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LIGHT-EMITTING DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME
An object is to provide a light-emitting display device in which a pixel including a thin film transistor using an oxide semiconductor has a high aperture...
A display device in which the current load of wirings are distributed and display variations due to voltage drop are suppressed. An active matrix display...
TRANSISTOR ARRAY ROUTING
A device comprising an array of transistors, wherein the device comprises: a first conductor layer at a first level defining a plurality of first conductors...
A display panel including a first substrate, a second substrate and a display medium is provided. The first substrate includes a base substrate, a gate, an...
DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
A wiring having excellent electrical characteristics is provided. A wiring having stable electrical characteristics is provided. A device is manufactured...
ARRAY SUBSTRATE AND DISPLAY DEVICE
The present disclosure provides an array substrate and a display device. The array substrate includes a plurality of data lines, a plurality of gate lines and...
SEMICONDUCTOR DEVICES HAVING GATE STACK PORTIONS THAT EXTEND IN A ZIGZAG
A semiconductor device includes a substrate having an upper surface extended in first and second directions perpendicular to each other, gate stack portions...
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
A method for fabricating a semiconductor device includes forming a stacked structure on a substrate, forming a first interlayer dielectric covering the stacked...
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device, including: interlayer insulating patterns and conductive patterns alternately stacked on a substrate; a channel structure passing...
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor memory device according to an embodiment, includes a stacked body, a semiconductor member, a charge storage layer, a charge block layer and an...
3D NONVOLATILE MEMORY DEVICE
A 3D nonvolatile memory device is disclosed. The 3D nonvolatile memory device includes a word line stack in which a plurality of word lines are stacked therein...
L-SHAPED CAPACITOR IN THIN FILM STORAGE TECHNOLOGY
The present disclosure relates to a non-planar FEOL (front-end-of-the-line) capacitor comprising a charge trapping dielectric layer disposed between...
ENHANCED CHANNEL MOBILITY THREE-DIMENSIONAL MEMORY STRUCTURE AND METHOD OF
A stack including an alternating plurality of first material layers and second material layers is provided. A memory opening is formed and at least a...
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
A method of manufacturing a semiconductor memory device according to an embodiment comprises: stacking a first insulating layer on a semiconductor layer, the...
DRAIN SELECT GATE FORMATION METHODS AND APPARATUS
Some embodiments include a string of charge storage devices formed along a vertical channel of semiconductor material; a gate region of a drain select gate...
Access Transistor of a Nonvolatile Memory Device and Method for
A three-dimensional integrated circuit nonvolatile memory array includes a memory array of vertical channel NAND flash strings connected between an upper layer...
METHODS OF FABRICATING SEMICONDUCTOR DEVICES INCLUDING MULTIPLE PATTERNING
Methods of fabricating semiconductor devices may include forming a stopper layer, a lower hard mask layer, an intermediate hard mask layer, and an upper hard...
ANTI-FUSE OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND SYSTEM EACH
INCLUDING THE SEMICONDUCTOR DEVICE, AND...
An anti-fuse based on a Field Nitride Trap (FNT) is disclosed. The anti-fuse includes a first active pillar including a first junction, a second active pillar...
FLASH MEMORY SEMICONDUCTOR DEVICE
The present disclosure provides a method of fabricating a flash memory semiconductor device. In one embodiment, a method of fabricating a resistive memory...
TUNGSTEN FOR WORDLINE APPLICATIONS
Disclosed herein are methods and related apparatus for formation of tungsten wordlines in memory devices. Also disclosed herein are methods and related...
COAXIAL CARBON NANOTUBE CAPACITOR FOR eDRAM
A deep trench (DT) opening is provided in a semiconductor substrate and then conducting carbon nanotubes are formed within the DT. Each conducting carbon...
A semiconductor device comprises a convex portion, a concave portion provided so as to cover upper and side surfaces of the convex portion, a gate electrode...
ETCHSTOP LAYERS AND CAPACITORS
Capacitor structures for integrated circuit devices are provided. Capacitors include proximate dense or highly dense etchstop layers. The dense or highly dense...
SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREFOR
A semiconductor device includes a substrate (110); a buried layer (120) formed on the substrate (110), a diffusion layer (130) formed on the buried layer...
