Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2016/0218128 Active Matrix Light Emitting Diode Array and Projector Display Comprising It
A method of fabricating a pixelated imager and structure including a substrate with a bottom contact layer and active element blanket layers deposited on the...
2016/0218127 SOLID-STATE IMAGE SENSOR AND CAMERA
A solid-state image sensor includes a plurality of pixels for focus detection, each of the pixels including a photoelectric converter arranged in a...
2016/0218126 Backside Structure and Methods for BSI Image Sensors
BSI image sensors and methods. In an embodiment, a substrate is provided having a sensor array and a periphery region and having a front side and a back side...
2016/0218125 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Object is to prevent deterioration in pixel characteristics due to dark-time white spot defects in a pixel. Generation of these dark-time white spot defects is...
2016/0218124 THIN FILM TRANSISTOR DRIVING BACKPLANE AND MANUFACTURING METHOD THEREOF, AND DISPLAY PANEL
The embodiments of the present invention provide a thin film transistor driving backplane and a manufacturing method thereof, and a display panel. The...
2016/0218123 METHOD OF MANUFACTURING DISPLAY DEVICE AND FORMING AN ALIGNMENT MARK HAVING CONCAVE AND CONVEX PORTIONS FORMED...
A method of manufacturing a display device is disclosed. In one aspect, the method includes forming an active layer over a substrate, forming a first...
2016/0218122 DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
This invention aims at reducing the probability of short-circuiting between terminals in a display device in which an IC driver is connected by COG. Terminals...
2016/0218121 LIQUID CRYSTAL DISPLAY AND METHOD FOR MANUFACTURING THE SAME
A liquid crystal display includes a first substrate, a gate line which includes a gate electrode, a gate insulating layer, a semiconductor stripe layer which...
2016/0218120 DISPLAY DEVICE
A pixel portion and a driver circuit driving the pixel portion are formed over the same substrate. At least a part of the driver circuit is formed using an...
2016/0218119 DISPLAY DEVICE
A display device includes a driver circuit including a logic circuit including a first transistor which is a depletion type transistor and a second transistor...
2016/0218118 LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
Provided is a method to manufacture a liquid crystal display device in which a contact hole for the electrical connection of the pixel electrode and one of the...
2016/0218117 DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
A display device includes: a first wiring line and a second wiring line separated from each other on a substrate; a gate insulating layer on the first wiring...
2016/0218116 DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
A display device includes: a gate electrode, a gate line, and data lines on a substrate, the data lines in a same layer as the gate line; a gate insulating...
2016/0218115 PIXEL STRUCTURE
A pixel structure including a plurality of sub-pixels arranged in array is provided. Each of the sub-pixels includes an active device and a pixel electrode...
2016/0218114 THIN FILM TRANSISTOR ARRAY PANEL AND METHOD FOR MANUFACTURING THE SAME
A thin film transistor array panel includes: a gate line on a substrate and including a gate electrode; a first gate insulating layer on the substrate and the...
2016/0218113 Integrated Circuits with Non-Volatile Memory and Methods for Manufacture
Semiconductor devices and methods of manufacturing thereof are described. According to an example embodiment, a semiconductor device comprises: a substrate...
2016/0218112 NON-VOLATILE MEMORY (NVM) CELL AND DEVICE STRUCTURE INTEGRATION
A dielectric layer is formed over the substrate in the capacitor region and the memory region and a select gate layer is formed over the dielectric layer. A...
2016/0218111 MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
A memory device is provided. The memory device includes a substrate, a plurality of semiconductor strip structures, a first doped region, a plurality of second...
2016/0218110 Method Of Forming Self-Aligned Split-Gate Memory Cell Array With Metal Gates And Logic Devices
A method of forming a memory device by forming spaced apart first and second regions with a channel region therebetween, forming a floating gate over and...
2016/0218109 SEMICONDUCTOR MEMORY DEVICE
According to one embodiment, a semiconductor memory device includes: a semiconductor substrate; a first semiconductor pillar above the semiconductor substrate;...
2016/0218108 SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF
The reliability of a semiconductor device having a nonvolatile memory is improved. The memory cell of the nonvolatile memory is of a split gate type, and has...
2016/0218107 THREE-DIMENSIONAL SEMICONDUCTOR DEVICE
A semiconductor device includes a stacked structure having first conductive layers stacked stepwise and first insulating layers interposed between the first...
2016/0218106 SEMICONDUCTOR DEVICE
The semiconductor device of the present invention comprises first and second transistors and first and second capacitors. One of source and drain electrodes of...
2016/0218105 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having at least one fin-shaped structure...
2016/0218104 BARRIER LAYER ABOVE ANTI-PUNCH THROUGH (APT) IMPLANT REGION TO IMPROVE MOBILITY OF CHANNEL REGION OF FIN FIELD...
A fin field device structure and method for forming the same are provided. The FinFET device structure includes a substrate and a fin structure extending from...
2016/0218103 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THEREOF
It is therefore an object of the present invention to provide a method in which, in a semiconductor integrated circuit device, a plurality of transistors...
