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FAN OUT SYSTEM IN PACKAGE AND METHOD FOR FORMING THE SAME
Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), stacked...
Laser Marking in Packages
A package includes a device die, a first plurality of redistribution lines underlying the device die, a second plurality of redistribution lines overlying the...
SEMICONDUCTOR PACKAGE ASSEMBLY
The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package including a first...
COMBINED MULTICOLORED AND WHITE LED LAMP
Disclosed is a combined light emitting diode lamp that utilizes a multicolored light emitting diode that is capable of creating a full spectrum of colors....
A semiconductor module includes: a first semiconductor chip including a surface provided with a first signal electrode; a second semiconductor chip arranged...
SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS
Embodiments of the present disclosure describe scalable package architecture of an integrated circuit (IC) assembly and associated techniques and...
PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES
A package-on-package stacked microelectronic structure comprising a pair of microelectronic packages attached to one another in a flipped configuration. In one...
ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC DEVICES
An electronic assembly that includes a first electronic device. The first electronic device includes a cavity that extends into a back side of the first...
EMBEDDED GRAPHITE HEAT SPREADER FOR 3DIC
A device with thermal control is presented. In some embodiments, the device includes a plurality of die positioned in a stack, each die including a chip,...
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE
A first resin encapsulated body (25) and a second resin encapsulated body (26) are stacked to form a resin-encapsulated semiconductor device. The first resin...
Embedded Circuit Package
An embedded integrated circuit package is made by providing a substrate with a patterned conductor layer defining bond pads. One or more components typically...
SYSTEM IN PACKAGE FAN OUT STACKING ARCHITECTURE AND PROCESS FLOW
Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), and a...
A semiconductor device includes a semiconductor chip provided with a plurality of bumps arranged in a peripheral alignment, a substrate provided with a...
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
A method of making a semiconductor device can include providing a temporary carrier with a semiconductor die mounting site, and forming conductive...
INTERFACIAL ALLOY LAYER FOR IMPROVING ELECTROMIGRATION (EM) RESISTANCE IN
A method of forming a structure for an interfacial alloy layer which is able to improve the electromigration (EM) resistance of a solder joint. More...
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A method for manufacturing a semiconductor device includes the steps of mounting a Si interposer over a printed wiring substrate, plasma-cleaning an upper...
HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH
Apparatuses, processes, and systems related to an interconnect with an increased z-height and decreased reflow temperature are described herein. In...
A semiconductor device includes a semiconductor substrate, a front surface electrode provided on a front surface of the semiconductor substrate, a solder...
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
The present disclosure relates to a semiconductor device and a method for manufacturing the same. The semiconductor device includes a semiconductor die, a...
SEMICONDUCTOR DEVICE HAVING GUARD METAL THAT SUPPRESS INVASION OF MOISTURE
A semiconductor device having a structure to suppress invasion of moisture into a device area is disclosed. The semiconductor device provides the device area...
SLOTTED SUBSTRATE FOR DIE ATTACH INTERCONNECTS
A method of forming slots into a substrate surrounding via interconnects at the periphery of a die to create a standoff between mismatched materials and the...
REMOVAL OF INTEGRATED CIRCUIT CHIPS FROM A WAFER
Upon a wafer, integrated circuit (IC) chips are separated by a kerf that includes a through kerf via (TKV). The chips are removed from the wafer and separated...
Method for Increasing Adhesion of Copper to Polymeric Surfaces
Disclosed herein are methods and systems for conditioning a polymeric layer on a substrate to enable adhesion of a metal layer to the polymeric layer....
A semiconductor apparatus has a configuration in which multiple copper wiring layers and multiple insulating layers are alternately layered. A low-impedance...
MICROELECTRONIC PACKAGE WITH CONSOLIDATED CHIP STRUCTURES
A chip package has multiple chips that may be arranged side-by-side or in a staggered, stair step arrangement. The contacts of the chips are connected to...
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
An upper surface of a plug (PL1) is formed so as to be higher than an upper surface of an interlayer insulating film (PIL) by forming the interlayer insulating...
FINFETS HAVING STEP SIDED CONTACT PLUGS AND METHODS OF MANUFACTURING THE
A semiconductor device includes an active fin extending in a first direction on a substrate, a gate electrode intersecting the active fin and extending in a...
