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Patent # Description
2016/0260895 METHODS OF MANUFACTURING A MAGNETIC FIELD SENSOR
A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a...
2016/0260894 METHODS OF MANUFACTURING A MAGNETIC FIELD SENSOR
A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a...
2016/0260893 Magnetic Tunnel Junction Patterning Using Low Atomic Weight Ion Sputtering
A method of magnetic tunnel junction patterning for magnetoresisitive random access memory devices using low atomic weight ion sputtering. The method includes:...
2016/0260892 MAGNETIC MEMORY WITH TUNNELING MAGNETORESISTANCE ENHANCED SPACER LAYER
A device and a method of forming a device are presented. A substrate is provided. The substrate includes circuit component formed on a substrate surface. Back...
2016/0260891 MAGNETIC MEMORY WITH TUNNELING MAGNETORESISTANCE ENHANCED SPACER LAYER
A device and a method of forming a device are presented. A substrate is provided. The substrate includes circuit component formed on a substrate surface. Back...
2016/0260890 NOVEL PERPENDICULAR MAGNETORESISTIVE ELEMENTS
A perpendicular magnetoresistive element comprises a novel buffer layer provided on a surface of the recording layer, which is opposite to a surface of the...
2016/0260889 Magnetic Tunnel Junction Patterning Using Low Atomic Weight Ion Sputtering
A method of magnetic tunnel junction patterning for magnetoresisitive random access memory devices using low atomic weight ion sputtering. The method includes:...
2016/0260888 DIELECTRIC ELASTOMER ACTAUTOR
A dielectric elastomer actuator includes an elastomeric film and an electrode material layer on opposing sides of the film. The elastomeric film includes a...
2016/0260887 PIEZOELECTRIC WAFER, PIEZOELECTRIC VIBRATION PIECE, AND PIEZOELECTRIC VIBRATOR
This piezoelectric wafer has: a piezoelectric vibration piece; a frame portion that supports the piezoelectric vibration piece; and a coupling portion that...
2016/0260886 PIEZOELECTRIC RESONATOR ELEMENT, PIEZOELECTRIC DEVICE USING THE PIEZOELECTRIC RESONATOR ELEMENT, METHOD FOR...
A crystal resonator element 2 has excitation electrodes 23a, 23b formed on front and back main surfaces of a crystal resonator plate. Each of the excitation...
2016/0260885 ULTRASONIC TRANSDUCER AND MANUFACTURE METHOD THEREOF
The present application relates to the technical field of transducer, it provides an ultrasonic transducer and the manufacture method therefore. The ultrasonic...
2016/0260884 CONTINUOUS BRAZING SYSTEM AND BRAZING PROCESS
A brazing system (1) for manufacturing an armored superconductor wire (10, 10a) comprises: --a first feeder (5) of a superconductor wire (11), --a second...
2016/0260883 THERMOELECTRIC CONVERSION ELEMENT AND METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION ELEMENT
Provided are a thermoelectric conversion element which has a thermoelectric conversion layer made of an organic material and is capable of generating electric...
2016/0260882 THERMOELECTRIC CONVERSION MATERIAL, THERMOELECTRIC CONVERSION ELEMENT, ARTICLE FOR THERMOELECTRIC POWER...
Provided are the following: a thermoelectric conversion element including, on a substrate, a first electrode, a thermoelectric conversion layer and a second...
2016/0260881 Systems, Methods, and Materials for Cryogenic Thermoelectric Cooling
Materials and systems and methods of manufacture thereof that function as thermoelectric materials both in and near a cryogenic temperature range. In...
2016/0260880 LIGHT-EMITTING DEVICE USING MOUNTING SUBSTRATE
A light-emitting device uses a mounting substrate wherein insulation resistance of a metal substrate having an oxide film formed on the surface thereof is...
2016/0260879 LIGHT EMITTING PACKAGE HAVING A GUIDING MEMBER GUIDING AN OPTICAL MEMBER
A light emitting device package including a base including a top flat surface; an insulating layer on the base; a light emitting diode on the base; an optical...
2016/0260878 MOUNT SUBSTRATE AND LED MODULE WITH THE SAME
A mount substrate includes: an insulation substrate containing resin and glass; connection conductors formed on a surface of the insulation substrate; a first...
2016/0260877 LED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
A manufacturing method of an LED package structure includes the steps of providing a base; disposing an LED chip on the base; electrically connecting the base...
2016/0260876 LED LIGHT SOURCE AND MANUFACTURING METHOD THEREOF
The present invention is related to a LED light source and its manufacturing method. It is related to the LED technology field. The LED light source includes a...
2016/0260875 ANISOTROPIC CONDUCTIVE FILM (ACF) INCLUDING A RELFECTIVE LAYER
An anisotropic conductive film (ACF) is disclosed. In one approach, the ACF includes a non-reflective adhesive layer including a top surface, a plurality of...
2016/0260874 PRODUCING A LIGHTING MODULE
A method for producing a lighting module is provided. The method includes providing a light source substrate populated with at least one semiconductor light...
2016/0260873 LIGHT EMITTING DEVICE
A light emitting device having a light-emitting element, a covering resin covering the light-emitting element, a wavelength converting material contained in...
2016/0260872 SUBSTRATE FOR LED WITH TOTAL-INTERNAL REFLECTION LAYER SURROUNDING LED
A packaged LED module includes an LED die mounted on a substrate surface. Formed on the substrate surface and surrounding the die is a first layer of a low...
2016/0260871 LED MODULE
An LED module includes a mount board and an LED chip. The mount board includes: an insulation substrate that includes resin and glass; a first conductor, a...
