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Method for Electrophoretically Depositing a Film on an Electronic Assembly
A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a...
An example package comprising: an RF circuit having a first portion and a second portion; a cavity structure positioned only over the first portion of the RF...
DRIVER INTEGRATED CIRCUIT CHIP AND DISPLAY DEVICE HAVING THE SAME
A driver integrated circuit chip includes a plurality of monitoring bumps, a plurality of output bumps, a plurality of first inner wires electrically connected...
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING
According to one embodiment, a semiconductor manufacturing apparatus includes a manufacturing processor, a signal acquisition unit, a frequency characteristic...
Method for Positioning a Carrier with Electronic Components and Electronic
Component Produced with Such Method
The present invention relates to a method of processing a solder masked carrier with electronic components, comprising the detection of a carrier related...
Method of Semiconductor Fabrication with Height Control Through Active
The present disclosure provides a method for fabricating an integrated circuit in accordance with some embodiments. The method includes forming a trench on a...
Semiconductor Manufacturing Method and Tool
An overlay measurement and correction method and device is provided. In an embodiment the measurement device takes measurements of a first semiconductor wafer...
Semiconductor Device and Method of Forming the Same
A method of forming a semiconductor device includes forming a gate stack over a substrate, forming an amorphized region in the substrate adjacent to an edge of...
METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICES
An integrated circuit device includes a first transistor having a first channel between a first source/drain, and a second transistor having a second channel...
SYSTEMS AND PROCESSES FOR FORMING THREE-DIMENSIONAL INTEGRATED CIRCUITS
Provided are systems and processes for forming a three-dimensional circuit on a substrate. A radiation source produces a beam that is directed at a substrate...
Semiconductor Device and Method
A semiconductor device and method of manufacture are provided. In an embodiment a first semiconductor device and a second semiconductor device are formed...
MODIFIED TUNGSTEN SILICON
A method for forming a precision resistor or an e-fuse structure where tungsten silicon is used. The tungsten silicon layer is modified by changing the...
REDUCED HEIGHT M1 METAL LINES FOR LOCAL ON-CHIP ROUTING
Systems and methods are directed to an integrated circuit comprising a reduced height M1 metal line formed of an exemplary material with lower mean free path...
METAL WIRING LAYER FORMING METHOD, METAL WIRING LAYER FORMING APPARATUS,
AND RECORDING MEDIUM
A metal wiring layer can be formed within a recess of a substrate while suppressing the metal wiring layer from being formed at the outside of the recess. A...
MICROELECTRONIC INTERCONNECT ADAPTOR
An interconnect adaptor may be fabricated having a substantially planar surface, to which a microelectronic package may be electrically attached, and a...
Method for Via Plating with Seed Layer
Presented herein is a method for plating comprising providing a substrate having a dielectric layer formed over a trace, and forming a via/trench opening...
RUTHENIUM FILM FORMING METHOD, FILM FORMING APPARATUS, AND SEMICONDUCTOR
DEVICE MANUFACTURING METHOD
A ruthenium film forming method includes a deposition process of introducing a mixed gas of a ruthenium carbonyl gas and a CO gas into a processing vessel 1 by...
METHODS FOR FORMING COBALT-COPPER SELECTIVE FILL FOR AN INTERCONNECT
Methods for processing a substrate include: (a) depositing a cobalt layer to a first thickness within a first plurality of features and a second plurality of...
MAGNETIC SIDEWALLS FOR WRITE LINES IN FIELD-INDUCED MRAM AND METHODS OF
In one embodiment, there is provided a non-volatile magnetic memory cell. The non-volatile magnetic memory cell comprises a switchable magnetic element; and a...
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
A method for fabricating a semiconductor device includes forming a hard mask (HM) layer over a material layer, forming a first trench in the HM layer, which...
Dielectric Structures with Negative Taper and Methods of Formation Thereof
A method for forming a dielectric structure includes forming an auxiliary layer over a substrate, and forming a hole within the auxiliary layer. A fill...
Method of Forming an Interconnect Structure Having an Air Gap and
A semiconductor device and method of manufacture are provided which utilize an air gap to help isolate conductive structures within a dielectric layer. A first...
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
A semiconductor structure includes a substrate, at least one first epitaxial layer, and at least one second epitaxial layer. The substrate has a plurality of...
SUBSTRATE SUPPORT WITH IMPROVED RF RETURN
Apparatus for processing a substrate are provided herein. In some embodiments, a substrate support includes a body having a support surface; an RF electrode...
SUBSTRATE HOLDING MECHANISM AND SUBSTRATE PROCESSING APPARATUS USING THE
There is provided a substrate holding mechanism of holding a substrate in a predetermined substrate holding region on a susceptor, including: a substrate...
