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Patent # Description
2016/0260695 FAN OUT SYSTEM IN PACKAGE AND METHOD FOR FORMING THE SAME
Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), stacked...
2016/0260694 Laser Marking in Packages
A package includes a device die, a first plurality of redistribution lines underlying the device die, a second plurality of redistribution lines overlying the...
2016/0260693 SEMICONDUCTOR PACKAGE ASSEMBLY
The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package including a first...
2016/0260692 COMBINED MULTICOLORED AND WHITE LED LAMP
Disclosed is a combined light emitting diode lamp that utilizes a multicolored light emitting diode that is capable of creating a full spectrum of colors....
2016/0260691 SEMICONDUCTOR MODULE
A semiconductor module includes: a first semiconductor chip including a surface provided with a first signal electrode; a second semiconductor chip arranged...
2016/0260690 SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS
Embodiments of the present disclosure describe scalable package architecture of an integrated circuit (IC) assembly and associated techniques and...
2016/0260689 PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES
A package-on-package stacked microelectronic structure comprising a pair of microelectronic packages attached to one another in a flipped configuration. In one...
2016/0260688 ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC DEVICES
An electronic assembly that includes a first electronic device. The first electronic device includes a cavity that extends into a back side of the first...
2016/0260687 EMBEDDED GRAPHITE HEAT SPREADER FOR 3DIC
A device with thermal control is presented. In some embodiments, the device includes a plurality of die positioned in a stack, each die including a chip,...
2016/0260686 RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A first resin encapsulated body (25) and a second resin encapsulated body (26) are stacked to form a resin-encapsulated semiconductor device. The first resin...
2016/0260685 Embedded Circuit Package
An embedded integrated circuit package is made by providing a substrate with a patterned conductor layer defining bond pads. One or more components typically...
2016/0260684 SYSTEM IN PACKAGE FAN OUT STACKING ARCHITECTURE AND PROCESS FLOW
Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), and a...
2016/0260683 SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor chip provided with a plurality of bumps arranged in a peripheral alignment, a substrate provided with a...
2016/0260682 FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
A method of making a semiconductor device can include providing a temporary carrier with a semiconductor die mounting site, and forming conductive...
2016/0260681 INTERFACIAL ALLOY LAYER FOR IMPROVING ELECTROMIGRATION (EM) RESISTANCE IN SOLDER JOINTS
A method of forming a structure for an interfacial alloy layer which is able to improve the electromigration (EM) resistance of a solder joint. More...
2016/0260680 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A method for manufacturing a semiconductor device includes the steps of mounting a Si interposer over a printed wiring substrate, plasma-cleaning an upper...
2016/0260679 HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH
Apparatuses, processes, and systems related to an interconnect with an increased z-height and decreased reflow temperature are described herein. In...
2016/0260678 SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor substrate, a front surface electrode provided on a front surface of the semiconductor substrate, a solder...
2016/0260677 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
The present disclosure relates to a semiconductor device and a method for manufacturing the same. The semiconductor device includes a semiconductor die, a...
2016/0260676 SEMICONDUCTOR DEVICE HAVING GUARD METAL THAT SUPPRESS INVASION OF MOISTURE
A semiconductor device having a structure to suppress invasion of moisture into a device area is disclosed. The semiconductor device provides the device area...
2016/0260675 SLOTTED SUBSTRATE FOR DIE ATTACH INTERCONNECTS
A method of forming slots into a substrate surrounding via interconnects at the periphery of a die to create a standoff between mismatched materials and the...
2016/0260674 REMOVAL OF INTEGRATED CIRCUIT CHIPS FROM A WAFER
Upon a wafer, integrated circuit (IC) chips are separated by a kerf that includes a through kerf via (TKV). The chips are removed from the wafer and separated...
2016/0260673 Method for Increasing Adhesion of Copper to Polymeric Surfaces
Disclosed herein are methods and systems for conditioning a polymeric layer on a substrate to enable adhesion of a metal layer to the polymeric layer....
2016/0260672 SEMICONDUCTOR APPARATUS
A semiconductor apparatus has a configuration in which multiple copper wiring layers and multiple insulating layers are alternately layered. A low-impedance...
2016/0260671 MICROELECTRONIC PACKAGE WITH CONSOLIDATED CHIP STRUCTURES
A chip package has multiple chips that may be arranged side-by-side or in a staggered, stair step arrangement. The contacts of the chips are connected to...
2016/0260670 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
An upper surface of a plug (PL1) is formed so as to be higher than an upper surface of an interlayer insulating film (PIL) by forming the interlayer insulating...
2016/0260669 FINFETS HAVING STEP SIDED CONTACT PLUGS AND METHODS OF MANUFACTURING THE SAME
A semiconductor device includes an active fin extending in a first direction on a substrate, a gate electrode intersecting the active fin and extending in a...