FORMATION OF SEMICONDUCTOR DEVICE WITH RESISTORS
A semiconductor device includes a semiconductor substrate, trench isolations, a sacrificial layer, a first resist protect oxide (RPO) layer, a second RPO layer...
A semiconductor device includes a semiconductor substrate; and a temperature sense diode fixed on the semiconductor substrate. The temperature sense diode...
Integrated Circuit Having a MOM Capacitor and Method of Making Same
An integrated circuit can include a MOM capacitor formed simultaneously with other devices, such as finFETs. A dielectric layer formed on a substrate has a...
METAL-INSULATOR-METAL CAPACITOR STRUCTURE
A capacitor structure in a semiconductor device includes a semiconductor substrate having a top surface and a bottom surface opposite the top surface, an...
The ringing of a switching waveform of a semiconductor device is restrained. For example, an interconnect (L5) is laid which functions as a source of a power...
HIGH VOLTAGE SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE DEVICES
A multi-cell MOSFET device including a MOSFET cell with an integrated Schottky diode is provided. The MOSFET includes n-type source regions formed in p-type...
A semiconductor device includes a first transistor of a normally-off type, a second transistor of a normally-on type, and a third transistor of a normally-on...
OVERHEAT DETECTION CIRCUIT AND POWER SUPPLY APPARATUS
Provided is an overheat detection circuit having a small circuit scale, low cost, and low electric power consumption. The overheat detection circuit...
In the semiconductor device including the off transistor serving as an ESD protection element and an output element between a first external connection...
PARTIAL LAYER TRANSFER SYSTEM AND METHOD
An embodiment includes an apparatus comprising: a first layer, including a first semiconductor switching element, coupled to a first portion of a first bonding...
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
A method for fabricating a semiconductor package is provided, which includes the steps of: providing a first substrate having a plurality of first conductive...
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
To improve the reliability in applying a tape to the rear surface of a substrate while securing the heat resistance of the tape applied to the rear surface of...
Semiconductor Packages and Methods of Forming the Same
Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a semiconductor package including a...
The present invention relates to a semiconductor device used in power equipment. The semiconductor device includes: a base plate; an insulating substrate...
COMPOSITE PROTECTION CIRCUIT, COMPOSITE PROTECTION ELEMENT, AND LED DEVICE
A Zener diode used as an ESD protection element is connected in parallel to a circuit to be protected, for example an LED chip. The Zener diode is connected in...
Production of an Optoelectronic Component
A method for producing an optoelectronic component is disclosed. In various embodiments, the method includes arranging a plurality of optoelectronic...
LIGHT EMITTING MODULE AND LIGHTING DEVICE
Disclosed herein are a light emitting module and a lighting device that may be used for a display application or a lighting application. The light emitting...
Back-to-back stacked integrated circuit assembly
An integrated circuit assembly includes a first substrate and a second substrate, with active layers formed on the first surfaces of each substrate, and with...
3D INTEGRATION USING Al-Ge EUTECTIC BOND INTERCONNECT
Provided herein is an apparatus including a first CMOS wafer and a second CMOS wafer. A number of eutectic bonds connect the first CMOS wafer to the second...
SEMICONDUCTOR PACKAGE USING A CORELESS SIGNAL DISTRIBUTION STRUCTURE
A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at...
STACKED SEMICONDUCTOR DEVICE
A stacked semiconductor device includes: a plurality of stacked integrated-circuit chips that are to be mounted onto a substrate and including at least one...
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
A package structure is provided, which includes: a dielectric layer having opposite first and second surfaces; a circuit sub-layer formed in the dielectric...
MULTI-DIE WIREBOND PACKAGES WITH ELONGATED WINDOWS
A microelectronic package can include a substrate having first and second opposed surfaces extending in first and second transverse directions and an opening...
SWITCHED POWER STAGE WITH INTEGRATED PASSIVE COMPONENTS
A scalable switching regulator architecture has an integrated inductor. In some embodiments an area and current drive capability of switches of the switching...
DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARATUS
Provided are a device packing facility and method using phthalate and a device processing apparatus utilizing the phthalate. The device packaging facility...
Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and
A interposer sandwich structure comprises a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes means for...