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Patent # Description
2016/0262297 Loropetalum plant named 'Beni Hime'
A new and distinct Loropetalum cultivar named `BENI HIME` is disclosed, characterized by very small, glossy deep red/maroon foliage that holds its color well...
2016/0262296 Loropetalum plant named 'Irodori'
A new and distinct Loropetalum cultivar named `IRODORI` is disclosed, characterized by bright pink, white, green and maroon variegated foliage, tall upright...
2016/0262295 Loropetalum plant named 'Hakuou'
A new and distinct Loropetalum cultivar named `HAKUOU` is disclosed, characterized by dark green foliage and bright white re-blooming flowers. Plant form is...
2016/0262294 Loropetalum plant named 'KURENAI DAIOU'
A new and distinct Loropetalum cultivar named `KURENAI DAIOU` is disclosed, characterized by extremely large burgundy colored foliage. Additionally it has an...
2016/0262293 LOROPETALUM PLANT NAMED 'KURENAI'
A new and distinct Loropetalum cultivar named `KURENAI` is disclosed, characterized by deep red foliage and deep pink flowers. Dwarf, mounded form and a bright...
2016/0262292 CIRCUIT ELEMENT PACKAGE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING APPARATUS THEREOF
A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit...
2016/0262291 GASKET HAVING TWO REGIONS OF FOAM DENSITIES
Fabric-over-foam (and foil-over-foam) electromagnetic interference attenuating gaskets having a body of indefinite length are disclosed, the gaskets having a...
2016/0262290 HEAT SINK-BASED SINGLE-BOARD COMPUTER HOLDER ASSEMBLY
A heat sink-based single-board computer holder assembly includes heat sink including base, mounting flanges located at opposing top and bottom sides of base,...
2016/0262289 HEAT SPREADER-BASED HEAT SINK MODULE
A heat spreader-based heat sink module includes a heat spreader; a radiation fin set consisting of middle radiation fins on the middle and lateral radiation...
2016/0262288 ACTIVE CONTROL FOR TWO-PHASE COOLING
Methods and devices for active control for two-phase cooling include a cooling volume that has cavities and active coolant flow controls in the cavities...
2016/0262287 COOLED ELECTRONIC SYSTEM
A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to...
2016/0262286 CONFIGURABLE AIR BAFFLE FOR DIRECTING AIRFLOW WITHIN INFORMATION HANDLING SYSTEMS
An air baffle for directing air within an information handling system is disclosed. The air baffle includes an open region configured to permit passage of an...
2016/0262285 ENSURING PROPER HEAT SINK INSTALLATION IN INFORMATION HANDLING SYSTEMS
Systems and apparatuses for ensuring proper heat sink installation in an information handling system are disclosed. The information handling system may include...
2016/0262284 COLD PLATE STRUCTURE
A cold plate structure comprises a plate body and a pipe. The plate body has a first side and a second side. A groove is formed on the second side. The pipe is...
2016/0262283 SYSTEM WITH MOVABLE COMPUTING DEVICES
A system for providing computing resources includes a mounting bar and one or more computing devices supported on the mounting bar. The computing devices are...
2016/0262282 MULTI-NODE SERVER PLATFORM
A multi-node server platform including a cubby chassis and at least one multi-server sled. The cubby chassis includes partitions defining a plurality of sled...
2016/0262281 POWER BOARD AND BALLAST MODULE AND PROJECTOR USING THE SAME
A power board and ballast module includes a housing, a power board, a ballast and an electrical connector. The power board is disposed in the housing. The...
2016/0262280 FIXING DEVICE FOR A CIRCUIT PLATE TO A CARRIER, CIRCUIT ARRANGEMENT AND METHOD FOR FIXING A CIRCUIT PLATE TO A...
The invention relates to a mounting device for fastening a printed circuit board onto a carrier. The mounting device comprises at least one bolt that can be...
2016/0262279 EXTRUDED SEAL CARRIER AND METHOD OF USE
A sealing apparatus includes a carrier and sealant contained by the carrier. An enclosure interface includes first and second pieces and defines one or more...
2016/0262278 DISPLAY APPARATUS
A display apparatus includes panels, and a connection member that connects the panels. Relative positions of the panels can be changed to a first state, a...
2016/0262277 RAIL SEAL FOR ELECTRONIC EQUIPMENT ENCLOSURE
An electronic equipment enclosure includes a frame structure, one or more panels attached to the frame structure, at least one vertical mounting rail fastened...
2016/0262276 CASING AND ELECTRONIC DEVICE USING THE SAME
A casing and an electronic device using the same are provided. The casing includes a housing, a cover and a connection element. The housing has an opening. The...
2016/0262275 CLASP ASSEMBLY AND DATA INTERCONNECTION FOR WEARABLE COMPUTING DEVICES
Embodiments of the invention describe a clasp assembly for detachably coupling a first housing to a second housing. The clasp assembly to further includes a...
2016/0262274 SINGLE ACTION DIN RAIL LATCH
An electronics module includes a latch with a first latch portion and a second latch portion. The latch portions move between a latched position and an...
2016/0262273 DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
To provide a display device of high quality and high reliability by securely sealing the gap between the bezel and the display panel even when variation is...
2016/0262272 ELECTRONIC DEVICE
Provided is an electronic device capable of preventing stress from being generated in each of joining portions of electronic circuit components joined to a...
