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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor device includes a substrate, and a nitride semiconductor layer provided on the substrate. An opening is provided through the nitride...
System, Method and Apparatus to Relieve Stresses in a Semiconductor Wafer
Caused by Uneven Internal...
Systems and methods for forming semiconductor wafers with wafer support structures includes: multiple semiconductor devices formed in multiple semiconductor...
System, Method and Apparatus to Relieve Stresses in a Semiconductor Die
Caused by Uneven Internal Metallization...
A system, method and apparatus for making a semiconductor die includes forming multiple semiconductor devices in a respective portion of a semiconductor wafer....
SEMICONDUCTOR PACKAGES HAVING WIRE BOND WALL TO REDUCE COUPLING
A device (e.g., a Doherty amplifier) housed in an air cavity package includes one or more isolation structures over a surface of a substrate and defining an...
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A selectively shielded and/or three-dimensional semiconductor device and a method of manufacturing thereof. For example and without limitation, various aspects...
INDUCTOR SHIELDING STRUCTURE, INTEGRATED CIRCUIT INCLUDING THE SAME AND
METHOD OF FORMING THE INTEGRATED CIRCUIT
An inductor shielding structure includes a first conductive layer including a plurality of first conductive lines having a first width and a plurality of...
SEMICONDUCTOR DEVICE WITH AT LEAST ONE TRUNCATED CORNER AND/OR SIDE
A method of producing a substantially rectangular semiconductor device having at least one corner truncation or corner cut-out or side cut-out, comprises: a)...
PROCESS SUBSTRATE WITH CRYSTAL ORIENTATION MARK, METHOD OF DETECTING
CRYSTAL ORIENTATION, AND READING DEVICE OF...
To provide a crystal orientation mark which can be formed easily and inexpensively, and which enables to perform high precision alignment and allows...
SHEET FOR SEALING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING
SAID SHEET FOR SEALING
Provided is a thermosetting sheet for sealing which is used to seal an electronic device. One surface of the sheet has a surface roughness (Ra) of 3 .mu.m or...
INTEGRATED CIRCUIT DEVICES AND METHODS
An integrated circuit device includes a first metal layer including aluminum. The integrated circuit device includes a second metal layer including an...
Semiconductor devices are provided. The semiconductor devices may include a first interconnection structure and a second interconnection structure which are...
POWER AMPLIFIER PACKAGE AND METHOD THEREOF
A device is provided, which includes a wiring structure including a first surface and a second surface opposite the first surface. The device also includes a...
INTEGRATED CIRCUIT HAVING SLOT VIA AND METHOD OF FORMING THE SAME
An integrated circuit includes a first conductive line on a first metal level of the integrated circuit. The integrated circuit further includes a second...
FISHBONE STRUCTURE ENHANCING SPACING WITH ADJACENT CONDUCTIVE LINE IN
In some embodiments, a fishbone structure in a power network includes a first conductive segment in a first conductive layer running in a first direction, a...
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device is provided. The semiconductor device includes a first porous interlayer insulating film having a low dielectric constant and including...
FLEXIBLE DISPLAY AND METHOD OF MANUFACTURING THE SAME
A flexible display and method of manufacturing the same are disclosed. In one aspect, the display includes a flexible substrate having a bending area and a...
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
A semiconductor structure and a method for fabricating the semiconductor structure are provided. The semiconductor structure includes a substrate, a plurality...
ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHOD OF
An interconnect assembly for an embedded chip package includes a dielectric layer, first metal layer comprising upper contact pads, second metal layer...
SEMICONDUCTOR ASSEMBLY HAVING WIRING BOARD WITH ELECTRICAL ISOLATOR AND
MOISTURE INHIBITING CAP INCORPORATED...
A method of making a wiring board is characterized by the provision of moisture inhibiting caps covering interfaces between an electrical isolator/optional...
MULTILAYER STRUCTURE FOR A SEMICONDUCTOR DEVICE AND A METHOD OF FORMING A
MULTILAYER STRUCTURE FOR A...
A multilayer structure for a semiconductor device and a method of forming a multilayer structure for a semiconductor device. The multilayer structure...
MOUNTING SUBSTRATE WAFER, MULTILAYER CERAMIC SUBSTRATE, MOUNTING
SUBSTRATE, CHIP MODULE, AND MOUNTING SUBSTRATE...
A wafer for mounting substrates according to the present disclosure includes a multilayer ceramic substrate including top face electrodes, bottom face...
An electronic package is provided. The electronic package includes an insulator having a recessed portion formed therein; an electronic element embedded in the...
ISOLATION METHOD FOR A STAND ALONE HIGH VOLTAGE LATERALLY-DIFFUSED
METAL-OXIDE SEMICONDUCTOR (LDMOS) TRANSISTOR
A semiconductor package having a lead frame over which a first device and a second device are spaced is provided. The lead frame includes a die pad upon which...
A miniaturized semiconductor device includes a frame body having an opening region formed in a central portion, an insulating substrate which is provided in...
