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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
In a semiconductor device (SP1) according to an embodiment, a solder resist film (first insulating layer, SR1) which is in contact with the base material...
Contact bumps methods of making contact bumps
Contact bumps between a contact pad and a substrate can include a rough surface that can mate with the material of the substrate. The rough surface can enhance...
Semiconductor Package Using A Contact In A Pleated Sidewall Encapsulant
A semiconductor package, and a method of manufacturing thereof, comprising a contact in a plated sidewall encapsulant opening, substantially as shown in and/or...
CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS
Electro-mechanical connection component provided on one connection surface with conductive inserts intended to be inserted at ambient temperature into...
Power Semiconductor Device with a Double Metal Contact and Related Method
A power semiconductor device that includes a stack of a thin metal layer and a thick metal layer over the active region thereof, and a method for the...
Semiconductor Device Manufacturing Method
A method for manufacturing a semiconductor includes: a Step A of preparing a chip with sheet-shaped resin composition in which a sheet-shaped resin composition...
INTEGRATED CIRCUIT DIE WITH CORNER IO PADS
An integrated circuit (IC) die has side input/output (IO) pads located along each side of the die interior. Each die corner has a corner IO pad. The side IO...
SEMICONDUCTOR PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
A semiconductor packaging structure includes a chip, a metal barrier layer, a dielectric layer and two metal seed layers. The chip has a top surface,...
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
An electronic device includes a first electronic component including a first electrode, a solder provided above the first electrode, and a first bonding layer...
SPOKED SOLDER PAD TO IMPROVE SOLDERABILITY AND SELF-ALIGNMENT OF
INTEGRATED CIRCUIT PACKAGES
A center pad or paddle that is shaped with three or more curved spires which are symmetrical in form about axis that radiate from the center of the integrated...
Devices and methods for forming a device are disclosed. The device includes a contact region disposed over a last interconnect level of the device. The device...
DEVICE FOR RADIOFREQUENCY (RF) TRANSMISSION WITH AN INTEGRATED
ELECTROMAGNETIC WAVE REFLECTOR
RF transmission device including at least: a substrate comprising first and second faces opposite to each other; a first RF transmission electronic circuit...
DEVICE AND METHOD FOR GENERATING IDENTIFICATION KEY
The present invention relates to a device and method for generating an identification key using a process variation in a via process, and specifically the...
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method for manufacturing a semiconductor device includes attaching a semiconductor substrate to a support substrate in a heated state, and processing the...
MICROELECTRONIC DIE HAVING CHAMFERED CORNERS
A microelectronic die may be formed with chamfer corners for reducing stresses which can lead to delamination and/or cracking failures when such a...
INTEGRATED CIRCUIT, ELECTRONIC DEVICE AND METHOD FOR TRANSMITTING DATA IN
An integrated circuit is provided. The integrated circuit includes a control circuitry, a plurality of pins, and a plurality of driving units coupled to the...
THERMALLY-CONDUCTIVE ELECTROMAGNETIC INTERFERENCE (EMI) ABSORBERS WITH
According to various aspects, exemplary embodiments are disclosed of thermally-conductive EMI absorbers. In an exemplary embodiment, a thermally-conductive EMI...
Wafer Alignment Methods in Die Sawing Process
A method includes forming a molding compound molding a lower portion of an electrical connector of a wafer therein. The molding compound is at a front surface...
Provided is a semiconductor device including an interconnection structure provided on a cell region of a substrate to include a first line and a second line...
METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
A method of manufacturing an electronic device and an electronic device are disclosed. The manufacturing method including: forming a carbon nanotube electrode...
WAFER LEVEL SEMICONDUCTOR PACKAGE AND MANUFACTURING METHODS THEREOF
A semiconductor package includes at least one semiconductor die having an active surface, an interposer element having an upper surface and a lower surface, a...
Semiconductor Device and Method of Forming 3D Dual Side Die Embedded
Build-Up Semiconductor Package
A semiconductor device has a plurality of semiconductor die. A substrate is provided with bumps disposed over the substrate. A first prefabricated insulating...
SEMICONDUCTOR ELEMENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING
A wiring board includes a base substrate, a semiconductor element embedded in the substrate and having active and non-active surfaces such that the...
BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL)
Embodiments of the present disclosure are directed towards bumpless interfaces to an embedded silicon die, in integrated circuit (IC) package assemblies. In...
ACTIVE CHIP ON CARRIER OR LAMINATED CHIP HAVING MICROELECTRONIC ELEMENT
A structure including a first semiconductor chip with front and rear surfaces and a cavity in the rear surface. A second semiconductor chip is mounted within...