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE
A semiconductor integrated circuit device capable of stably forming a fuse element that is used to adjust the characteristics of the semiconductor integrated...
Semiconductor Devices Including Conductive Features with Capping Layers
and Methods of Forming the Same
Semiconductor devices, methods of manufacture thereof, and methods of forming conductive features thereof are disclosed. A semiconductor device includes an...
SELF-ALIGNED VIA AND AIR GAP
Provided are approaches for forming a self-aligned via and an air gap within a semiconductor device. Specifically, one approach produces a device having: a...
Interconnect Structure Having Air Gap and Method of Forming the Same
A representative semiconductor device includes a first dielectric layer overlying a substrate, at least a first opening in the first dielectric layer, a...
SEMICONDUCTOR STRUCTURES INCLUDING RAILS OF DIELECTRIC MATERIAL
Methods of forming semiconductor structures that include bodies of a semiconductor material disposed between rails of a dielectric material are disclosed. Such...
SEPARATED LOWER SELECT LINE IN 3D NAND ARCHITECTURE
Roughly described, a memory device has a multilevel stack of conductive layers which are divided laterally into separate word lines, each defining a block of...
Systems and Methods for Main Distribution on an Integrated Circuit
Systems, methods, devices, circuits for distributing signals and/or potentials on an integrated circuit.
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE
A wiring substrate includes a core layer including a plate-like body and linear conductors, a first wiring layer formed on a first surface of the plate-like...
ELECTRONIC DEVICE AND ELECTRONIC PACKAGE THEREOF
An electronic package is provided, including a substrate and a semiconductor chip. The substrate has a plurality of substrate pads. The semiconductor chip is...
SEMICONDUCTOR PACKAGE ASSEMBLY
The invention provides a semiconductor package assembly. The semiconductor package assembly includes a redistribution layer (RDL) structure die-attach surface...
Source Down Semiconductor Devices and Methods of Formation Thereof
A method for forming a semiconductor device includes forming device regions in a semiconductor substrate having a first side and a second side. The device...
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
In a semiconductor package, surfaces of a die pad, a semiconductor element, a connecting member, and a lead are subjected to a surface treatment with a silane...
ELECTRONIC PACKAGE STRUCTURE
An electronic package includes a lead frame structure having one or more structural features configured to improve board level reliability. In one embodiment,...
PACKAGE SUBSTRATE, PACKAGE STRUCTURE INCLUDING THE SAME, AND THEIR
This disclosure provides a package substrate, a package structure including the same and their fabrication methods. The package substrate comprises: a first...
PLASTIC COOLER FOR SEMICONDUCTOR MODULES
A cooling apparatus includes a plurality of discrete modules and a plastic housing. Each module includes a semiconductor die encapsulated by a mold compound, a...
Provided is a semiconductor device. The semiconductor device includes a substrate including a cantilever configured to generate a flow of cooling media through...
LASER DRILLING ENCAPSULATED SEMICONDUCTOR DIE TO EXPOSE ELECTRICAL
A method of making an integrated circuit package that contains a semiconductor die having one or more electrical connections to an electronic circuit within...
A semiconductor device and a method of making the same. The device includes an electrically conductive heat sink having a first surface. The device also...
A semiconductor module, which is mounted on an object for mounting and cooled by a cooler to which cooling medium is supplied, the semiconductor module...
WAVELENGTH SELECTIVE HEAT RADIATION MATERIAL SELECTIVELY RADIATING HEAT
RADIATION LIGHT CORRESPONDING TO...
An object is to provide a method for manufacturing a wavelength selective heat radiation material in which a surface roughness of an upper portion of a cavity...
SEMI-CONDUCTOR MODULE WITH AN ENCAPSULATING CEMENT MASS THAT COVERS A
A semi-conductor module with an encapsulating mass that covers a semi-conductor component, in which the encapsulating mass is cement.
METHOD FOR PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION
A microelectronic assembly (10) includes a substrate (12) having a first and second opposed surfaces. A microelectronic element (22) overlies the first surface...
Semiconductor Device and Method of Self-Confinement of Conductive Bump
Material During Reflow Without Solder Mask
A semiconductor device has a semiconductor die with a die bump pad. A substrate has a conductive trace with an interconnect site. A conductive bump material is...