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Patent # Description
2016/0233189 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
In a semiconductor device (SP1) according to an embodiment, a solder resist film (first insulating layer, SR1) which is in contact with the base material...
2016/0233188 Contact bumps methods of making contact bumps
Contact bumps between a contact pad and a substrate can include a rough surface that can mate with the material of the substrate. The rough surface can enhance...
2016/0233187 Semiconductor Package Using A Contact In A Pleated Sidewall Encapsulant Opening
A semiconductor package, and a method of manufacturing thereof, comprising a contact in a plated sidewall encapsulant opening, substantially as shown in and/or...
2016/0233186 CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS
Electro-mechanical connection component provided on one connection surface with conductive inserts intended to be inserted at ambient temperature into...
2016/0233185 Power Semiconductor Device with a Double Metal Contact and Related Method
A power semiconductor device that includes a stack of a thin metal layer and a thick metal layer over the active region thereof, and a method for the...
2016/0233184 Semiconductor Device Manufacturing Method
A method for manufacturing a semiconductor includes: a Step A of preparing a chip with sheet-shaped resin composition in which a sheet-shaped resin composition...
2016/0233183 INTEGRATED CIRCUIT DIE WITH CORNER IO PADS
An integrated circuit (IC) die has side input/output (IO) pads located along each side of the die interior. Each die corner has a corner IO pad. The side IO...
2016/0233182 SEMICONDUCTOR PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
A semiconductor packaging structure includes a chip, a metal barrier layer, a dielectric layer and two metal seed layers. The chip has a top surface,...
2016/0233181 ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
An electronic device includes a first electronic component including a first electrode, a solder provided above the first electrode, and a first bonding layer...
2016/0233180 SPOKED SOLDER PAD TO IMPROVE SOLDERABILITY AND SELF-ALIGNMENT OF INTEGRATED CIRCUIT PACKAGES
A center pad or paddle that is shaped with three or more curved spires which are symmetrical in form about axis that radiate from the center of the integrated...
2016/0233179 RELIABLE INTERCONNECT
Devices and methods for forming a device are disclosed. The device includes a contact region disposed over a last interconnect level of the device. The device...
2016/0233178 DEVICE FOR RADIOFREQUENCY (RF) TRANSMISSION WITH AN INTEGRATED ELECTROMAGNETIC WAVE REFLECTOR
RF transmission device including at least: a substrate comprising first and second faces opposite to each other; a first RF transmission electronic circuit...
2016/0233177 DEVICE AND METHOD FOR GENERATING IDENTIFICATION KEY
The present invention relates to a device and method for generating an identification key using a process variation in a via process, and specifically the...
2016/0233176 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method for manufacturing a semiconductor device includes attaching a semiconductor substrate to a support substrate in a heated state, and processing the...
2016/0233175 MICROELECTRONIC DIE HAVING CHAMFERED CORNERS
A microelectronic die may be formed with chamfer corners for reducing stresses which can lead to delamination and/or cracking failures when such a...
2016/0233174 INTEGRATED CIRCUIT, ELECTRONIC DEVICE AND METHOD FOR TRANSMITTING DATA IN ELECTRONIC DEVICE
An integrated circuit is provided. The integrated circuit includes a control circuitry, a plurality of pins, and a plurality of driving units coupled to the...
2016/0233173 THERMALLY-CONDUCTIVE ELECTROMAGNETIC INTERFERENCE (EMI) ABSORBERS WITH SILICON CARBIDE
According to various aspects, exemplary embodiments are disclosed of thermally-conductive EMI absorbers. In an exemplary embodiment, a thermally-conductive EMI...
2016/0233172 Wafer Alignment Methods in Die Sawing Process
A method includes forming a molding compound molding a lower portion of an electrical connector of a wafer therein. The molding compound is at a front surface...
2016/0233171 SEMICONDUCTOR DEVICE
Provided is a semiconductor device including an interconnection structure provided on a cell region of a substrate to include a first line and a second line...
2016/0233170 METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
A method of manufacturing an electronic device and an electronic device are disclosed. The manufacturing method including: forming a carbon nanotube electrode...
2016/0233169 WAFER LEVEL SEMICONDUCTOR PACKAGE AND MANUFACTURING METHODS THEREOF
A semiconductor package includes at least one semiconductor die having an active surface, an interposer element having an upper surface and a lower surface, a...
2016/0233168 Semiconductor Device and Method of Forming 3D Dual Side Die Embedded Build-Up Semiconductor Package
A semiconductor device has a plurality of semiconductor die. A substrate is provided with bumps disposed over the substrate. A first prefabricated insulating...
2016/0233167 SEMICONDUCTOR ELEMENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
A wiring board includes a base substrate, a semiconductor element embedded in the substrate and having active and non-active surfaces such that the...
2016/0233166 BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL)
Embodiments of the present disclosure are directed towards bumpless interfaces to an embedded silicon die, in integrated circuit (IC) package assemblies. In...
2016/0233165 ACTIVE CHIP ON CARRIER OR LAMINATED CHIP HAVING MICROELECTRONIC ELEMENT EMBEDDED THEREIN
A structure including a first semiconductor chip with front and rear surfaces and a cavity in the rear surface. A second semiconductor chip is mounted within...