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
An integrated circuit device includes a source/drain region having a recess in its top, a contact plug extending on the source/drain region from within the...
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device according to an embodiment includes a first transistor and a second transistor. The first transistor is connected to a first wiring...
ANGLED ION BEAM PROCESSING OF HETEROGENEOUS STRUCTURE
A method for fabricating a multilayer structure includes providing a mask on a device stack disposed on the substrate, the device stack comprising a first...
Passive Devices in Package-on-Package Structures and Methods for Forming
A device includes a polymer. A device die is disposed in the polymer. A passive device includes three Through Assembly Vias (TAVs) penetrating through the...
MICROELECTRONIC DEVICES WITH THROUGH-SILICON VIAS AND ASSOCIATED METHODS
Microelectronic devices with through-silicon vias and associated methods of manufacturing such devices. One embodiment of a method for forming tungsten...
INTEGRATED CIRCUIT DEVICE INCLUDING MULTIPLE VIA CONNECTORS AND A METAL
STRUCTURE HAVING A LADDER SHAPE
In a particular aspect, an apparatus includes a first via of an integrated circuit. The apparatus includes a second via of the integrated circuit. The...
MECHANISMS FOR FORMING METAL-INSULATOR-METAL (MIM) CAPACITOR STRUCTURE
A method for forming a metal-insulator-metal (MIM) capacitor structure is provided. The method includes providing a substrate and forming an interconnect...
SLOT DESIGNS IN WIDE METAL LINES
A method and structure for slots in wide lines to reduce stress. An example embodiment method and structure for is an interconnect structure comprising:...
ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE USING
An electronic component, a semiconductor package, and an electronic device including the electronic component and/or the semiconductor package are provided....
SEMICONDUCTOR DEVICE, FABRICATING METHOD THEREOF AND SEMICONDUCTOR PACKAGE
INCLUDING THE SEMICONDUCTOR DEVICE
In one embodiment, a semiconductor device includes a semiconductor substrate having a first surface, and a second surface opposite to the first surface. The...
The present invention has for its purpose to provide a technique capable of reducing planar dimension of the semiconductor device. An input/output circuit is...
INTEGRATED DEVICE PACKAGE COMPRISING A MAGNETIC CORE INDUCTOR WITH
PROTECTIVE RING EMBEDDED IN A PACKAGE SUBSTRATE
An integrated device package includes a die and a package substrate. The package substrate includes at least one dielectric layer (e.g., core layer, prepeg...
A package structure includes a lead frame, a selective-electroplating epoxy compound, conductive vias and a patterned circuit layer. The lead frame includes a...
POWER SEMICONDUCTOR DEVICE
An object is to provide a technique in which a cost reduction in a power semiconductor device can be achieved while maintaining heat dissipation performance as...
A semiconductor device according to an embodiment includes a first metal part. A semiconductor chip is mounted on the first metal part and includes a first...
Semiconductor Chip Package Having Contact Pins at Short Side Edges
A semiconductor chip package includes a semiconductor chip, an encapsulation body encapsulating the semiconductor chip, a chip pad, and electrical contact...
SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING HEAT DISSIPATION ELEMENTS
A semiconductor package structure includes a flexible substrate, a semiconductor element, a printed circuit board, and first and second heat dissipation...
PACKAGED SEMICONDUCTOR DEVICE HAVING STACKED ATTACHED CHIPS OVERHANGING
THE ASSEMBLY PAD
A semiconductor device comprising a stack of semiconductor chips. The semiconductor chips have an electrically active side and an opposite electrically...
A semiconductor device includes an insulating substrate having an insulating plate formed of ceramic and a circuit plate fixed on a main face of the insulating...
APPARATUS COMPRISING A FUNCTIONAL COMPONENT LIKELY TO BE THERMALLY
OVERLOADED DURING THE OPERATION THEREOF AND...
The invention relates to an apparatus comprising a functional component likely to be thermally overloaded during the operation thereof, and a system for...
A semiconductor device includes a first fin pattern, which includes a first lower pattern and a first upper pattern stacked sequentially on a substrate, the...
VARIABLE HEAT CONDUCTOR
A method and apparatus for a variable heat conductor that is able to increase heat conduction capacity based on operating temperature. The variable heat...
Composite Substrate with Alternating Pattern of Diamond and Metal or Metal
A composite substrate includes a submount substrate of an alternating pattern of electrically insulative portions, pieces, layers or segments and electrically...
There is provided a semiconductor device including a substrate whose surface is made of an insulation material, a semiconductor chip flip-chip connected on the...
A package structure includes a first insulation layer, at least one first electronic component, and a first re-distribution layer. The first electronic...