal interconnect structure allows formation of metal structures having different compositions. Trenches having different widths are formed in...
DIELECTRIC THIN FILM ELEMENT, ANTIFUSE ELEMENT, AND METHOD OF PRODUCING
DIELECTRIC THIN FILM ELEMENT
A dielectric thin film element having a high humidity resistance is provided. A dielectric thin film element includes a capacitance section having a dielectric...
TANK CIRCUIT STRUCTURE AND METHOD OF MAKING THE SAME
A tank circuit structure includes a first gate layer, a first substrate, a first shielding layer, a first conductive line and a first inter metal dielectric...
CHIP PACKAGE AND FABRICATION METHOD THEREOF
A chip package including a chip, a first though hole, a conductive structure, a first isolation layer, a second though hole and a first conductive layer. The...