2016/0233164 INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
An integrated circuit device includes a source/drain region having a recess in its top, a contact plug extending on the source/drain region from within the...
2016/0233163 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device according to an embodiment includes a first transistor and a second transistor. The first transistor is connected to a first wiring...
2016/0233162 ANGLED ION BEAM PROCESSING OF HETEROGENEOUS STRUCTURE
A method for fabricating a multilayer structure includes providing a mask on a device stack disposed on the substrate, the device stack comprising a first...
2016/0233161 Passive Devices in Package-on-Package Structures and Methods for Forming the Same
A device includes a polymer. A device die is disposed in the polymer. A passive device includes three Through Assembly Vias (TAVs) penetrating through the...
2016/0233160 MICROELECTRONIC DEVICES WITH THROUGH-SILICON VIAS AND ASSOCIATED METHODS OF MANUFACTURING
Microelectronic devices with through-silicon vias and associated methods of manufacturing such devices. One embodiment of a method for forming tungsten...
2016/0233159 INTEGRATED CIRCUIT DEVICE INCLUDING MULTIPLE VIA CONNECTORS AND A METAL STRUCTURE HAVING A LADDER SHAPE
In a particular aspect, an apparatus includes a first via of an integrated circuit. The apparatus includes a second via of the integrated circuit. The...
2016/0233158 MECHANISMS FOR FORMING METAL-INSULATOR-METAL (MIM) CAPACITOR STRUCTURE
A method for forming a metal-insulator-metal (MIM) capacitor structure is provided. The method includes providing a substrate and forming an interconnect...
2016/0233157 SLOT DESIGNS IN WIDE METAL LINES
A method and structure for slots in wide lines to reduce stress. An example embodiment method and structure for is an interconnect structure comprising:...
2016/0233156 ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE USING THE SAME
An electronic component, a semiconductor package, and an electronic device including the electronic component and/or the semiconductor package are provided....
2016/0233155 SEMICONDUCTOR DEVICE, FABRICATING METHOD THEREOF AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE
In one embodiment, a semiconductor device includes a semiconductor substrate having a first surface, and a second surface opposite to the first surface. The...
2016/0233154 SEMICONDUCTOR DEVICE
The present invention has for its purpose to provide a technique capable of reducing planar dimension of the semiconductor device. An input/output circuit is...
2016/0233153 INTEGRATED DEVICE PACKAGE COMPRISING A MAGNETIC CORE INDUCTOR WITH PROTECTIVE RING EMBEDDED IN A PACKAGE SUBSTRATE
An integrated device package includes a die and a package substrate. The package substrate includes at least one dielectric layer (e.g., core layer, prepeg...
2016/0233152 PACKAGE STRUCTURE
A package structure includes a lead frame, a selective-electroplating epoxy compound, conductive vias and a patterned circuit layer. The lead frame includes a...
2016/0233151 POWER SEMICONDUCTOR DEVICE
An object is to provide a technique in which a cost reduction in a power semiconductor device can be achieved while maintaining heat dissipation performance as...
2016/0233150 SEMICONDUCTOR DEVICE
A semiconductor device according to an embodiment includes a first metal part. A semiconductor chip is mounted on the first metal part and includes a first...
2016/0233149 Semiconductor Chip Package Having Contact Pins at Short Side Edges
A semiconductor chip package includes a semiconductor chip, an encapsulation body encapsulating the semiconductor chip, a chip pad, and electrical contact...
2016/0233148 SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING HEAT DISSIPATION ELEMENTS
A semiconductor package structure includes a flexible substrate, a semiconductor element, a printed circuit board, and first and second heat dissipation...
2016/0233147 PACKAGED SEMICONDUCTOR DEVICE HAVING STACKED ATTACHED CHIPS OVERHANGING THE ASSEMBLY PAD
A semiconductor device comprising a stack of semiconductor chips. The semiconductor chips have an electrically active side and an opposite electrically...
2016/0233146 SEMICONDUCTOR DEVICE
A semiconductor device includes an insulating substrate having an insulating plate formed of ceramic and a circuit plate fixed on a main face of the insulating...
2016/0233145 APPARATUS COMPRISING A FUNCTIONAL COMPONENT LIKELY TO BE THERMALLY OVERLOADED DURING THE OPERATION THEREOF AND...
The invention relates to an apparatus comprising a functional component likely to be thermally overloaded during the operation thereof, and a system for...
2016/0233144 SEMICONDUCTOR DEVICE
A semiconductor device includes a first fin pattern, which includes a first lower pattern and a first upper pattern stacked sequentially on a substrate, the...
2016/0233143 VARIABLE HEAT CONDUCTOR
A method and apparatus for a variable heat conductor that is able to increase heat conduction capacity based on operating temperature. The variable heat...
2016/0233142 Composite Substrate with Alternating Pattern of Diamond and Metal or Metal Alloy
A composite substrate includes a submount substrate of an alternating pattern of electrically insulative portions, pieces, layers or segments and electrically...
2016/0233141 SEMICONDUCTOR DEVICE
There is provided a semiconductor device including a substrate whose surface is made of an insulation material, a semiconductor chip flip-chip connected on the...
2016/0233140 PACKAGE STRUCTURE
A package structure includes a first insulation layer, at least one first electronic component, and a first re-distribution layer. The first electronic...
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