MANUFACTURING AND EVALUATION METHOD OF A SEMICONDUCTOR DEVICE
Provided is a method of manufacturing a semiconductor device which includes a semiconductor chip, an insulating board mounted with the semiconductor chip and...
One embodiment provides a semiconductor device having a first chip for lowering an input voltage and a second chip for performing signal processing, mounted on...
LEAD FRAME, ELECTRONIC CONTROL DEVICE USING LEAD FRAME, AND LEAD-FRAME
Conventional lead frames could neither be self-supporting nor be picked up by an automatic mounter through suction and mounted on a circuit board. Lead frame...
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
The present invention provides a semiconductor device and a method for manufacturing a semiconductor device. The method comprises: Preparing a semiconductor...
LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY
Consistent with an example embodiment, there is surface-mountable non-leaded chip carrier for a semiconductor device. The device comprises a first contact. A...
METHOD OF PRODUCING A SEMICONDUCTOR PACKAGE
A method of manufacturing a lead frame includes providing an electrically conductive layer having a plurality of holes at a top surface. The plurality of holes...
ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME
In a method for producing an electronic part mounting substrate wherein an electronic part 14 is mounted on one major surface (a surface to which the...
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
A semiconductor package structure and method for forming the same are provided. The semiconductor package structure includes a substrate and the substrate has...
A stacked cooler includes flow pipes that are stacked, each of the flow pipes having a flat shape and including a medium passage in which a heat medium flows,...
A cooler includes a cooling pipe having a cooling surface in contact with a heat-exchanged component, and a refrigerant passage. A pair of outer passages are...
HEAT SINK ASSEMBLY WITH FRAME CLIP FOR FULLY ASSEMBLED ATTACHMENT TO HEAT
An assembly for engaging a heat sink with an electrical component heat source includes a first retaining device with a frame that defines an opening to receive...
DUAL-SIDED DIE PACKAGES
An apparatus including a die, a first side of the die including a first type of system level contact points and a second side including a second type of...
Chip carrier laminate with high frequency dielectric and thermomechanical
A chip carrier for carrying an encapsulated electronic chip, wherein the chip carrier comprises a laminate structure formed as a stack of a plurality of...
SEMICONDUCTOR PACKAGES, METHODS OF MANUFACTURING THE SAME, ELECTRONIC
SYSTEMS INCLUDING THE SAME, AND MEMORY...
A semiconductor package includes an adhesive member disposed on a package substrate to have a trapezoid cross-section view, and a semiconductor chip disposed...
MONITORING SEMICONDUCTOR DEVICE, METHOD FOR PERFORMING DEEP N-TYPED
WELL-CORRELATED (DNW-CORRELATED) ANTENNA...
A semiconductor monitoring device includes a substrate, a die seal ring formed on the substrate, a deep n-typed well formed in the substrate under the die seal...
PLASMA PROCESSING APPARATUS
A processing apparatus and a processing method for a semiconductor wafer, which allow stable end point detection, are provided. In the plasma processing...
SUBSTRATE-SCALE MASK ALIGNMENT
Methods and systems for alignment of substrate-scale masks are described. The alignment methods presented may improve the uniformity and repeatability of...
METHOD FOR MAKING A THREE DIMENSIONAL INTEGRATED ELECTRONIC CIRCUIT
A method for making a three-dimensional integrated electronic circuit comprising steps for: making a first electrically conductive portion on a first...
SEMICONDUCTOR DEVICE WITH METAL GATE AND HIGH-K DIELECTRIC LAYER, CMOS
INTEGRATED CIRCUIT, AND METHOD FOR...
A semiconductor device includes a gate dielectric layer over a substrate, a metal layer over the gate dielectric layer, a capping layer over the metal layer,...
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
A semiconductor device including: a first conductivity type transistor and a second conductivity type transistor, wherein each of the first conductivity type...
TRANSISTOR STRUCTURE AND FABRICATION METHODS WITH AN EPITAXIAL LAYER OVER
MULTIPLE HALO IMPLANTS
A method of forming a transistor can include forming a gate mask on a substrate having a vertical location aligned with that of a transistor control gate;...
SEMICONDUCTOR PIECE MANUFACTURING METHOD
A semiconductor piece manufacturing method includes: a process of forming a fine groove on a front surface side including a first groove portion having a width...
METHOD OF PROCESSING A SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR CHIP
A method of processing a semiconductor substrate is provided. The method may include forming a film over a first side of a semiconductor substrate, forming at...
METHOD OF DICING A WAFER AND SEMICONDUCTOR CHIP
A method of dicing a wafer may include forming a plurality of active regions in a wafer, each active region including at least one electronic component, the...
METHOD OF MANUFACTURING THIN-FILM TRANSISTOR
According to one embodiment, a method of manufacturing a thin-film transistor includes forming a semiconductor layer on a gate electrode with an insulating...
METHOD FOR FORMING INTEGRATED CIRCUIT STRUCTURE WITH THINNED CONTACT
Methods for forming integrated circuit structures are provided. The method includes providing a substrate including a first diffusion region, a second...