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Patent # Description
2016/0240449 Method for Electrophoretically Depositing a Film on an Electronic Assembly
A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a...
2016/0240448 RF Package
An example package comprising: an RF circuit having a first portion and a second portion; a cavity structure positioned only over the first portion of the RF...
2016/0240447 DRIVER INTEGRATED CIRCUIT CHIP AND DISPLAY DEVICE HAVING THE SAME
A driver integrated circuit chip includes a plurality of monitoring bumps, a plurality of output bumps, a plurality of first inner wires electrically connected...
2016/0240446 SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
According to one embodiment, a semiconductor manufacturing apparatus includes a manufacturing processor, a signal acquisition unit, a frequency characteristic...
2016/0240445 Method for Positioning a Carrier with Electronic Components and Electronic Component Produced with Such Method
The present invention relates to a method of processing a solder masked carrier with electronic components, comprising the detection of a carrier related...
2016/0240444 Method of Semiconductor Fabrication with Height Control Through Active Region Profile
The present disclosure provides a method for fabricating an integrated circuit in accordance with some embodiments. The method includes forming a trench on a...
2016/0240443 Semiconductor Manufacturing Method and Tool
An overlay measurement and correction method and device is provided. In an embodiment the measurement device takes measurements of a first semiconductor wafer...
2016/0240442 Semiconductor Device and Method of Forming the Same
A method of forming a semiconductor device includes forming a gate stack over a substrate, forming an amorphized region in the substrate adjacent to an edge of...
2016/0240441 METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICES
An integrated circuit device includes a first transistor having a first channel between a first source/drain, and a second transistor having a second channel...
2016/0240440 SYSTEMS AND PROCESSES FOR FORMING THREE-DIMENSIONAL INTEGRATED CIRCUITS
Provided are systems and processes for forming a three-dimensional circuit on a substrate. A radiation source produces a beam that is directed at a substrate...
2016/0240439 Semiconductor Device and Method
A semiconductor device and method of manufacture are provided. In an embodiment a first semiconductor device and a second semiconductor device are formed...
2016/0240438 MODIFIED TUNGSTEN SILICON
A method for forming a precision resistor or an e-fuse structure where tungsten silicon is used. The tungsten silicon layer is modified by changing the...
2016/0240437 REDUCED HEIGHT M1 METAL LINES FOR LOCAL ON-CHIP ROUTING
Systems and methods are directed to an integrated circuit comprising a reduced height M1 metal line formed of an exemplary material with lower mean free path...
2016/0240436 METAL WIRING LAYER FORMING METHOD, METAL WIRING LAYER FORMING APPARATUS, AND RECORDING MEDIUM
A metal wiring layer can be formed within a recess of a substrate while suppressing the metal wiring layer from being formed at the outside of the recess. A...
2016/0240435 MICROELECTRONIC INTERCONNECT ADAPTOR
An interconnect adaptor may be fabricated having a substantially planar surface, to which a microelectronic package may be electrically attached, and a...
2016/0240434 Method for Via Plating with Seed Layer
Presented herein is a method for plating comprising providing a substrate having a dielectric layer formed over a trace, and forming a via/trench opening...
2016/0240433 RUTHENIUM FILM FORMING METHOD, FILM FORMING APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
A ruthenium film forming method includes a deposition process of introducing a mixed gas of a ruthenium carbonyl gas and a CO gas into a processing vessel 1 by...
2016/0240432 METHODS FOR FORMING COBALT-COPPER SELECTIVE FILL FOR AN INTERCONNECT
Methods for processing a substrate include: (a) depositing a cobalt layer to a first thickness within a first plurality of features and a second plurality of...
2016/0240431 MAGNETIC SIDEWALLS FOR WRITE LINES IN FIELD-INDUCED MRAM AND METHODS OF MANUFACTURING THEM
In one embodiment, there is provided a non-volatile magnetic memory cell. The non-volatile magnetic memory cell comprises a switchable magnetic element; and a...
2016/0240430 METHOD OF FABRICATING SEMICONDUCTOR DEVICE
A method for fabricating a semiconductor device includes forming a hard mask (HM) layer over a material layer, forming a first trench in the HM layer, which...
2016/0240429 Dielectric Structures with Negative Taper and Methods of Formation Thereof
A method for forming a dielectric structure includes forming an auxiliary layer over a substrate, and forming a hole within the auxiliary layer. A fill...
2016/0240428 Method of Forming an Interconnect Structure Having an Air Gap and Structure Thereof
A semiconductor device and method of manufacture are provided which utilize an air gap to help isolate conductive structures within a dielectric layer. A first...
2016/0240427 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
A semiconductor structure includes a substrate, at least one first epitaxial layer, and at least one second epitaxial layer. The substrate has a plurality of...
2016/0240426 SUBSTRATE SUPPORT WITH IMPROVED RF RETURN
Apparatus for processing a substrate are provided herein. In some embodiments, a substrate support includes a body having a support surface; an RF electrode...
2016/0240425 SUBSTRATE HOLDING MECHANISM AND SUBSTRATE PROCESSING APPARATUS USING THE SAME
There is provided a substrate holding mechanism of holding a substrate in a predetermined substrate holding region on a susceptor, including: a substrate...