2016/0260870 Optoelectronic Semiconductor Chip
An optoelectronic semiconductor chip is disclosed. In an embodiment the optoelectronic semiconductor chip includes a semiconductor body of semiconductor...
2016/0260869 SEMICONDUCTOR LIGHT EMITTING DEVICE
Disclosed is a semiconductor light emitting device, including: a plurality of semiconductor layers grown sequentially on a growth substrate; a first electrode...
2016/0260868 GROUP III NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE AND PRODUCTION METHOD THEREFOR
There is provided a Group III nitride semiconductor light-emitting device in which electrons and holes are suppressed to be captured by threading dislocation,...
2016/0260867 Semiconductor Material Doping
A solution for designing and/or fabricating a structure including a quantum well and an adjacent barrier is provided. A target band discontinuity between the...
2016/0260866 III-NITRIDE NANOWIRE LED WITH STRAIN MODIFIED SURFACE ACTIVE REGION AND METHOD OF MAKING THEREOF
A light emitting diode (LED) device includes a semiconductor nanowire core, and an In(Al)GaN active region quantum well shell located radially around the...
2016/0260865 SEPARATING A WAFER OF LIGHT EMITTING DEVICES
Embodiments of the invention are directed to a method of separating a wafer of light emitting devices. The method includes scribing a first groove on a dicing...
2016/0260864 REMOVAL OF 3D SEMICONDUCTOR STRUCTURES BY DRY ETCHING
Various embodiments include methods of fabricating a semiconductor device that include providing a plurality of nanostructures extending away from a support,...
2016/0260863 METHODS OF GROWING HETEROEPITAXIAL SINGLE CRYSTAL OR LARGE GRAINED SEMICONDUCTOR FILMS AND DEVICES THEREON
A method is provided for depositing textured wide bandgap materials, such as polymers or perovskites, on a textured transparent conducting oxide on inorganic...
2016/0260862 SIGNAL COUPLING DEVICE
A signal coupling device includes a light-emitting element configured to emit light, a first element to drive the light-emitting element to output an optical...
2016/0260861 MULTIBAND DOUBLE JUNCTION PHOTODIODE AND RELATED MANUFACTURING PROCESS
A photodiode structure is based on the use of a double junction sensitive to different wavelength bands based on a magnitude of a reverse bias applied to the...
2016/0260860 SOLAR CELL DEVICE
A device having a multi-junction solar cell and a protection diode structure, whereby the multi-junction solar cell and the protection diode structure have a...
2016/0260859 PHOTOVOLTAIC DEVICES WITH AN INTERFACIAL BAND-GAP MODIFYING STRUCTURE AND METHODS FOR FORMING THE SAME
A Schottky-barrier-reducing layer is provided between a p-doped semiconductor layer and a transparent conductive material layer of a photovoltaic device. The...
2016/0260858 SOLAR CELL MODULE
A solar cell module includes: first and second solar cell strings each including solar cells arranged in an arrangement direction and electrically connected to...
2016/0260857 Multilayer Down-Converting Encapsulant Films and Electronic Devices Including the Same
A multilayer encapsulant film having at least two layers includes a first layer comprising an encapsulant resin, and a second layer comprising an encapsulant...
2016/0260856 SOLAR PHOTOVOLTAIC GENERATION MODULE
The invention has for its object to provide a solar photovoltaic generation module capable of being used over an extended period of time while keeping on its...
2016/0260855 ASSEMBLIES OF SOLAR CELLS WITH CURVED EDGES
Solar cells can be obtained by dividing a substantially circular solar cell wafer into portions featuring straight and arcuate edges, which are then combined...
2016/0260854 SOLAR CELL MODULE AND METHOD OF MANUFACTURING THE SAME
A method of manufacturing a solar cell module can include positioning an upper protective layer on a transparent member; positioning a plurality of solar cells...
2016/0260853 Method for Producing the Rear Contact Layer for CdTe Thin-Film Solar Cells
The present invention concerns a method for the manufacture of the first layer of a back contact layer for thin-layer solar cells in superstrate configuration....
2016/0260852 SOLAR CELL, MANUFACTURING METHOD THEREOF, AND SOLAR CELL MODULE
A solar cell includes: a first-conductivity-type semiconductor substrate that includes an impurity diffusion layer on one surface side, which is a light...
2016/0260851 METHOD FOR MANUFACTURING A FRONT ELECTRODE OF A SEMICONDUCTOR DEVICE
The present invention provides a method for manufacturing a front electrode of a semiconductor device. The method includes using an electrically conductive...
2016/0260850 ELECTRICALLY CONDUCTIVE PASTE FOR FRONT ELECTRODE OF SOLAR CELL AND PREPARATION METHOD THEREOF
The present invention provides an electrically conductive paste for a front electrode of a solar cell and a preparation method thereof. The electrically...
2016/0260849 INTEGRATED PHOTODETECTOR WAVEGUIDE STRUCTURE WITH ALIGNMENT TOLERANCE
An encapsulated integrated photodetector waveguide structures with alignment tolerance and methods of manufacture are disclosed. The method includes forming a...
2016/0260848 Method for Laser Curing of Anti-Reflective Coatings
A method of curing anti-reflective coatings, and photovoltaic modules produced using the method, are described.
2016/0260847 METHOD AND APPARATUS FOR MANUFACTURING OPTICAL DEVICE
An optical device manufacturing apparatus includes an encapsulating device for encapsulating an optical semiconductor element mounted on a substrate by a...
2016/0260846 UNGUARDED SCHOTTKY BARRIER DIODES
One embodiment of the disclosure relates to an unguarded Schottky barrier diode. The diode includes a cathode that has a recessed region and a dielectric...
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