2016/0218102 SILICON NITRIDE FILL FOR PC GAP REGIONS TO INCREASE CELL DENSITY
A semiconductor device is provided comprising a substrate, two or more semiconductor fins, and one or more gates. A flowable oxide layer is deposited on the...
2016/0218101 SEMICONDUCTOR DEVICE
According to one embodiment, a semiconductor device includes a first region having an insulated gate bipolar transistor and a second region having a diode. The...
2016/0218100 SEMICONDUCTOR DEVICE
A semiconductor device according to an embodiment includes a normally-off transistor having a first drain, a first source electrically connected to a source...
2016/0218099 SEMICONDUCTOR DEVICE
A semiconductor device according to an embodiment includes a normally-off transistor having a first drain, a first source electrically connected to a source...
2016/0218098 High-Performance Device for Protection from Electrostatic Discharge
A semiconductor device for protection from electrostatic discharge includes a number of modules for protection from electrostatic discharge. Each module...
2016/0218097 RADIATION-EMITTING SEMICONDUCTOR CHIP AND METHOD OF PRODUCING RADIATION-EMITTING SEMICONDUCTOR CHIPS
A radiation-emitting semiconductor chip having a semiconductor body including a semi-conductor layer sequence having an active region that generates radiation,...
2016/0218096 LED CHIP HAVING ESD PROTECTION
Disclosed herein is a light emitting diode chip having ESD protection. An exemplary embodiment provides a flip-chip type light emitting diode chip, which...
2016/0218095 COMPOSITE RESIN AND ELECTRONIC DEVICE
According to one embodiment, a composite resin includes a resin component; a plurality of first powder bodies dispersed in the resin component, and having a...
2016/0218094 Package with SoC and Integrated Memory
A semiconductor package includes a processor die (e.g., an SoC) and one or more memory die (e.g., DRAM) coupled to a ball grid array (BGA) substrate. The...
2016/0218093 OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES
An offset interposer includes a land side including land-side ball-grid array (BGA) and a package-on-package (POP) side including a POP-side BGA. The land-side...
2016/0218092 CHIP PACKAGE WITH EMBEDDED PASSIVE DEVICE
A chip package includes a first die encapsulated by a molding compound; a board comprising a chip mounting surface; a redistributed layer (RDL) structure on an...
2016/0218091 SEMICONDUCTOR PACKAGE INCLUDING EXPOSED CONNECTING STUBS
A semiconductor package includes a substrate comprising a chip area and a peripheral area, at least one semiconductor chip mounted on the chip area, a...
2016/0218090 3D Package With Through Substrate Vias
A package, comprising a substrate having electrical devices disposed at a first side of the substrate, vias extending from the first side of the substrate to a...
2016/0218089 Semiconductor Device and Method of Forming WLCSP with Semiconductor Die Embedded Within Interconnect Structure
A semiconductor device includes a semiconductor die. An encapsulant is deposited over the semiconductor die. An insulating layer is formed over the encapsulant...
2016/0218088 SUPPORT MOUNTED ELECTRICALLY INTERCONNECTED DIE ASSEMBLY
Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe,...
2016/0218087 PACKAGE STRUCTURE FOR POWER CONVERTER AND MANUFACTURE METHOD THEREOF
A package structure of a power converter, can include: a die pad; an insulation adhesive layer and a conductive adhesive layer on the die pad; a control...
2016/0218086 SEMICONDUCTOR DEVICE
A semiconductor device is provided including a package substrate, and a plurality of semiconductor chips stacked above the package substrate, at least one of...
2016/0218085 SEMICONDUCTOR DEVICE PACKAGES WITH IMPROVED THERMAL MANAGEMENT AND RELATED METHODS
Semiconductor device packages in accordance with this disclosure may include a substrate and a stack of semiconductor dice attached to the substrate. The stack...
2016/0218084 HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM
A system for interconnecting at least two die each die having a plurality of conducting layers and dielectric layers disposed upon a substrate which may...
2016/0218083 Semiconductor Device
To improve reliability of signal transmission of an interposer which couples between semiconductor chips. A reference potential wiring and a reference...
2016/0218082 DAMASCENE RE-DISTRIBUTION LAYER (RDL) IN FAN OUT SPLIT DIE APPLICATION
A semiconductor device may include a first semiconductor die. A passivation layer supports the first semiconductor die. The passivation layer may include a...
2016/0218081 SEMICONDUCTOR PACKAGES INCLUDING AN INTERPOSER
A semiconductor package may include a first semiconductor chip, second semiconductor chips disposed to respectively overlap with portions of the first...
2016/0218080 Method of Thinning and Packaging a Semiconductor Chip
A semiconductor wafer and a plurality of semiconductor dies are provided. The wafer and the dies each include first electrically conductive terminals arranged...
2016/0218079 DISPLAY DEVICE AND METHOD FOR ASSEMBLING THE SAME
The present disclosure provides a display device and a method for assembling the same. The display device includes an electronic device and a flexible printed...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.