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ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
An electronic component comprises: a resin frame; a semiconductor substrate housed in the resin frame; a plate shape metal member having at least one end fixed...
Composite Sheet for Resin Film Formation
The present invention relates to a composite sheet for resin film formation composed of a pressure-sensitive adhesive sheet having a pressure-sensitive...
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
According to one embodiment, a semiconductor device includes a first conductive portion, a second conductive portion, a first layer, and a second layer. The...
Post-Passivation Interconnect Structure and Method of Forming Same
A semiconductor device including a dielectric layer formed on the surface of a post-passivation interconnect (PPI) structures. A polymer layer is formed on the...
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER AND RELATED METHODS
A method of forming a semiconductor package. Implementations include forming on a die backside an intermediate metal layer having multiple sublayers, each...
A semiconductor device includes a first metal wiring formed on a semiconductor substrate, a first organic insulating film formed on the first metal wiring, and...
ANTENNA CAVITY STRUCTURE FOR INTEGRATED PATCH ANTENNA IN INTEGRATED
An integrated fan-out package having a top-side redistribution wiring structure, a back-side redistribution wiring layer, a ground plane provided in the...
SMART CARD AND METHOD OF MANUFACTURING SMART CARD
An integrated circuit includes a detector circuit including a sensor configured to sense an alteration to a physical characteristic of a substrate and to...
MULTILAYER STRUCTURE IN AN INTEGRATED CIRCUIT FOR DAMAGE PREVENTION AND
DETECTION AND METHODS OF CREATING THE SAME
Various embodiments facilitate die protection for an integrated circuit. In one embodiment, a multilayer structure is formed in multiple levels and along the...
SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER AND MANUFACTURING METHOD OF
A semiconductor device includes wiring layers formed over a semiconductor wafer, a via-layer between the wiring layers, conductive films in the wiring layers,...
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
A semiconductor device, including: an intermediate plate; a semiconductor element connected to one of surfaces of the intermediate plate by a brazing filler...
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
A semiconductor device includes a substrate, a nitride semiconductor layer formed on the substrate, and a protection layer, comprising carbon, covering a side...
Alignment Marks in Non-STI Isolation Formation and Methods of Forming the
A method includes forming a photo resist over a semiconductor substrate of a wafer, patterning the photo resist to form a first opening in the photo resist,...
SEMICONDUCTOR PACKAGES AND PACKAGE MODULES USING THE SAME
A semiconductor package includes a flexible film substrate including a chip mounting region and a cut-line interposed between an inner region and an outer...
SEMICONDUCTOR PACKAGE WITH EMBEDDED COMPONENTS AND METHOD OF MAKING THE
A semiconductor package may include a lower substrate with one or more electronic components attached to a surface thereof and an upper substrate with one or...
FAN -OUT WAFER LEVEL PACKAGING STRUCTURE
Described herein is a semiconductor device and the manufacturing method thereof, wherein the semiconductor device includes a first die including a first pad...
THIN FILM RESISTOR INTEGRATION IN COPPER DAMASCENE METALLIZATION
An integrated circuit with copper damascene interconnects includes a thin film resistor. Copper damascene metal lines are formed in a first ILD layer. A...
SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE
A highly reliable semiconductor device. In a configuration where a precharged source line is discharged to a bit line by establishing electrical continuity...
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
An improvement is achieved in the performance of a semiconductor-device. The semiconductor device includes MISFETs formed in the upper surface of a substrate,...
COMPOSITE CONTACT VIA STRUCTURE CONTAINING AN UPPER PORTION WHICH FILLS A
CAVITY WITHIN A LOWER PORTION
A contact via cavity can be filled with a lower structure and an upper structure. The lower structure can be a conductive structure that is formed by...
A semiconductor device and a method of making the same. The device includes a semiconductor substrate provided in a chip-scale package (CSP). The device also...
INTERPOSERS AND FABRICATION METHODS THAT USE NANOPARTICLE INKS AND
Interposer circuitry (130) is formed on a possibly sacrificial substrate (210) from a porous core (130') covered by a conductive coating (130'') which...
INTERMETALLIC COMPOUND FILLED VIAS
Electronic devices including intermetallic columns within vias are provided. Vias are filled with one or more pastes containing metal particles. Thermal...
SEMICONDUCTOR PACKAGING AND MANUFACTURING METHOD THEREOF
The present disclosure provides a semiconductor package includes a contact pad, a device external to the contact pad and a solder bump on the contact pad. The...