2016/0240424 CHUCK TABLE OF PROCESSING APPARATUS
A chuck table in processing apparatus holds a frame unit in which a wafer is fixed to an opening of a ring-shaped frame with an intermediary of adhesive tape...
2016/0240423 EXPOSURE METHOD, MANUFACTURING METHOD OF DEVICE, AND THIN FILM SHEET
According to one embodiment, there is provided an exposure method. The method includes attaching a thin film sheet thermally shrinkable onto a rear face of a...
2016/0240422 ELECTROSTATIC CHUCK DEVICE
Provided is an electrostatic chuck device in which breakdown between an electrostatic chuck portion and a cooling base portion can be prevented, voltage...
2016/0240421 Barrier Seal for Electrostatic Chuck
Provided is a barrier seal for an electrostatic chuck in the plasma etching process. The barrier seal comprises multiple sealing portions to block the...
2016/0240420 DEVICE AND METHOD FOR ALIGNING SUBSTRATES
A method for aligning and bringing a first substrate into contact with a second substrate as well as a corresponding device with at least four detection units...
2016/0240419 ATOMIC-LAYER DEPOSITION SUBSTRATE
A substrate for fluidic levitation processing includes a moveable substrate and a levitation stabilizing structure located on the moveable substrate. The...
2016/0240418 SUBSTRATE HANDLING SYSTEM FOR ALIGNING AND ORIENTING SUBSTRATES DURING A TRANSFER OPERATION
A system for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so...
2016/0240417 Ceiling Transport Vehicle
A ceiling transport vehicle is provided in which any obstacle located below a vertically movable member can be detected properly while reducing any increase in...
2016/0240416 DEVICE AND METHOD FOR CONVEYING AND FLIPPING A COMPONENT
The present invention relates to a device (1) and method for conveying and flipping a component (10) for use in conjunction with a rotary turret module (30)....
2016/0240415 WAFER PROCESSING SYSTEM
Disclosed herein is a wafer processing system for processing wafers one at a time, the wafer processing system including: a plurality of trays each configured...
2016/0240414 Chuck for Suction and Holding a Wafer
The invention relates to a chuck and a method for suction and holding a wafer by said chuck, wherein the chuck comprises: a flat top face being subdivided into...
2016/0240413 SUBSTRATE PROCESSING APPARATUS
A supply flow passage branches into a plurality of upstream flow passages. The plurality of upstream flow passages include a branching upstream flow passage...
2016/0240412 Substrate Detection Apparatus, Substrate Detection Method and Substrate Processing System
There is provided a substrate detection apparatus of detecting whether or not a substrate is normally supported by a support part at a predetermined position,...
2016/0240411 MULTI-PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A multi-processing apparatus includes an electron beam irradiation unit, a dry etching unit and a transfer unit. The transfer unit is connected to the electron...
2016/0240410 SUBSTRATE LIFT ASSEMBLIES
A substrate lift assembly is disclosed. The substrate lift assembly includes a lift frame, a plurality of fingers extending from the frame, the fingers adapted...
2016/0240409 SYSTEMS AND METHODS FOR MICROWAVE-RADIATION ANNEALING
Systems and methods are provided for annealing a semiconductor structure using microwave radiation. A semiconductor structure is provided. One or more...
2016/0240408 Apparatus and Methods for Annealing Wafers
A method includes performing an anneal on a wafer. The wafer includes a wafer-edge region, and an inner region encircled by the wafer-edge region. During the...
2016/0240407 Laser annealing systems and methods with ultra-short dwell times
Laser annealing systems and methods for annealing a semiconductor wafer with ultra-short dwell times are disclosed. The laser annealing systems can include one...
2016/0240406 SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
The invention provides a substrate processing device and a substrate processing method for cooling a substrate, which are capable of conveying a substrate in a...
2016/0240405 STAND ALONE ANNEAL SYSTEM FOR SEMICONDUCTOR WAFERS
A high throughput stand-alone anneal system has a horizontal row of docking stations at a front wall of an enclosure. A rack in the enclosure has a plurality...
2016/0240404 Method and Apparatus for Planarizing Material Layers
A processing chamber is disclosed for planarizing material layers (for example, polymer layers). An exemplary processing chamber includes a substrate table...
2016/0240403 APPARATUS AND METHOD OF MANUFACTURING DISPLAY DEVICE
An apparatus for manufacturing a display device, the apparatus including a loading chamber configured to receive a substrate from outside, a transfer chamber...
2016/0240402 SYSTEMS AND METHODS FOR INTERNAL SURFACE CONDITIONING IN PLASMA PROCESSING EQUIPMENT
A method of conditioning internal surfaces of a plasma source includes flowing first source gases into a plasma generation cavity of the plasma source that is...
2016/0240401 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD
A top plate when located at a first position is held by an opposing-member holder, and the top plate when located at a second position is held by a substrate...
2016/0240400 SUBSTRATE PROCESSING APPARATUS
A substrate holding unit which holds the substrate, a nozzle which includes a first cylindrical member within which a first flow path along which the first...
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