2016/0262271 METHOD FOR MANUFACTURING A DOUBLE-SIDED PRINTED CIRCUIT BOARD
The method for manufacturing printed circuit boards includes providing through hole vias in a non-conductive substrate at given coordinates in a printed...
2016/0262270 ELECTRONIC PACKAGE WITH HEAT TRANSFER ELEMENT(S)
Electronic packages are provided with enhanced heat dissipation capabilities. The electronic package includes a plurality of electronic components, and an...
2016/0262269 COPPER ETCHING METHOD FOR MANUFACTURING CIRCUIT BOARD
Disclosed is a copper etching method for manufacturing a circuit board, including steps of electroplating a metal copper support layer, coating a thermal...
2016/0262268 PRESSING OF WIRE BOND WIRE TIPS TO PROVIDE BENT-OVER TIPS
In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second...
2016/0262267 METHOD FOR MANUFACTURING A CIRCUIT BOARD WITH BURIED ELEMENT HAVING HIGH DENSITY PIN COUNT AND THE CIRCUIT...
A method for manufacturing a circuit board with a buried element having high density pin count, wherein a micro copper window formed in a first circuit by...
2016/0262266 ELECTRONIC DEVICE
A circuit board has a through hole extending from a front surface to a rear surface. A press-fit terminal is press-fitted from the front surface into the...
2016/0262265 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
A printed circuit board includes first and second insulating layers, a wiring trace, a metal thin film, and a connection terminal. The wiring trace is formed...
2016/0262264 CONNECTION SUBSTRATE AND DISPLAY DEVICE HAVING THE SAME
A connection substrate and a display device including the same are provided. The connection substrate includes a first conductive portion disposed on a tensile...
2016/0262263 CYANATE ESTER COMPOUND, CURABLE RESIN COMPOSITION CONTAINING THE SAME, AND HARDENED PRODUCT THEREOF
The present invention is a cyanate ester compound represented by the following formula (1): ##STR00001## wherein Ar represents an aromatic ring; R.sub.1 each...
2016/0262262 Metal-Free Monolithic Epitaxial Graphene-On-Diamond PWB with Optical Waveguide
According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by thermolysis of layers of a...
2016/0262261 Printed Circuits With Laser Ablated Conformal Coating Openings
Electrical components may be mounted on a printed circuit or other substrate. The electrical components may be covered with a conformal coating containing a...
2016/0262260 MULTI-LAYERED CIRCUIT BOARD AND SEMICONDUCTOR DEVICE
A multi-layered circuit board includes a first insulating layer, a second insulating layer, and a sheet capacitor that is located between the first insulating...
2016/0262259 ELECTRONIC DEVICE FOR VEHICLES
An electronic device includes: a printed circuit board; a conductive casing; and a connecting part. The printed circuit board is mounted with an electronic...
2016/0262258 WIRED CIRCUIT BOARD
A wired circuit board includes a first insulating layer, a conductive pattern disposed on the first insulating layer and including a plurality of terminals...
2016/0262257 Electronic Circuit Unit
To increase vibration resistance of a connection terminal, a tip of which is soldered to a circuit board. In a controller, the circuit board is accommodated in...
2016/0262256 METHOD FOR FABRICATING FLEXIBLE SUBSTRATE AND FLEXIBLE SUBSTRATE PREFABRICATED COMPONENT
A method for fabricating a flexible substrate and a flexible substrate prefabricated component are disclosed, the flexible substrate comprises an electronic...
2016/0262255 TEST BOARD UNIT AND APPARATUS FOR TESTING A SEMICONDUCTOR CHIP INCLUDING THE SAME
A test board unit may include a test board, a thermal tank and a heat-dissipating plate. The test board may be configured to provide a semiconductor chip with...
2016/0262254 INTRINSICALLY SAFE RADIO FREQUENCY (RF) ADAPTER
An intrinsic safety (IS) radio frequency (RF) adapter combination includes a multi-layer printed circuit board (PCB) including a dielectric substrate material...
2016/0262253 ELECTRONIC PACKAGE WITH HEAT TRANSFER ELEMENT(S)
Electronic packages are provided with enhanced heat dissipation capabilities. The electronic package includes a plurality of electronic components, and an...
2016/0262252 SUBSTRATE STRUCTURE
A substrate structure includes a substrate, a buffer layer, and a protecting layer. The substrate includes a side surface. The buffer layer is disposed between...
2016/0262251 PLASMA GENERATION ELECTRODE MODULE, PLASMA GENERATION ELECTRODE ASSEMBLY, AND APPARATUS FOR GENERATING PLASMA...
A plasma generation electrode module includes: a plasma generation electrode module includes: first and second electrodes formed to be spaced apart from one...
2016/0262250 POWER GENERATION SYSTEM AND PACKAGE
A power generation system includes an input to receive a low-voltage alternating current and a number N of voltage-conversion modules coupled to the input,...
2016/0262249 ELECTRO-CONDUCTING TILE OR FLOORBOARD FLOOR COVERING
A component, such as a title or a floorboard, has electro-conductive properties for producing a floor covering, or a similar system, in particular for a medium...
2016/0262248 Device for Forming Air Flow Containing Charged Ions
Embodiments of the present invention provide a device for forming air flow containing charged ions, comprising a fan member, a ring air blowing chamber...
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