DC-DC CONVERTER HAVING TERMINALS OF SEMICONDUCTOR CHIPS DIRECTLY
ATTACHABLE TO CIRCUIT BOARD
A power supply system has a leadframe with leads and a pad. The pad surface facing a circuit board has a portion recessed with a depth and an outline suitable...
CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
A chip-on-film (COF) package includes a base film, a semiconductor chip mounted on a chip mounting region of a top surface of the base film, a plurality of top...
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the...
A lead frame, as one product unit in a multi-row lead frame sharing a partition frame among other lead frames, has a non-mirrorsymmetric pad region and at...
POWER MODULE AND FABRICATION METHOD FOR THE SAME
A power module includes: an insulating layer; a first metallic plate disposed on the insulating layer; a first semiconductor chip disposed on the first...
Semiconductor Device and Method of Manufactures
A semiconductor device and method of manufacture is provided. A reflowable material is placed in electrical connection with a through via, wherein the through...
MICROFLUIDIC CHANNELS FOR THERMAL MANAGEMENT OF MICROELECTRONICS
Heat spreading device using microfabricated microfluidic structures to cool microelectronic devices.
In a semiconductor device, a second heat sink and a third heat sink are electrically connected by a joint portion in an alignment direction in which a first...
SEMICONDUCTOR DEVICE AND STRUCTURE
A 3D device, including: a first layer including first transistors, the first transistors interconnected by a first layer of interconnection; a second layer...
GLASS FRIT WAFER BOND PROTECTIVE STRUCTURE
A bonded semiconductor device comprising a support substrate, a semiconductor device located with respect to one side of the support substrate, a cap substrate...
Device Comprising a Ductile Layer and Method of Making the Same
Device comprising a ductile layer, a method for making a component comprising a ductile layer and a method for testing a component are disclosed. An embodiment...
FIN FIELD EFFECT TRANSISTOR INCLUDING ASYMMETRIC RAISED ACTIVE REGIONS
Merged and unmerged raised active regions on semiconductor fins can be simultaneously formed on a same substrate by control of growth rates of a deposited...
Nonplanar Device and Strain-Generating Channel Dielectric
A nonplanar circuit device having a strain-producing structure disposed under the channel region is provided. In an exemplary embodiment, the integrated...
TECHNIQUE OF REDUCING SHALLOW TRENCH ISOLATION LOSS DURING FIN FORMATION
A method of fabricating a semiconductor device includes: providing a semiconductor substrate including a hard mask layer; performing, using the hard mask...
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
An insulating film and another insulating film are formed over a semiconductor substrate in that order to cover first, second, and third gate electrodes. The...
Method for Handling a Product Substrate, a Bonded Substrate System and a
A method for handling a product substrate includes bonding a carrier to the product substrate. A layer of a permanent adhesive is applied onto a surface of the...
NOVEL PATTERNING APPROACH FOR IMPROVED VIA LANDING PROFILE
The present disclosure is directed to a semiconductor structure and a method of manufacturing a semiconductor structure in which a spacer element is formed...
DEVICE MANUFACTURING METHOD
A device manufacturing method according to an embodiment includes forming a film on the side of a second surface of a substrate having a first surface and the...
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE WITH REDUCED LEAK PATHS
A method of manufacturing a semiconductor device includes fabricating a transistor, surrounding a gate of the transistor with a spacer, and applying an...
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF
The present disclosure provides an interconnect structure, including a substrate, a first conductive feature over the substrate, a second conductive feature...
METHODS FOR FABRICATING INTEGRATED CIRCUITS INCLUDING BACK-END-OF-THE-LINE
Methods for fabricating integrated circuits are provided. In one example, a method for fabricating an integrated circuit includes selectively depositing a...
Intermediate Layer for Copper Structuring and Methods of Formation Thereof
A method of forming a metallization layer over a semiconductor substrate includes depositing a blanket layer of a diffusion barrier liner over an inter level...
Methods of forming a nanostructured polymer material including block
Methods for fabricating sub-lithographic, nanoscale microstructures utilizing self-assembling block copolymers, and films and devices formed from these methods...
A seal belt includes inner and outer belt sections. The inner belt section revolves according to the movable member movement. The outer belt section includes,...
END EFFECTOR FOR WAFER TRANSFER SYSTEM AND METHOD OF TRANSFERRING WAFERS
An end effector of a wafer transfer system includes synchronously movable blades operable to hold and release wafers. The end effector comprises an end...
SEMICONDUCTOR PROCESS EQUIPMENT
A system for processing a substrate is provided including a first planar motor, a substrate carrier, a first processing chamber, and a first lift. The first...