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SUBSTRATE PACKAGING METHOD
The present invention provides a substrate packaging method, comprising steps of: step 1: providing a base substrate and a packaging substrate; step 2:...
The invention relates to boron-containing compounds with bicyclic structural units and to electronic devices, in particular organic electroluminescent devices,...
AZABORININE DERIVATIVES, THEIR SYNTHESIS AND USE IN ORGANIC ELECTRONIC
The present invention relates to azaborinine derivatives their synthesis as well as their use in organic electronic devices, particularly in organic light...
Peeling Method and Method of Manufacturing Semiconductor Device
There is provided a peeling method capable of preventing a damage to a layer to be peeled. Thus, not only a layer to be peeled having a small area but also a...
METHOD FOR PRODUCING FLEXIBLE DISPLAY PANEL
An embodiment of the present invention provides a method for producing a flexible display panel. The method includes the following steps of: providing a...
METHOD OF MANUFACTURING MASK
A method of manufacturing a mask includes aligning a mask substrate comprising a thin film at a processing position, forming a coating layer comprising a...
Memory Arrays and Methods of Forming Memory Arrays
Some embodiments include a memory array having a first series of access/sense lines which extend along a first direction, a second series of access/sense lines...
An electronic device includes a semiconductor unit. The semiconductor unit includes a first electrode and a second electrode spaced apart from each other in a...
One Transistor and One Resistive Random Access Memory (RRAM) Structure
The present disclosure provides a resistive random access memory (RRAM) cells and methods of making the same. The RRAM cell includes a transistor and an RRAM...
GATE-TUNABLE ATOMICALLY-THIN MEMRISTORS AND METHODS FOR PREPARING SAME AND
APPLICATIONS OF SAME
In one aspect of the invention, the memristor includes a monolayer film formed of an atomically thin material, where the monolayer film has at least one grain...
DOPANT-DRIVEN PHASE TRANSITIONS IN CORRELATED METAL OXIDES
Reversible phase transitions of exceptional magnitude may be induced in correlated metal oxides by altering their chemical compositions through reversible...
PHASE CHANGE MEMORY
A phase change memory includes a substrate, a number of row electrode leads located on the substrate, and a number of column electrode leads located on the...
MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
A memory device includes: a memory layer that is isolated for each memory cell and stores information by a variation of a resistance value; an ion source layer...
SPIN TORQUE TRANSFER MRAM DEVICE FORMED ON SILICON STUD GROWN BY SELECTIVE
A technique relates magnetoresistive random access memory (MRAM). A dielectric layer is disposed on a transistor, and the transistor is formed in a uniform...
ELECTRODE STRUCTURE FOR RESISTIVE MEMORY DEVICE
A semiconductor device includes an interconnect layer and a bottom electrode of a resistive memory device. The bottom electrode is coupled to the interconnect...
SELF-LIMITED CRACK ETCH TO PREVENT DEVICE SHORTING
A semiconductor device includes a piezoelectric layer interposed between a first metal layer and a hardmask layer. A first trench extends through the hardmask...
METHOD OF FABRICATING A BASE PLATE FOR PIEZO ACTUATION
A method of fabricating a base plate for piezoelectric actuation, comprises providing a plate having a major surface, striking a first removable portion of the...
A piezoelectric device including a substrate, at least two electrodes extending on the substrate, at least one piezoelectric strip extending on the substrate...
PIEZOELECTRIC DEVICES AND METHODS FOR THEIR PREPARATION AND USE
Methods for fabricating a piezoelectric device are provided. The methods can include providing a substrate and forming a nanocrystalline diamond layer on a...
CVD Nanocrystalline Silicon as Thermoelectric Material
A process for forming a doped nc-Si thin film thermoelectric material. A nc-Si thin film is slowly deposited on a substrate, either by hot-wire CVD (HWCVD)...
LARGE FOOTPRINT, HIGH POWER DENSITY THERMOELECTRIC MODULES FOR HIGH
KiloWatt-level, large footprint, high power density thermoelectric modules are disclosed for high temperature applications. The thermoelectric modules utilize...
THERMOELECTRIC CONVERTER HAVING THERMOELECTRIC CONVERSION ELEMENTS
CONNECTED TO EACH OTHER VIA WIRING PATTERN,...
A converter includes a first insulating substrate having a first surface on which a wiring pattern is formed, a second insulating substrate integrated with the...
METHODS TO SYNTHESIZE SINGLE SOURCE PRECURSORS AND METHODS TO DEPOSIT
NANOWIRE BASED THIN FILMS FOR HIGH...
Single source precursors, methods to synthesize single source precursors and methods to deposit nanowire based thin films using single source precursors for...
LIGHT-EMITTING DEVICE SUBSTRATE, LIGHT-EMITTING DEVICE, AND METHOD FOR
PRODUCING LIGHT-EMITTING DEVICE SUBSTRATE
In a light-emitting device substrate (2), a light reflecting surface covered with an anodized aluminum layer (12) is formed on one side of a base (14), and a...
