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Patent # Description
2016/0218178 PROCESS FOR ASSEMBLING TWO WAFERS AND CORRESPONDING DEVICE
A process for assembling a first wafer and a second wafer each bevelled on their peripheries includes excavating the bevelled peripheral part of at least one...
2016/0218177 Isolated Semiconductor Layer in Bulk Wafer by Localized Silicon Epitaxial Seed Formation
An integrated circuit may be formed by forming a buried isolation layer in an isolation recess in a single-crystal silicon-based substrate. Exposed lateral...
2016/0218176 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
An SiC semiconductor device includes an SiC layer including a drift region forming a surface and a body region forming a part of a surface and being in contact...
2016/0218175 WAFER SUBSTRATE REMOVAL
A semiconductor device is formed on a semiconductor substrate, including a primary portion of the substrate. An active component of the semiconductor device is...
2016/0218174 Semiconductor Device with a Super Junction Structure and a Field Extension Zone
A super junction semiconductor device includes an impurity layer of a first (conductivity) type formed in a semiconductor portion having first and second...
2016/0218173 Defect Reduction Using Aspect Ratio Trapping
Lattice-mismatched epitaxial films formed proximate non-crystalline sidewalls. Embodiments of the invention include formation of facets that direct...
2016/0218172 METAL-INSULATOR-METAL (MIM) CAPACITORS AND FORMING METHODS
The present disclosure relates a metal-insulator-metal (MIM) capacitor. In some embodiments, the MIM capacitor has a capacitor bottom metal (CBM) electrode...
2016/0218171 INTEGRATED CIRCUIT AND METHOD OF FABRICATING THE SAME
An integrated circuit and a method of fabricating the integrated circuit are provided. In various embodiments, the integrated circuit includes a substrate and...
2016/0218170 SEMICONDUCTOR DEVICE
Two rows of resistive bodies, first resistive body and second resistive body, having slits are provided on an input matching circuit substrate. Since a...
2016/0218169 INTEGRATED INDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
An integrated inductor structure includes a capacitor, a guard ring, a patterned shield, and an inductor. The guard ring is coupled to the capacitor. The...
2016/0218168 INTEGRATED CIRCUIT WITH BACK SIDE INDUCTOR
A method for providing an inductively loaded integrated circuit includes providing a wafer with an integrated circuit formed thereon, the integrated circuit...
2016/0218167 DISPLAY PANEL WITH VARYING CONDUCTIVE PATTERN ZONE
An organic electroluminescence display panel includes a substrate, an organic light-emitting layer disposed on the substrate, a first conductive pattern with a...
2016/0218166 DISPLAY MODULE
The display module includes first and second FPC substrates disposed on top of each other. The first substrate has an IC mounted on it. The second FPC...
2016/0218165 ORGANIC LIGHT-EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THE SAME
An organic light-emitting diode (OLED) display and a method of manufacturing an OLED display are disclosed. In one aspect, the method includes forming a data...
2016/0218164 ORGANIC LIGHT EMITTING DIODE DISPLAY
An organic light emitting diode display includes: a substrate; a substrate insulating layer on the substrate; a capacitor on the substrate insulating layer; a...
2016/0218163 ORGANIC LIGHT EMITTING DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME
The present invention relates to a method of manufacturing an organic light emitting display panel. The method includes forming a light shielding layer on a...
2016/0218162 ORGANIC LIGHT EMITTING DISPLAY
An organic light emitting display includes a substrate including a first region and a second region adjacent to the first region, a plurality of first organic...
2016/0218161 Bottom Emission Organic Electroluminescence Display Device, Preparation Method Thereof, and Display Apparatus
A bottom emission organic electroluminescence display, a preparation method thereof, and a display apparatus are provided. The display includes a base...
2016/0218160 Light Emitting Device and Method of Manufacturing the Same
To provide a light emitting device high in reliability with a pixel portion having high definition with a large screen. According to a light emitting device of...
2016/0218159 ORGANIC LIGHT-EMITTING DIODE DISPLAY
An organic light emitting diode (OLED) display includes: a first electrode around a center point of a virtual square; second electrodes around a first vertex...
2016/0218158 ORGANIC LIGHT-EMITTING DIODE DISPLAY PANEL
Disclosed is an organic light-emitting diode display panel, including: a substrate; a thin-film transistor layer including a plurality of thin-film...
2016/0218157 ORGANIC LIGHT EMITTING DIODE DISPLAY
An exemplary embodiment provides an organic light emitting diode display, including: a first substrate; a switching and driving thin film transistor disposed...
2016/0218156 Electronic Devices With Light Sensors And Displays
An electronic device is provided with a display and a light sensor that receives light that passes through the display. The display includes features that...
2016/0218155 ORGANIC LIGHT EMITTING DISPLAY APPARATUS
An organic light emitting display apparatus includes: a plurality of pixels at a display area; a plurality of dummy pixels at a dummy area; and a plurality of...
