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Batch Heating and Cooling Chamber or Loadlock
Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber....
SINGLE AND DUAL STAGE WAFER CUSHION AND WAFER SEPARATOR
Improvements in a single and dual stage wafer cushion is disclosed where the wafer cushion can use an edge hinge as a single first stage cushion and a second...
SEMICONDUCTOR MANUFACTURING APPARATUS, DIAGNOSTIC SYSTEM FOR SEMICONDUCTOR
MANUFACTURING APPARATUS, AND METHOD...
A semiconductor manufacturing apparatus capable of stable operation includes a processing chamber where a wafer is treated, a vacuum pump that is coupled with...
SYSTEMS FOR ADHESIVE BONDING OF ELECTRONIC DEVICES
In accordance with certain embodiments, an apparatus for bonding electronic components such as light-emitting elements each to a connection point on a...
A bearing (12) being a recessed section that receives a spindle (20) is provided in a lower surface (10B) of a susceptor (10). The bearing (12) has a tapers...
CUTTING BLADE HAVING CUTTING EDGE CONTAINING PHOTOCATALYST PARTICLES
A cutting blade for cutting a workpiece is disclosed. The cutting blade includes a base and a cutting edge fixed to a peripheral portion of the base. The...
SUBSTRATE TREATING APPARATUS AND TREATMENT LIQUID NOZZLE
Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing having a space for treating a substrate in the interior...
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
The present disclosure relates to a semiconductor package and method of manufacturing the same. The semiconductor package includes a first die, a plurality of...
METHOD OF MANUFACTURING FAN OUT WAFER LEVEL PACKAGE
A method of manufacturing a fan out wafer level package comprises: preparing conductive projections on an upper surface of a chip; mounting the chip on a...
PACKAGE CARRIER, SEMICONDUCTOR PACKAGE, AND PROCESS FOR FABRICATING SAME
A package carrier includes: (1) a dielectric layer; (2) a first electrically conductive pattern, embedded in the dielectric layer and disposed adjacent to a...
VERTICAL GATE SEPARATION
Methods of selectively etching tungsten from the surface of a patterned substrate are described. The methods electrically separate vertically arranged tungsten...
SUBSTRATE FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A substrate for semiconductor device includes a substrate, a reaction layer provided on a back surface of the substrate, a transmission preventing metal having...
Curing Photo Resist for Improving Etching Selectivity
A method includes exposing and developing a negative photo resist, and performing a treatment on the negative photo resist using an electron beam. After the...
Dry Etching Method
Disclosed is a dry etching method for a laminated film in which at least one silicon layer and at least one silicon oxide layer are laminated together. The dry...
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device includes a semiconductor substrate. A gate insulation film is formed on the semiconductor substrate. A gate electrode is formed on the...
PATTERN FORMING METHOD USING RESIST UNDERLAYER FILM
A pattern forming method which uses a resist underlayer film having resistance to a basic aqueous hydrogen peroxide solution. A pattern forming method...
METHOD OF FORMING FINE PATTERN, METHOD OF MANUFACTURING SEMICONDUCTOR
DEVICE, SUBSTRATE PROCESSING APPARATUS...
A fine pattern-forming method includes: a core pattern-forming step of forming a core pattern of a predetermined line width at a substrate surface side; a...
METHOD AND SYSTEM FOR HIGH PRECISION ETCHING OF SUBSTRATES
This disclosure relates to a plasma processing system and methods for high precision etching of microelectronic substrates. The system may include a plasma...
METHOD OF FORMING MINUTE PATTERNS AND METHOD OF MANUFACTURING A
SEMICONDUCTOR DEVICE USING THE SAME
A method includes forming a first etch target layer and a first mask layer on a substrate. Sacrificial patterns extending in a first direction are formed on...
METHOD FOR PRODUCING PATTERNED METAL NANOWIRES, ELECTRODE USING THE
PATTERNED METAL NANOWIRES, AND TRANSISTOR...
The present invention relates to a method of producing patterned silver nanowire, comprising: coating a photosensitive polyamide acid polymer solution on a...
POWER DEVICE WITH HIGH ASPECT RATIO TRENCH CONTACTS AND SUBMICRON PITCHES
This invention discloses a semiconductor power device disposed in a semiconductor substrate including an active cell areas and a termination area. The...
METHOD OF FORMING SEMICONDUCTOR STRUCTURE WITH ANTI-PUNCH THROUGH
A method for manufacturing a semiconductor structure is provided. The method includes implanting a first type of dopants in a first region and a second region...
INGAAS FILM GROWN ON SI SUBSTRATE AND METHOD FOR PREPARING THE SAME
The present invention discloses an InGaAs film grown on a Si substrate, which comprises a Si substrate, a low temperature In.sub.0.4Ga.sub.0.6As buffer layer,...
METHODS AND SYSTEMS FOR IMPROVED UNIFORMITY OF SiGe THICKNESS
A process is used to form a protective layer to cover a divot between two regions of a semiconductor material. During etching processes, the protective layer...
METHODS OF GROWING THIN FILMS AT LOW TEMPERATURES USING ELECTRON
STIMULATED DESORPTION (ESD)
The invention includes a method of promoting thin film growth on a solid substrate, wherein derivatization of the substrate comprises formation of at least one...