LIGHT EMITTING DIODE
A light emitting diode including a first light emitting cell and a second light emitting cell separated from each other on a substrate, a first transparent...
LIGHT EMITTING DEVICE
A light emitting device includes a molded package and one or more light emitting components. The molded package includes a recess, two leads, and a molded...
OPTOELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
A method of producing a contact element for an optoelectronic component includes providing an auxiliary carrier with a sacrificial layer arranged on a top side...
Semiconductor Light Emitting Diode Chip
A semiconductor light emitting diode chip relates to the field of production technologies of a light emitting diode. In the present invention, corresponding...
SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD
FOR MANUFACTURING SEMICONDUCTOR ELEMENT
To provide a semiconductor element that can have the high adhesion between a substrate made of an oxide or the like and a metal film, a semiconductor element...
SEMICONDUCTOR LIGHT-EMITTING DEVICE
A semiconductor light-emitting device can include a wavelength converting layer including a surrounding portion, which covers at least one semiconductor...
SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING A SEMICONDUCTOR COMPONENT
A method of producing a semiconductor component includes providing an optoelectronic semiconductor chip; applying a molding compound for an optical element,...
LIGHT EMITTING DEVICE AND THE MANUFACTURING METHOD THEREOF
A light emitting device includes a semiconductor light emitting unit and a light-transmitting substrate. The light-transmitting substrate includes an upper...
LED PACKAGE WITH SURFACE TEXTURES AND METHODS OF FORMATION
Methods and apparatus are provided for LED packages with surface textures. In one novel aspect, microstructures are formed on surfaces of the LED package such...
ENCAPSULATION OF LIGHT-EMITTING ELEMENTS ON A DISPLAY MODULE
A display module comprises a circuit board having a front face, a plurality of light-emitting elements electrically coupled to the front face of the circuit...
A light-emitting device including a light-emitting unit, an electrode unit, and an insulating unit is provided. The light-emitting unit includes an illuminator...
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
A display device and a manufacturing method of the same are provided. The display device includes a first substrate, a second substrate, a display element, an...
PHOSPHOR, LIGHT-EMITTING APPARATUS INCLUDING THE SAME, AND PHOSPHOR
A phosphor, which is represented by the general formula containing M, Ce, Pr, Si, and N, is provided. M is at least one element selected from the group...
MOLDED PACKAGE AND LIGHT EMITTING DEVICE
A molded package includes a recess, leads, and a molded resin part. The leads include a first lead and a second lead. A part of the recess is defined by a side...
MOUNTING SUBSTRATE AND ELECTRONIC DEVICE INCLUDING THE SAME
A mounting substrate includes: a base; and at least one pair of wiring patterns disposed apart from each other on the base. At least one of the wiring patterns...
LED INTEGRATED PACKAGING STRUCTURE AND METHOD
An LED integrated packaging structure is disclosed including a base; at least one LED chip which is fixedly connected on the base, the LED chip having positive...
PARTIAL SPACERS FOR WAFER-LEVEL FABRICATED MODULES
An optoelectronic module includes a cover substrate including a passive optical element, a base substrate including an optoelectronic device, and a spacer...
LEDS WITH EFFICIENT ELECTRODE STRUCTURES
Aspects include Light Emitting Diodes that have a GaN-based light emitting region and a metallic electrode. The metallic electrode can be physically separated...
LIGHT EMITTING DIODE
A light emitting diode including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode,...
METHOD OF LIGHT EMITTING DIODE SIDEWALL PASSIVATION
A Light-Emitting Diode (LED) includes a light-emitting structure having a passivation layer disposed on vertical sidewalls across a first doped layer, an...
LIGHT-EMITTING DIODE CHIP
A light-emitting diode chip including a semiconductor device layer, a first electrode, a current-blocking layer, a current-spreading layer, and a second...
LIGHT EMITTING DIODE
A light emitting diode includes a light emitting structure including first and second conductive type semiconductor layers and an active layer disposed...
NITRIDE LIGHT-EMITTING DIODE
A nitride light-emitting diode includes a substrate, an n-type nitride layer, a light-emitting layer, a p-type nitride layer, a p+ layer, an AlInN layer, an n+...
METHOD OF BONDING A SEMICONDUCTOR DEVICE TO A SUPPORT SUBSTRATE
A method according to embodiments of the invention includes providing a wafer of semiconductor devices grown on a growth substrate. The wafer of semiconductor...
NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICONDUCTOR ELEMENT, AND METHOD FOR
MANUFACTURING NITRIDE SEMICONDUCTOR...
A nitride semiconductor wafer includes a silicon substrate, a first layer, a second layer, a third layer, a fourth layer, a fifth layer, and a sixth layer. The...
GALLIUM NITRIDE ON 3C-SiC COMPOSITE WAFER
We disclose a semiconductor structure comprising a monocrystalline silicon wafer; spaced apart monocrystalline silicon carbide layers disposed directly on the...