2016/0218154 ORGANIC ELECTROLUMINESCENT DISPLAY APPARATUS
An organic electroluminescent display apparatus includes: a base substrate; a first electrode; a hole transport region; a light-emitting unit; a common layer;...
2016/0218153 DISPLAY DEVICE
A display device including a display panel having a display area and a pad area, a circuit board connected to the pad area and configured to apply an electric...
2016/0218152 Metal Mesh Touch Screen Structure and Methods for Producing the Same
A metal mesh touch screen structure includes an active matrix organic light-emitting diode (AMOLED) structural layer, a pixel layer, a packaging layer, a...
2016/0218151 ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THE SAME
Disclosed herein is an organic light emitting diode display, including: an insulating substrate including a display area in which a plurality of pixels are...
2016/0218150 HIGH RESOLUTION LOW POWER CONSUMPTION OLED DISPLAY WITH EXTENDED LIFETIME
OLED-based devices that include at least two colors of emissive regions are provided, in which one region is optically coupled to a microcavity and the other...
2016/0218149 SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
A solid-state imaging device which includes, a photoelectric conversion film provided on a second surface side which is the opposite side to a first surface on...
2016/0218148 SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS
The present technique relates to a solid-state imaging device and an imaging apparatus that enable provision of a solid-state imaging device having superior...
2016/0218147 METHOD FOR FORMING PCM AND RRAM 3-D MEMORY CELLS
A method for fabricating 3-D cross-point memory arrays, and more particularly to fabricating phase change memory (PCM) and resistive RAM (ReRAM or RRAM) 3-D...
2016/0218146 RRAM PROCESS WITH ROUGHNESS TUNING TECHNOLOGY
The present invention relates to metal oxide based memory devices and methods for manufacturing such devices; and more particularly to memory devices having...
2016/0218145 MAGNETIC MEMORY DEVICES
Magnetic memory devices are provided. A magnetic memory device includes a Magnetic Tunnel Junction (MTJ) structure on a contact. Moreover, the magnetic memory...
2016/0218144 HIGH EFFICIENCY LEDS AND LED LAMPS
In various embodiments, lighting systems include an electrically insulating carrier having a plurality of conductive elements disposed thereon and a...
2016/0218143 MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
Post-processing steps for integrating of micro devices into system (receiver) substrate or improving the performance of the micro devices after transfer. Post...
2016/0218142 DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICES AND METHOD FOR MANUFACTURING THE SAME
A display device including a plurality of semiconductor light emitting devices on a wiring substrate; a connection part on the wiring substrate and configured...
2016/0218141 QUANTUM DOT LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF, DISPLAY DEVICE
A quantum dot light emitting diode, including a first electrode and a second electrode, a quantum dot light emitting layer disposed between the two electrodes,...
2016/0218140 MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
A manufacturing method of a semiconductor structure includes the following steps. A patterned photoresist layer is formed on a wafer of the wafer structure....
2016/0218139 Low Noise InGaAs Photodiode Array
A photodiode pixel structure for imaging short wave infrared (SWIR) and visible light built in a planar structure and may be used for one dimensional and two...
2016/0218138 SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING A SOLID-STATE IMAGE PICKUP DEVICE
A solid-state image pickup device includes a semiconductor layer, a photoelectric conversion element, floating diffusion, a plurality of gates, and a...
2016/0218137 SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD OF SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD OF...
A solid-state imaging device has a sensor substrate having a pixel region on which photoelectric converters are arrayed; a driving circuit provided on a front...
2016/0218136 IMAGE SENSOR PACKAGES AND METHODS OF FABRICATING THE SAME
An image sensor package includes a die having an active side surface and a backside surface opposite to each other and having a bonding pad disposed on the...
2016/0218135 SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
A semiconductor device including a first semiconductor section including a first wiring layer at one side thereof, the first semiconductor section further...
2016/0218134 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a...
2016/0218133 PHOTOSENSITIVE MODULE AND METHOD FOR FORMING THE SAME
A method for forming a photosensitive module is provided. The method includes providing a sensing device. The sensing device includes a conducting pad located...
2016/0218132 STORAGE TRANSISTOR WITH OPTICAL ISOLATION
A storage transistor with a storage region is disposed in a semiconductor material. A gate electrode is disposed in a bottom side of an interlayer proximate to...
2016/0218131 PHOTO DIODE AND METHOD OF FORMING THE SAME
A photo diode includes a pixel unit, a photo conversion layer, and a dielectric layer. The pixel unit includes a pair of pixels. The photo conversion layer is...
2016/0218130 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
A semiconductor package includes a substrate, an image sensor chip mounted on the substrate, a holder disposed on the substrate and surrounding the image...
2016/0218129 PHOTOSENSITIVE MODULE AND METHOD FOR FORMING THE SAME
A method for forming a photosensitive module is provided. The method includes providing a sensing device. The sensing device includes a substrate having a...
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