SINGLE-CRYSTAL SILICON CARBIDE SUBSTRATE, METHOD FOR PRODUCING
SINGLE-CRYSTAL SILICON CARBIDE SUBSTRATE, AND...
A single-crystal silicon carbide substrate has a main surface having a surface roughness fulfilling Ra .ltoreq.1 nm, and has a ratio of hidden scratches of...
CONTROLLING THE REFLOW BEHAVIOUR OF BPSG FILMS AND DEVICES MADE THEREOF
A method for depositing an insulating layer includes performing a primary deposition over a sidewall of a feature by depositing a layer of silicate glass using...
SEMICONDUCTOR MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF
A semiconductor manufacturing apparatus according to an embodiment includes a first cleaner and a second cleaner. The first cleaner polishes a semiconductor...
PLASMA TREATMENT ON METAL-OXIDE TFT
Techniques are disclosed for methods of post-treating an etch stop or a passivation layer in a thin film transistor to increase the stability behavior of the...
Atomic Layer Deposition Of Films Using Spatially Separated Injector
Methods of depositing a film comprising positioning a plurality of substrates on a substrate support in a processing chamber having a plurality of processing...
METHOD FOR PRODUCING MIRROR-POLISHED WAFER
A method for producing mirror-polished wafer, the method produces a plurality of mirror-polished wafers by performing, on plurality of silicon wafers obtained...
SUBSTRATE PROCESSING DEVICE, RECORDNG MEDIUM, AND CONTROL METHOD
According to one embodiment, a substrate processing device includes a nozzle that discharges chemical to a circumferential edge portion of a substrate; and a...
VIBRATION RESISTANT AUTOMOTIVE FRONT LIGHTING LAMP
A lamp for automotive front lighting and a vehicle headlight comprising the lamp are described, as well as a method of manufacturing the lamp. The lamp 10...
TIME-OF-FLIGHT MASS SPECTROMETER
An embodiment of the invention relates to a TOF-MS capable of performing mass spectrometry of a sample at a high throughput. The TOF-MS has an acceleration...
The invention relates to a micro-nozzle array comprising a plurality of capillaries comprising a first silica-based material and a second silica-based material...
APPARATUS AND METHOD FOR SAMPLING OF CONFINED SPACES
In various embodiments of the invention, a cargo container can be monitored at appropriate time intervals to determine that no controlled substances have been...
Probe Assembly for Attaching a Chromatography Device to a Mass
A probe assembly is disclosed comprising an inlet for receiving an eluent from a chromatography device; an outlet (120) for delivering the eluent to an ion...
Multiplexed Precursor Isolation for Mass Spectrometry
Systems and methods for multiplexed precursor ion selection are provided. A mass isolator includes a selection region of rods, a transmission region of rods,...
SYSTEM FOR RECORDING SPATIAL AND TEMPORAL PROPERTIES OF IONS EMITTED FROM
A QUADRUPOLE MASS FILTER
An ion detection system for a detecting a quantity of ions exiting from a mass analyzer of a mass spectrometer comprises: (a) photon generating means...
METHOD OF CONTROLLING A DC POWER SUPPLY
A method of controlling a DC power supply to change a DC offset voltage applied to a component for manipulating charged particles. The method includes, whilst...
Systems and Methods for Identifying Precursor ions from Product Ions Using
Arbitrary Transmission Windowing
Ions are separated from a sample over time and filtered. The precursor ions produced at each step are fragmented. Resulting product ions are analyzed using a...
Multiplexed Precursor Isolation for Mass Spectrometry
Systems and methods for identifying precursor ions of product ions from combined product ion spectra are provided. N precursor ions are selected. N groups of...
Peak Assessment for Mass Spectrometers
A method of assessing mass spectral peaks obtained by a mass spectrometer is disclosed. The method comprises: providing experimentally obtained mass spectral...
TARGETED MASS ANALYSIS
A mass spectrometer comprises: an ion source that generates ions having an initial range of mass-to-charge ratios; an auxiliary ion detector, downstream from...
CONDUCTIVE TARGET MATERIAL
A conductive target material includes substantially one lithium compound, preferably lithium phosphate, and carbon, as well as typical impurities. A process...
TANTALUM SPUTTERING TARGET
A tantalum sputtering target containing niobium and tungsten as essential components in a total amount of 1 massppm or more and less than 10 massppm, and...
METHOD AND DEVICE FOR DETECTING A PLASMA IGNITION
Disclosed are a method and an apparatus for the detection of a plasma in a process chamber for the treatment of substrates. In the method, the pressure within...
SEMICONDUCTOR SYSTEM ASSEMBLIES AND METHODS OF OPERATION
An exemplary semiconductor processing system may include a remote plasma source coupled with a processing chamber having a top plate. An inlet assembly may be...
PLASMA PROCESSING APPARATUS
Provided is a plasma processing apparatus including a processing chamber which is disposed in a vacuum vessel and able to be decompressed, a sample stage on a...
MICROWAVE PLASMA PROCESSING DEVICE
To provide microwave excitation plasma processing device capable of generating wide-width plasma jet having high uniformity, high density, and low temperature...