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Patent # Description
2016/0233239 LIGHT-EMITTING DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME
An object is to provide a light-emitting display device in which a pixel including a thin film transistor using an oxide semiconductor has a high aperture...
2016/0233238 Display Device
A display device in which the current load of wirings are distributed and display variations due to voltage drop are suppressed. An active matrix display...
2016/0233237 TRANSISTOR ARRAY ROUTING
A device comprising an array of transistors, wherein the device comprises: a first conductor layer at a first level defining a plurality of first conductors...
2016/0233236 DISPLAY PANEL
A display panel including a first substrate, a second substrate and a display medium is provided. The first substrate includes a base substrate, a gate, an...
2016/0233235 DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
A wiring having excellent electrical characteristics is provided. A wiring having stable electrical characteristics is provided. A device is manufactured...
2016/0233234 ARRAY SUBSTRATE AND DISPLAY DEVICE
The present disclosure provides an array substrate and a display device. The array substrate includes a plurality of data lines, a plurality of gate lines and...
2016/0233233 SEMICONDUCTOR DEVICES HAVING GATE STACK PORTIONS THAT EXTEND IN A ZIGZAG PATTERN
A semiconductor device includes a substrate having an upper surface extended in first and second directions perpendicular to each other, gate stack portions...
2016/0233232 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
A method for fabricating a semiconductor device includes forming a stacked structure on a substrate, forming a first interlayer dielectric covering the stacked...
2016/0233231 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device, including: interlayer insulating patterns and conductive patterns alternately stacked on a substrate; a channel structure passing...
2016/0233230 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor memory device according to an embodiment, includes a stacked body, a semiconductor member, a charge storage layer, a charge block layer and an...
2016/0233229 3D NONVOLATILE MEMORY DEVICE
A 3D nonvolatile memory device is disclosed. The 3D nonvolatile memory device includes a word line stack in which a plurality of word lines are stacked therein...
2016/0233228 L-SHAPED CAPACITOR IN THIN FILM STORAGE TECHNOLOGY
The present disclosure relates to a non-planar FEOL (front-end-of-the-line) capacitor comprising a charge trapping dielectric layer disposed between...
2016/0233227 ENHANCED CHANNEL MOBILITY THREE-DIMENSIONAL MEMORY STRUCTURE AND METHOD OF MAKING THEREOF
A stack including an alternating plurality of first material layers and second material layers is provided. A memory opening is formed and at least a...
2016/0233226 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
A method of manufacturing a semiconductor memory device according to an embodiment comprises: stacking a first insulating layer on a semiconductor layer, the...
2016/0233225 DRAIN SELECT GATE FORMATION METHODS AND APPARATUS
Some embodiments include a string of charge storage devices formed along a vertical channel of semiconductor material; a gate region of a drain select gate...
2016/0233224 Access Transistor of a Nonvolatile Memory Device and Method for Fabricating Same
A three-dimensional integrated circuit nonvolatile memory array includes a memory array of vertical channel NAND flash strings connected between an upper layer...
2016/0233223 METHODS OF FABRICATING SEMICONDUCTOR DEVICES INCLUDING MULTIPLE PATTERNING
Methods of fabricating semiconductor devices may include forming a stopper layer, a lower hard mask layer, an intermediate hard mask layer, and an upper hard...
2016/0233222 ANTI-FUSE OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND SYSTEM EACH INCLUDING THE SEMICONDUCTOR DEVICE, AND...
An anti-fuse based on a Field Nitride Trap (FNT) is disclosed. The anti-fuse includes a first active pillar including a first junction, a second active pillar...
2016/0233221 FLASH MEMORY SEMICONDUCTOR DEVICE
The present disclosure provides a method of fabricating a flash memory semiconductor device. In one embodiment, a method of fabricating a resistive memory...
2016/0233220 TUNGSTEN FOR WORDLINE APPLICATIONS
Disclosed herein are methods and related apparatus for formation of tungsten wordlines in memory devices. Also disclosed herein are methods and related...
2016/0233219 COAXIAL CARBON NANOTUBE CAPACITOR FOR eDRAM
A deep trench (DT) opening is provided in a semiconductor substrate and then conducting carbon nanotubes are formed within the DT. Each conducting carbon...
2016/0233218 SEMICONDUCTOR DEVICE
A semiconductor device comprises a convex portion, a concave portion provided so as to cover upper and side surfaces of the convex portion, a gate electrode...
2016/0233217 ETCHSTOP LAYERS AND CAPACITORS
Capacitor structures for integrated circuit devices are provided. Capacitors include proximate dense or highly dense etchstop layers. The dense or highly dense...
2016/0233216 SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREFOR
A semiconductor device includes a substrate (110); a buried layer (120) formed on the substrate (110), a diffusion layer (130) formed on the buried layer...
