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Patent # Description
2016/0219729 MODULAR ENCLOSURE AND CONSTRUCTION METHOD
A modular enclosure configurable to achieve one of a plurality of environmental ratings is disclosed. The modular enclosure includes a base having a...
2016/0219728 METHOD AND APPARATUS FOR PROVIDING INTERCHANGEABLE MODULES SUCH AS A POWER OUTLET MODULE
The present principles generally relate to an apparatus and a method for providing an interchangeable module, such as e.g., an AC power outlet. In one...
2016/0219727 Adaptable Mobile Device Stand
An adaptable mobile device stand is provided that includes (1) a moldable fill material that retains shape once molded, and (2) a bladder for enclosing the...
2016/0219726 DISPLAY APPARATUS
A display apparatus including: a display panel; and a chassis structure which holds the display panel, wherein the chassis structure includes a first chassis...
2016/0219725 STRUCTURE AND ELECTRONIC APPARATUS
A structure includes: a first component having a band-like shape and an elasticity for bending the first component in a first direction such that both ends of...
2016/0219724 Functional Module with a Housing
The invention relates to a functional module with a housing. The housing is comprised of a holder for a submodule. The submodule can be mounted in the holder...
2016/0219723 DISPLAY APPARATUS AND METHOD FOR MANUFACTURING THE SAME
A display apparatus includes a display panel, a panel adhesive film on the display panel, a main printed circuit board, and a flexible printed circuit board....
2016/0219722 SYSTEMS AND METHODS FOR PATTERNING COMPOSITE MATERIALS AND FABRICATING ILLUMINATION SYSTEMS
In accordance with certain embodiments, patterns are formed in composite materials by selectively urging one or more regions of the composite material toward...
2016/0219721 METHOD FOR MANUFACTURING SOLDER CIRCUIT BOARD, SOLDER CIRCUIT BOARD, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
A method for manufacturing a solder circuit board, the method including performing, in sequence, a resist formation step of partially coating a conductive...
2016/0219720 Diffusion Soldering Method Using The Formation Of A Diffusion Zone As A Solder Connection, And Electronic...
A diffusion soldering method for joining an electronic component to a substrate is provided. The joining surfaces are designed such that cavities are formed in...
2016/0219719 METHOD OF TRIMMING A COMPONENT AND A COMPONENT TRIMMED BY SUCH A METHOD
A method of trimming a component is provided in which the component is protected from oxidation or changes in stress after trimming. As part of the method, a...
2016/0219718 METHODS FOR PROVIDING ELECTRICALLY-CONDUCTIVE ARTICLES
A method is used to provide an electrically-conductive article. This method includes: forming an electrically-conductive pattern on first supporting side of a...
2016/0219717 METHOD FOR FORMING A PATTERNED FILM, METHOD FOR MANUFACTURING OPTICAL COMPONENT, METHOD FOR MANUFACTURING...
A method is provided which allows the alignment marks of a mold and a substrate to be accurately and simply detected, and accordingly provides a method for...
2016/0219716 PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME AND CONNECTION TERMINAL
A read wiring trace and a write wiring trace are formed on an insulating layer. Connection terminals made of conductor are connected to the read wiring trace...
2016/0219715 SUBSTRATE VIA FILLING
A method for filling vias with metal includes receiving a substrate having vias, forming a metal plating layer over the vias on a first side of the substrate,...
2016/0219714 CHIP PACKAGE, PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
A package substrate is provided. The package substrate includes: a dielectric layer; a passive component embedded in the dielectric layer and contacting the...
2016/0219713 ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
An electronic component embedded printed circuit board and method thereof a first insulation layer, an electronic component, a second insulation layer, and a...
2016/0219712 PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
A printed circuit board including an electronic component and a method of producing the same are provided. The printed circuit board includes a multilayered...
2016/0219711 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
There are provided a printed circuit board and a method to manufacture the same. The printed circuit board includes a core board including an insulating layer...
2016/0219710 ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
A printed circuit board and method thereof include an electronic component embedded in an insulation layer and comprising a connection terminal exposed on a...
2016/0219709 EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME
Disclosed is an embedded board and a method of manufacturing the same. The embedded board may include an insulating layer a first circuit layer formed inside...
2016/0219708 LIGHT SOURCE UNIT
Provided is a light source unit including a base unit formed on a front surface thereof with a first circuit pattern by irradiating laser light to a resin...
2016/0219707 MODULE AND METHOD FOR MANUFACTURING THE MODULE
A module includes a first substrate including first electrodes; a first element bonded to the first substrate, and including second electrodes disposed at a...
2016/0219706 DISPLAY DEVICE
A display device including a flexible substrate that includes a display part to display an image; a driving integrated chip (IC) that supplies a driving...
2016/0219705 Power Semiconductor Module Arrangement
A power semiconductor module arrangement includes a semiconductor module having a controllable power semiconductor component, a first printed circuit board...
2016/0219704 HERMETICALLY SEALED THROUGH VIAS (TVS)
Hermetically sealed through vias (TVs) are disclosed. In one aspect, an hourglass TV is first created in a substrate. The hourglass TV has a waist opening. A...