2016/0260668 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor integrated circuit device capable of stably forming a fuse element that is used to adjust the characteristics of the semiconductor integrated...
2016/0260667 Semiconductor Devices Including Conductive Features with Capping Layers and Methods of Forming the Same
Semiconductor devices, methods of manufacture thereof, and methods of forming conductive features thereof are disclosed. A semiconductor device includes an...
2016/0260666 SELF-ALIGNED VIA AND AIR GAP
Provided are approaches for forming a self-aligned via and an air gap within a semiconductor device. Specifically, one approach produces a device having: a...
2016/0260665 Interconnect Structure Having Air Gap and Method of Forming the Same
A representative semiconductor device includes a first dielectric layer overlying a substrate, at least a first opening in the first dielectric layer, a...
2016/0260664 SEMICONDUCTOR STRUCTURES INCLUDING RAILS OF DIELECTRIC MATERIAL
Methods of forming semiconductor structures that include bodies of a semiconductor material disposed between rails of a dielectric material are disclosed. Such...
2016/0260663 SEPARATED LOWER SELECT LINE IN 3D NAND ARCHITECTURE
Roughly described, a memory device has a multilevel stack of conductive layers which are divided laterally into separate word lines, each defining a block of...
2016/0260662 Systems and Methods for Main Distribution on an Integrated Circuit
Systems, methods, devices, circuits for distributing signals and/or potentials on an integrated circuit.
2016/0260661 WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE
A wiring substrate includes a core layer including a plate-like body and linear conductors, a first wiring layer formed on a first surface of the plate-like...
2016/0260660 ELECTRONIC DEVICE AND ELECTRONIC PACKAGE THEREOF
An electronic package is provided, including a substrate and a semiconductor chip. The substrate has a plurality of substrate pads. The semiconductor chip is...
2016/0260659 SEMICONDUCTOR PACKAGE ASSEMBLY
The invention provides a semiconductor package assembly. The semiconductor package assembly includes a redistribution layer (RDL) structure die-attach surface...
2016/0260658 Source Down Semiconductor Devices and Methods of Formation Thereof
A method for forming a semiconductor device includes forming device regions in a semiconductor substrate having a first side and a second side. The device...
2016/0260657 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
In a semiconductor package, surfaces of a die pad, a semiconductor element, a connecting member, and a lead are subjected to a surface treatment with a silane...
2016/0260656 ELECTRONIC PACKAGE STRUCTURE
An electronic package includes a lead frame structure having one or more structural features configured to improve board level reliability. In one embodiment,...
2016/0260655 PACKAGE SUBSTRATE, PACKAGE STRUCTURE INCLUDING THE SAME, AND THEIR FABRICATION METHODS
This disclosure provides a package substrate, a package structure including the same and their fabrication methods. The package substrate comprises: a first...
2016/0260654 PLASTIC COOLER FOR SEMICONDUCTOR MODULES
A cooling apparatus includes a plurality of discrete modules and a plastic housing. Each module includes a semiconductor die encapsulated by a mold compound, a...
2016/0260653 SEMICONDUCTOR DEVICE
Provided is a semiconductor device. The semiconductor device includes a substrate including a cantilever configured to generate a flow of cooling media through...
2016/0260652 LASER DRILLING ENCAPSULATED SEMICONDUCTOR DIE TO EXPOSE ELECTRICAL CONNECTION THEREIN
A method of making an integrated circuit package that contains a semiconductor die having one or more electrical connections to an electronic circuit within...
2016/0260651 SEMICONDUCTOR DEVICE
A semiconductor device and a method of making the same. The device includes an electrically conductive heat sink having a first surface. The device also...
2016/0260650 SEMICONDUCTOR MODULE
A semiconductor module, which is mounted on an object for mounting and cooled by a cooler to which cooling medium is supplied, the semiconductor module...
2016/0260649 WAVELENGTH SELECTIVE HEAT RADIATION MATERIAL SELECTIVELY RADIATING HEAT RADIATION LIGHT CORRESPONDING TO...
An object is to provide a method for manufacturing a wavelength selective heat radiation material in which a surface roughness of an upper portion of a cavity...
2016/0260648 SEMI-CONDUCTOR MODULE WITH AN ENCAPSULATING CEMENT MASS THAT COVERS A SEMI-CONDUCTOR COMPONENT
A semi-conductor module with an encapsulating mass that covers a semi-conductor component, in which the encapsulating mass is cement.
2016/0260647 METHOD FOR PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
A microelectronic assembly (10) includes a substrate (12) having a first and second opposed surfaces. A microelectronic element (22) overlies the first surface...
2016/0260646 Semiconductor Device and Method of Self-Confinement of Conductive Bump Material During Reflow Without Solder Mask
A semiconductor device has a semiconductor die with a die bump pad. A substrate has a conductive trace with an interconnect site. A conductive bump material is...
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