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Patent # Description
2016/0276571 ELECTRONIC DEVICE
An electronic device includes a sealing plate including a first surface connected to a pressure chamber formation substrate, and a second surface having a...
2016/0276570 SILICIDED NANOWIRES FOR NANOBRIDGE WEAK LINKS
Silicided nanowires as nanobridges in Josephson junctions. A superconducting silicided nanowire is used as a weak-link bridge in a Josephson junction, and a...
2016/0276569 PROCESS FOR MANUFACTURING A PYROELECTRIC AND/OR PIEZOELECTRIC DRIVE
A process for manufacturing a piezoelectric and/or pyroelectric device comprising a polyvinylidene fluoride film, the process comprising a step of forming at...
2016/0276568 ENERGY HARVESTING MATTRESS WITH THERMOELECTRIC FABRIC
Energy harvesting mattresses, systems, and methods of cooling mattresses are disclosed herein. In some aspects, the energy harvesting mattress can include a...
2016/0276567 METHODS FOR THICK FILM THERMOELECTRIC DEVICE FABRICATION
Solid state thermoelectric energy conversion devices can provide electrical energy from heat flow, creating energy, or inversely, provide cooling through...
2016/0276566 Electrical Circuit and Method for Producing an Electrical Circuit
An electrical circuit includes a component, a thermoelectric generator, and a housing. The component is a sensor element configured to sense a quantity to be...
2016/0276565 INTERNALLY HEATED CONCENTRATED SOLAR POWER (CSP) THERMAL ABSORBER
A system and method are disclosed for internally heated concentrated solar power (CSP) thermal absorbers. The system and method involve an energy-generating...
2016/0276564 THERMOELECTRIC CONVERSION MATERIAL, THERMOELECTRIC CONVERSION ELEMENT, THERMOELECTRIC CONVERSION MODULE,...
Provided is a thermoelectric conversion material including a plurality of kinds of phases including a first phase and a second phase which have elemental...
2016/0276563 THERMOELECTRIC GENERATOR WITH MINIMAL THERMAL SHUNTING
In at least one embodiment, a thermoelectric generator is provided. The thermoelectric generator includes a substrate, a cap, a thermoelectric detector, and an...
2016/0276562 METHOD OF MANUFACTURING LIGHT EMITTING DEVICE WITH EXPOSED WIRE END PORTIONS
A light emitting device is constituted with a semiconductor light emitting element on which a support member is disposed on one surface provided with a p-side...
2016/0276561 LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
A light emitting device includes a first light transmissive supportive substrate having a first light transmissive insulator and a conductive circuitry layer...
2016/0276560 SEMICONDUCTOR LIGHT EMITTING DEVICE
According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first metal pillar, a second metal pillar, and an...
2016/0276559 Light-Emitting Diode Package With Substantially In-Plane Light Emitting Surface and Fabrication Method
The present specification discloses a novel light emitting diode package having a package substrate with a light emitting layer bonded to the package...
2016/0276558 LIGHT EMITTING DIODE HAVING MULTILAYER BONDING PAD
A light-emitting diode having a multilayer bonding pad includes: a P1 layer disposed under a light-emitting structure and configured to improve ohmic contact...
2016/0276557 LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE
A light emitting device includes: a semiconductor light emitting element having a sapphire substrate and a semiconductor layer; a mounting board; and a light...
2016/0276556 OPTOELECTRONIC COMPONENT, OPTOELECTRONIC ARRANGEMENT, METHOD OF PRODUCING AN OPTICAL ELEMENT, AND METHOD OF...
An optoelectronic component includes an optoelectronic semiconductor chip having a radiation-emitting face; and an optical element arranged over the...
2016/0276555 LIGHT EMITTING DEVICE MANUFACTURING METHOD AND LIGHT EMITTING DEVICE
A light emitting device manufacturing method includes: bonding a second film having an adhesive layer formed thereon to a substrate having bonded on a surface...
2016/0276554 LIGHT EMITTING COMPONENT
A light emitting component includes a light emitting unit, a molding compound and a wavelength converting layer. The light emitting unit has a forward light...
2016/0276553 LIGHT-EMITTING DEVICE
A light-emitting device includes a base; wiring patterns formed on the base; and light-emitting elements arranged on the base and/or the wiring patterns. The...
2016/0276552 Optoelectronic Semiconductor Chip and Optoelectronic Semiconductor Component
An optoelectronic semiconductor chip has a non-rectangular, parallelogram-shaped top surface and an active zone, which is at a distance from the top surface...
2016/0276551 LED WITH CERAMIC GREEN PHOSPHOR AND PROTECTED RED PHOSPHOR LAYER
A ceramic green wavelength conversion element (120) is coated with a red wavelength conversion material (330) and placed above a blue light emitting element...
2016/0276550 SYSTEM AND METHOD FOR SELECTED PUMP LEDS WITH MULTIPLE PHOSPHORS
An LED pump light with multiple phosphors is described. LEDs emitting radiation at violet and/or ultraviolet wavelengths are used to pump phosphor materials...
2016/0276549 LIGHT EMITTING DEVICE AND ILLUMINATION DEVICE
A light emitting device which emits a secondary light with high color purity and has a fast response speed is obtained. A KSF phosphor (15) which absorbs a...