2016/0219703 Hole plug for thin laminate
A method for forming a hole plug in a laminate structure is provided. A laminate structure, is formed, including at least a dielectric layer and a first...
2016/0219702 SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor...
2016/0219701 Magnetically Enhanced Electrical Signal Conduction Apparatus and Methods
Apparatus and methods for magnetically enhanced electrical signal conduction are disclosed. An embodiment electrical connector comprises a connector body, a...
2016/0219700 PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
A prepreg including: a thermosetting resin composition (C) containing a thermosetting resin (A) and an inorganic filler (B); and a glass cloth (D) impregnated...
2016/0219699 SUBSTRATE STRUCTURE AND THE PROCESS MANUFACTURING THE SAME
A multi-layer substrate structure to achieve multiple arrangements of power/ground domains is disclosed. The multi-layer substrate structure comprises a first...
2016/0219698 WIRING BOARD
A wiring board of the present invention includes a build-up layer having a plurality of insulating layers laminated one upon another, a groove formed on a...
2016/0219697 CONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME
The present invention provides a conductive film including a plurality of groove units of which horizontal sections are formed in a lattice form, and a...
2016/0219696 ELECTRONIC DEVICE
An electronic device including a stretchable/contractible base and a wiring formed on the base, the wiring being divided into a first region having a shape...
2016/0219695 METHOD OF FABRICATING DISPLAY DEVICE USING BONDING APPARATUS AND DISPLAY DEVICE
A method of fabricating a display device using a bonding apparatus, the method including arranging a second substrate on a first substrate in which a plurality...
2016/0219694 NANOWIRE SECURITY FILMS
Articles and related methods, the article having an enclosed area at least partially surrounded by a visible light-transmissive protective film comprising a...
2016/0219693 POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH METAL PART, POWER MODULE WITH METAL PART, METHOD FOR...
A power module substrate includes an insulating layer, a circuit layer that is formed on a first surface of the insulating layer, and a metal layer that is...
2016/0219692 CIRCUIT BOARD OF ELECTRICAL CONNECTOR
A circuit board of an electrical connector includes a substrate having an electrical contact region, high-frequency line soldering region, opening, and...
2016/0219691 FAULT DETECTION OPTIMIZED ELECTRONIC CIRCUIT AND METHOD
Fault detection optimized electronic circuit includes a circuit substrate on which components of the electronic circuit are respectively disposed. Each of the...
2016/0219690 WIRING BOARD
A wiring board of the present invention includes a core substrate, insulating layers laminated on upper and lower surfaces of the core substrate, and a...
2016/0219689 SEMICONDUCTOR DEVICE
A semiconductor device includes a first circuit board on which a first switching element and a first diode connected in inverse parallel are mounted, a second...
2016/0219688 PLASMA TORCH WITH IMPROVED COOLING SYSTEM AND CORRESPONDING COOLING METHOD
The invention is a plasma torch (1; 101; 201) of the type comprising: a first element (20) provided with a through opening (21) serving as an outlet for a...
2016/0219687 MICROPLASMA JET DEVICE, LAMINATED MICROPLASMA JET MODULE AND METHOD FOR MANUFACTURING MICROPLASMA JET DEVICE
A microplasma jet device, according to the present invention, comprises: a channel layer having a plurality of micro flow channels arranged in parallel so as...
2016/0219686 X-RAY COMPUTED TOMOGRAPHY APPARATUS AND X-RAY DETECTOR
According to one embodiment, the X-ray computed tomography apparatus includes an X-ray tube, a rotating frame, a plurality of detector elements, a plurality of...
2016/0219685 GANTRY SYSTEM FOR CT IMAGING SYSTEM AND METHODS OF ASSEMBLING SAME
A gantry system for use with a computed tomography imaging system is provided. The gantry system includes a frame, a support rail coupled to the frame, and a...
2016/0219684 ILLUMINATION SYSTEM WITH MONITORING OPTICAL OUTPUT POWER
An illumination system and methods for controlling the illumination system are provided. In one embodiment, the method includes providing a plurality of...
2016/0219683 LIGHTING CONTROL SYSTEM
A lighting control system includes a plurality of light sources, a plurality of light source drivers, each of the light source drivers being configured to...
2016/0219682 REMOTE CONTROL FOR A WIRELESS LOAD CONTROL SYSTEM (As Amended)
A remote control for a wireless load control system, the remote control comprising: a housing having a front surface and an outer periphery defined by a length...
2016/0219681 NETWORKED LIGHTING APPARATUS AND METHOD FOR SUCH LIGHTING APPARATUS TO IDENTIFY ITSELF AND COMMUNICATE ITS...
In various embodiments an apparatus configured to be connected to a lighting network and to control a first and a second lighting unit in response to at least...
2016/0219680 INTERFACE MODULE FOR POWERING WIRELESS USER INTERFACE THROUGH LIGHT SWITCH
An interface module is described for replacing a light switch assembly in an electrical switch box, the electrical switch box having an input wire coupled to a...
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