2016/0233215 FORMATION OF SEMICONDUCTOR DEVICE WITH RESISTORS
A semiconductor device includes a semiconductor substrate, trench isolations, a sacrificial layer, a first resist protect oxide (RPO) layer, a second RPO layer...
2016/0233214 SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor substrate; and a temperature sense diode fixed on the semiconductor substrate. The temperature sense diode...
2016/0233213 Integrated Circuit Having a MOM Capacitor and Method of Making Same
An integrated circuit can include a MOM capacitor formed simultaneously with other devices, such as finFETs. A dielectric layer formed on a substrate has a...
2016/0233212 METAL-INSULATOR-METAL CAPACITOR STRUCTURE
A capacitor structure in a semiconductor device includes a semiconductor substrate having a top surface and a bottom surface opposite the top surface, an...
2016/0233211 Semiconductor Device
The ringing of a switching waveform of a semiconductor device is restrained. For example, an interconnect (L5) is laid which functions as a source of a power...
2016/0233210 HIGH VOLTAGE SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE DEVICES
A multi-cell MOSFET device including a MOSFET cell with an integrated Schottky diode is provided. The MOSFET includes n-type source regions formed in p-type...
2016/0233209 SEMICONDUCTOR DEVICE
A semiconductor device includes a first transistor of a normally-off type, a second transistor of a normally-on type, and a third transistor of a normally-on...
2016/0233208 OVERHEAT DETECTION CIRCUIT AND POWER SUPPLY APPARATUS
Provided is an overheat detection circuit having a small circuit scale, low cost, and low electric power consumption. The overheat detection circuit...
2016/0233207 SEMICONDUCTOR DEVICE
In the semiconductor device including the off transistor serving as an ESD protection element and an output element between a first external connection...
2016/0233206 PARTIAL LAYER TRANSFER SYSTEM AND METHOD
An embodiment includes an apparatus comprising: a first layer, including a first semiconductor switching element, coupled to a first portion of a first bonding...
2016/0233205 METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
A method for fabricating a semiconductor package is provided, which includes the steps of: providing a first substrate having a plurality of first conductive...
2016/0233204 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
To improve the reliability in applying a tape to the rear surface of a substrate while securing the heat resistance of the tape applied to the rear surface of...
2016/0233203 Semiconductor Packages and Methods of Forming the Same
Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a semiconductor package including a...
2016/0233202 SEMICONDUCTOR DEVICE
The present invention relates to a semiconductor device used in power equipment. The semiconductor device includes: a base plate; an insulating substrate...
2016/0233201 COMPOSITE PROTECTION CIRCUIT, COMPOSITE PROTECTION ELEMENT, AND LED DEVICE FOR ILLUMINATION
A Zener diode used as an ESD protection element is connected in parallel to a circuit to be protected, for example an LED chip. The Zener diode is connected in...
2016/0233200 Production of an Optoelectronic Component
A method for producing an optoelectronic component is disclosed. In various embodiments, the method includes arranging a plurality of optoelectronic...
2016/0233199 LIGHT EMITTING MODULE AND LIGHTING DEVICE
Disclosed herein are a light emitting module and a lighting device that may be used for a display application or a lighting application. The light emitting...
2016/0233198 Back-to-back stacked integrated circuit assembly
An integrated circuit assembly includes a first substrate and a second substrate, with active layers formed on the first surfaces of each substrate, and with...
2016/0233197 3D INTEGRATION USING Al-Ge EUTECTIC BOND INTERCONNECT
Provided herein is an apparatus including a first CMOS wafer and a second CMOS wafer. A number of eutectic bonds connect the first CMOS wafer to the second...
2016/0233196 SEMICONDUCTOR PACKAGE USING A CORELESS SIGNAL DISTRIBUTION STRUCTURE
A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at...
2016/0233195 STACKED SEMICONDUCTOR DEVICE
A stacked semiconductor device includes: a plurality of stacked integrated-circuit chips that are to be mounted onto a substrate and including at least one...
2016/0233194 PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
A package structure is provided, which includes: a dielectric layer having opposite first and second surfaces; a circuit sub-layer formed in the dielectric...
2016/0233193 MULTI-DIE WIREBOND PACKAGES WITH ELONGATED WINDOWS
A microelectronic package can include a substrate having first and second opposed surfaces extending in first and second transverse directions and an opening...
2016/0233192 SWITCHED POWER STAGE WITH INTEGRATED PASSIVE COMPONENTS
A scalable switching regulator architecture has an integrated inductor. In some embodiments an area and current drive capability of switches of the switching...
2016/0233191 DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARATUS UTILIZING PHTHALATE
Provided are a device packing facility and method using phthalate and a device processing apparatus utilizing the phthalate. The device packaging facility...
2016/0233190 Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and Protection
A interposer sandwich structure comprises a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes means for...
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