CHUCK TABLE OF PROCESSING APPARATUS
A chuck table in processing apparatus holds a frame unit in which a wafer is fixed to an opening of a ring-shaped frame with an intermediary of adhesive tape...
EXPOSURE METHOD, MANUFACTURING METHOD OF DEVICE, AND THIN FILM SHEET
According to one embodiment, there is provided an exposure method. The method includes attaching a thin film sheet thermally shrinkable onto a rear face of a...
ELECTROSTATIC CHUCK DEVICE
Provided is an electrostatic chuck device in which breakdown between an electrostatic chuck portion and a cooling base portion can be prevented, voltage...
Barrier Seal for Electrostatic Chuck
Provided is a barrier seal for an electrostatic chuck in the plasma etching process. The barrier seal comprises multiple sealing portions to block the...
DEVICE AND METHOD FOR ALIGNING SUBSTRATES
A method for aligning and bringing a first substrate into contact with a second substrate as well as a corresponding device with at least four detection units...
ATOMIC-LAYER DEPOSITION SUBSTRATE
A substrate for fluidic levitation processing includes a moveable substrate and a levitation stabilizing structure located on the moveable substrate. The...
SUBSTRATE HANDLING SYSTEM FOR ALIGNING AND ORIENTING SUBSTRATES DURING A
A system for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so...
Ceiling Transport Vehicle
A ceiling transport vehicle is provided in which any obstacle located below a vertically movable member can be detected properly while reducing any increase in...
DEVICE AND METHOD FOR CONVEYING AND FLIPPING A COMPONENT
The present invention relates to a device (1) and method for conveying and flipping a component (10) for use in conjunction with a rotary turret module (30)....
WAFER PROCESSING SYSTEM
Disclosed herein is a wafer processing system for processing wafers one at a time, the wafer processing system including: a plurality of trays each configured...
Chuck for Suction and Holding a Wafer
The invention relates to a chuck and a method for suction and holding a wafer by said chuck, wherein the chuck comprises: a flat top face being subdivided into...
SUBSTRATE PROCESSING APPARATUS
A supply flow passage branches into a plurality of upstream flow passages. The plurality of upstream flow passages include a branching upstream flow passage...
Substrate Detection Apparatus, Substrate Detection Method and Substrate
There is provided a substrate detection apparatus of detecting whether or not a substrate is normally supported by a support part at a predetermined position,...
MULTI-PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR
A multi-processing apparatus includes an electron beam irradiation unit, a dry etching unit and a transfer unit. The transfer unit is connected to the electron...
SUBSTRATE LIFT ASSEMBLIES
A substrate lift assembly is disclosed. The substrate lift assembly includes a lift frame, a plurality of fingers extending from the frame, the fingers adapted...
SYSTEMS AND METHODS FOR MICROWAVE-RADIATION ANNEALING
Systems and methods are provided for annealing a semiconductor structure using microwave radiation. A semiconductor structure is provided. One or more...
Apparatus and Methods for Annealing Wafers
A method includes performing an anneal on a wafer. The wafer includes a wafer-edge region, and an inner region encircled by the wafer-edge region. During the...
Laser annealing systems and methods with ultra-short dwell times
Laser annealing systems and methods for annealing a semiconductor wafer with ultra-short dwell times are disclosed. The laser annealing systems can include one...
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
The invention provides a substrate processing device and a substrate processing method for cooling a substrate, which are capable of conveying a substrate in a...
STAND ALONE ANNEAL SYSTEM FOR SEMICONDUCTOR WAFERS
A high throughput stand-alone anneal system has a horizontal row of docking stations at a front wall of an enclosure. A rack in the enclosure has a plurality...
Method and Apparatus for Planarizing Material Layers
A processing chamber is disclosed for planarizing material layers (for example, polymer layers). An exemplary processing chamber includes a substrate table...
APPARATUS AND METHOD OF MANUFACTURING DISPLAY DEVICE
An apparatus for manufacturing a display device, the apparatus including a loading chamber configured to receive a substrate from outside, a transfer chamber...
SYSTEMS AND METHODS FOR INTERNAL SURFACE CONDITIONING IN PLASMA PROCESSING
A method of conditioning internal surfaces of a plasma source includes flowing first source gases into a plasma generation cavity of the plasma source that is...
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE
A top plate when located at a first position is held by an opposing-member holder, and the top plate when located at a second position is held by a substrate...
SUBSTRATE PROCESSING APPARATUS
A substrate holding unit which holds the substrate, a nozzle which includes a first cylindrical member within which a first flow path along which the first...