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Patent # Description
2016/0268184 SEMICONDUCTOR DEVICE
A semiconductor device includes a first insulating film, a first wiring, a second insulating film, and a second wiring. The first insulating film is formed on...
2016/0268183 SEMICONDUCTOR STRUCTURE WITH THROUGH-SILICON VIA
A semiconductor structure includes a semiconductor substrate and a conductive element formed in a portion of the semiconductor substrate. The semiconductor...
2016/0268182 SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS OF FABRICATING THE SAME
A semiconductor device includes a semiconductor substrate, a circuit layer including an interlayer insulating layer on an upper surface of the substrate, and a...
2016/0268181 SEMICONDUCTOR DEVICE
A semiconductor device according to an embodiment includes a first electrode, a second electrode, a semiconductor portion connected between the first electrode...
2016/0268180 HEAT DISSIPATION ASSEMBLY
A heat dissipating assembly including a layered stack of materials with a highly thermally conductive path for cooling a circuit, the stack including a...
2016/0268179 SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
According to one embodiment, a semiconductor device includes a first substrate, a second substrate, a first electronic component, a heat-conducting layer, a...
2016/0268178 MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY
Embodiments of the present disclosure are directed toward a molded composite enclosure for an integrated circuit (IC) assembly. In one embodiment, an enclosure...
2016/0268177 Sensor for a Semiconductor Device
A semiconductor arrangement is presented. The semiconductor arrangement comprises a semiconductor body, the semiconductor body including a semiconductor drift...
2016/0268176 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes irradiating a first photoresist layer via a light source, measuring a first exposure intensity of the...
2016/0268175 METHOD FOR ELIMINATING MASK SELF-MAGNETIZATION, SUBSTRATE MANUFACTURING METHOD AND MASK TESTING DEVICE
Disclosed are a method for eliminating self-magnetization of a mask, a method for manufacturing a substrate and a mask testing device. The mask may include a...
2016/0268174 Methods for Probing Semiconductor Fins and Determining Carrier Concentrations
A method includes probing at least one semiconductor fin using a four-point probe head, with four probe pins of the four-point probe head contacting the at...
2016/0268173 Mechanical Stress Measurement During Thin-Film Fabrication
A method and system are provided for determining mechanical stress experienced by a film during fabrication thereof on a substrate positioned in a vacuum...
2016/0268172 Integrate Circuit with Nanowires
A method includes providing a substrate having a first gate region for a first device and a second gate region for a second device, the first and second gate...
2016/0268171 CAP LAYER FOR SPACER-CONSTRAINED EPITAXIALLY GROWN MATERIAL ON FINS OF A FINFET DEVICE
A method includes forming at least one fin in a semiconductor substrate. A fin spacer is formed on at least a first portion of the at least one fin. The fin...
2016/0268170 SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF
A semiconductor arrangement and method of formation are provided. The semiconductor arrangement includes a metal connect over and connected to a first active...
2016/0268169 METHOD OF FORMING SUPRA LOW THRESHOLD DEVICES
A semiconductor device and a method for making the semiconductor device are provided. The semiconductor device includes a non-volatile memory cell having a...
2016/0268168 SEMICONDUCTOR ARRANGEMENT
A semiconductor arrangement includes a first semiconductor device including a first type region having a first conductivity type and a second type region...
2016/0268167 PRODUCTION METHOD FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR ELEMENT
A production method for a semiconductor element (10) includes: a semiconductor element forming step of forming the semiconductor element (10) including a...
2016/0268166 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
In a method of manufacturing a semiconductor memory device, a stack is formed by alternately stacking an interlayer insulating layer and a first electrically...
2016/0268165 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
According to one embodiment, a method for manufacturing a semiconductor device, includes: selectively forming a plurality of electrode layers on a first...
2016/0268164 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
According to an embodiment, a method for manufacturing a semiconductor device includes: selectively forming a plurality of mask layers on a first surface of a...
2016/0268163 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME SEMICONDUCTOR DEVICE
The semiconductor device includes a semiconductor layer in which a via hole penetrating an upper surface of the semiconductor layer to a lower surface of the...
2016/0268162 SUBSTRATE PROCESSING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
An object of the present invention is to provide a method which enable a material to be fully embedded into a recess portion with a deposition film left in the...
2016/0268161 DIFFUSION BARRIER LAYER FORMATION
A method of forming a titanium nitride (TiN) diffusion barrier includes exposing a deposition surface to a first pulse of a titanium-containing precursor and...
2016/0268160 ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS
Compositions of matter, compounds, articles of manufacture and processes to reduce or substantially eliminate EM and/or stress migration, and/or TDDB in copper...
2016/0268159 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
A semiconductor device and a manufacturing method thereof are disclosed. The semiconductor device includes a silicon substrate, a spacer, a doped region, and a...
2016/0268158 AIR GAP CONTACT FORMATION FOR REDUCING PARASITIC CAPACITANCE
A functional gate structure is located on a surface of a semiconductor material portion and including a U-shaped gate dielectric portion and a gate conductor...
2016/0268157 LIFT PIN AND DISPLAY PANEL PRODUCTION EQUIPMENT
The present disclosure discloses a lift pin and a display panel production equipment, each of which reduces electrostatic ions located on a back side of a...
2016/0268156 APPARATUS AND METHOD FOR CHUCKING WARPED WAFERS
An apparatus tor fixing a wafer, including a chuck having a surface, a plurality of through bores in the chuck extending through the surface of the chuck, a...
2016/0268155 METHOD OF PROCESSING SINGLE-CRYSTAL SUBSTRATE
A method of dividing a single-crystal substrate along a plurality of preset division lines, includes a shield tunnel forming step of applying a pulsed laser...
2016/0268154 INSULATING SUBSTRATE AND SEMICONDUCTOR DEVICE
A thermosetting double-sided adhesive insulating resin is disposed on a ceramic plate. A metal plate is disposed on the thermosetting double-sided adhesive...
2016/0268153 SUBSTRATE FLOATING APPARATUS, SUBSTRATE TRANSFER APPRATUS, AND SUBSTRATE TRANSPORT APPARATUS
Provided are a substrate floating apparatus, substrate transfer apparatus, and substrate transport apparatus that achieve energy savings, the saving of space,...
2016/0268152 OVERHEAD SUBSTRATE HANDLING AND STORAGE SYSTEM
A method for operating a material handling system including an overhead rack defining a plurality of storage positions, first and second side rails disposed...
2016/0268151 FIXTURE FOR CONVEYING MASK PLATE
The present disclosure provides a fixture for conveying a mask plate, the fixture for conveying a mask plate includes: a conveying bracket; and a fixation...
2016/0268150 Apparatus For Improving Temperature Uniformity Of A Workpiece
An apparatus for improving the temperature uniformity of a workpiece during processing is disclosed. The apparatus includes a platen having a separately...
2016/0268149 SUBSTRATE WARPAGE CONTROL USING TEMPER GLASS WITH UNI-DIRECTIONAL HEATING
A method including clamping an integrated circuit package substrate between first and second supporting substrates; exposing the clamped package substrate to a...
2016/0268148 PURGE GAS SPRAYING PLATE AND FUME REMOVING APPARATUS HAVING THE SAME
Provided are a purge gas spraying plate and a fume removing apparatus, and more particularly, a purge gas spraying plate capable of spraying a purge gas, which...
2016/0268147 Fine Temperature Controllable Wafer Heating System
Disclosed are a method and a system for processing wafers in fabricating a semiconductor device where disposing chemicals and wafer heating are needed for...
2016/0268146 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus includes a processing liquid nozzle that includes a nozzle pipe within which a processing liquid flow path is defined and a...
2016/0268145 Package Structures and Methods for Forming the Same
A packaging structure and a method of forming a packaging structure are provided. The packaging structure, such as an interposer, is formed by optionally...
2016/0268144 STRUCTURE WITH AN IMPROVED CAPACITOR
A Metal-Insulator-Metal type capacitor structure (1) comprising a substrate (2), a first electrically insulating layer (14) placed on the substrate (2), a...
2016/0268143 METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH FINE LINE PITCH AND FINE END-TO-END SPACE
A method for forming a semiconductor device structure is provided. The method includes providing a substrate and forming a bottom layer, a middle layer, and a...
2016/0268142 MANUFACTURING METHOD OF PATTERNED STRUCTURE OF SEMICONDUCTOR DEVICE
A manufacturing method of a patterned structure of a semiconductor device includes following steps. A plurality of support features are formed on a substrate....
2016/0268141 TECHNIQUE TO DEPOSIT SIDEWALL PASSIVATION FOR HIGH ASPECT RATIO CYLINDER ETCH
Various embodiments herein relate to methods, apparatus and systems for forming a recessed feature in dielectric material on a semiconductor substrate....
2016/0268140 PLASMA ETCHING METHOD AND PLASMA ETCHING APPARATUS
There is provided a plasma etching method for etching a base film by a plasma using a photoresist as a mask. The method includes etching the base film by the...
2016/0268139 METHOD FOR MANUFACTURING ARRAY SUBSTRATE, FILM-ETCHING MONITORING METHOD AND DEVICE
A method for manufacturing an array substrate, a film-etching monitoring and a film-etching monitoring device. The monitoring method comprises: monitoring and...
2016/0268138 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A method for manufacturing a semiconductor device is provided. The method may include: forming a first material layer and a second material layer on a...
2016/0268137 METHOD OF FABRICATING ELECTROSTATIC DISCHARGE PROTECTION STRUCTURE
A method of fabricating an electrostatic discharge protection structure includes the following steps. Firstly, a semiconductor substrate is provided. Plural...
2016/0268136 NON-AMBIPOLAR ELECTRIC PRESSURE PLASMA UNIFORMITY CONTROL
This disclosure relates to a plasma processing system for controlling plasma density near the edge or perimeter of a substrate that is being processed. The...
2016/0268135 WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING
A bonded wafer structure having a handle wafer, a device wafer, and an interface region with an abrupt transition between the conductivity profile of the...
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