2016/0276548 BLUISH GREEN PHOSPHOR AND LIGHT EMITTING DEVICE PACKAGE INCLUDING THE SAME
Embodiments of the present invention provide a bluish green phosphor represented by Formula 1 below. In particular, the bluish green phosphor and a light...
2016/0276547 LIGHT EMITTING DIODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
An edge lighting light emitting diode (LED) structure and a method of manufacturing the same are provided. The edge lighting LED structure includes a...
2016/0276546 CHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
A chip package structure and method of manufacturing the same are provided. The chip package structure includes a substrate with a carrier surface, a chip...
2016/0276545 ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
In various embodiments, a method for producing an electronic component is provided. The method includes applying an adhesive layer to a carrier, initially...
2016/0276544 COVER GLASS FOR LIGHT EMITTING DIODE PACKAGE, SEALED STRUCTURE, AND LIGHT EMITTING DEVICE
To provide a cover glass for light emitting diode package, which is capable of preventing deterioration in transmittance characteristics during use for a long...
2016/0276543 LIGHT EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
A light emitting diode package structure and a manufacturing method thereof are disclosed. The light emitting diode package structure includes a carrier...
2016/0276542 LIGHT EMITTING DIODE FOR SURFACE MOUNT TECHNOLOGY, METHOD OF MANUFACTURING THE SAME, AND METHOD OF...
A light emitting diode (LED) includes a substrate, a first semiconductor layer disposed on the substrate, an active layer disposed on a portion of the first...
2016/0276541 Light Emitting Diodes With Current Injection Enhancement From The Periphery
A light emitting diode (LED) assembly with current injection enhancement from the periphery of the LED is disclosed. In one embodiment, the LED assembly...
2016/0276540 SEMICONDUCTOR LIGHT-EMITTING ELEMENT
A semiconductor light-emitting element includes a substrate having a convex portion protruding therefrom. A first semiconductor layer having a first...
2016/0276539 SEMICONDUCTOR LIGHT-EMITTING ELEMENT
A semiconductor light-emitting element includes a first layer having a first conductivity. A second layer having a second conductivity is provided between the...
2016/0276538 Light Emitting Diodes With Current Spreading Material Over Perimetric Sidewalls
A vertical light emitting diode (LED) assembly with current spreading material over one or more sidewalls of the LED is disclosed. In one embodiment, the...
2016/0276537 LIGHT-EMITTING DEVICE AND PRODUCTION METHOD THEREFOR
An emission efficiency of a light-emitting device is improved by reducing strains applied to a light-emitting layer. On a sapphire substrate, an n-type contact...
2016/0276536 LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEROF
A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes an LED including a first electrode pad and a...
2016/0276535 LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
A light emitting device, includes: a substrate, including a top surface, a bottom surface, a first side surface connecting the top surface and the bottom...
2016/0276534 OPTOELECTRONIC SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING OPTOELECTRONIC SEMICONDUCTOR CHIPS
An optoelectronic semiconductor chip (1) is provided which has a semiconductor body comprising a semiconductor layer sequence (2) with an active region (20)...
2016/0276533 ULTRAVIOLET LIGHT EMITTING DEVICES AND METHODS OF FABRICATION
An ultraviolet light emitting semiconductor chip, its use in a LED, and methods of its fabrication are disclosed. The semiconductor chip can include a buffer...
2016/0276532 SEMICONDUCTOR LIGHT EMITTING ELEMENT, METHOD FOR MANUFACTURING SAME, AND LIGHT EMITTING DEVICE
According to one embodiment, semiconductor light emitting element includes: a substrate having a first surface and a second surface on an opposite side of the...
2016/0276531 SEMICONDUCTOR LAYER SEQUENCE AND METHOD OF PRODUCING THE SAME
A semiconductor layer sequence includes an n-conducting n-type side, a p-conducting p-type side, and an active zone between the sides, the active zone...
2016/0276530 SEMICONDUCTOR STRUCTURES HAVING ACTIVE REGIONS COMPRISING INGAN AND METHODS OF FORMING SUCH SEMICONDUCTOR...
Semiconductor structures include an active region between a plurality of layers of InGaN. The active region may be at least substantially comprised by InGaN....
2016/0276529 GAN-BASED LED EPITAXIAL STRUCTURE AND PREPARATION METHOD THEREOF
A GaN-based LED epitaxial structure comprises a non-doped GaN buffer layer, an undoped GaN layer, an N-type GaN layer, an InGaN/GaN superlattice quantum well...
2016/0276528 METHOD FOR MANUFACTURING HETEROSTRUCTURES FOR MIDDLE INFRARED BAND, A HETEROSTRUCTURE, AND A LIGHT-EMITTING...
The present invention relates to producing spontaneous radiation sources based on A.sup.IIIB.sup.V semiconductor compounds in 2.6-4.7 .mu.m spectral range, and...
2016/0276527 SEMICONDUCTOR STRUCTURE HAVING NANOCRYSTALLINE CORE AND NANOCRYSTALLINE SHELL WITH INSULATOR COATING
Lighting apparatus including a light emitting diode and a plurality of semiconductor structures. Each semiconductor structure includes a quantum dot comprising...
2016/0276526 SEMICONDUCTOR LIGHT EMITTING DEVICE
According to one embodiment, a semiconductor light emitting device includes a base body, first to sixth semiconductor layers, first to third conductive layers,...
2016/0276525 METHOD OF MANUFACTURING SEMICONDUCTOR CHIPS
A method of manufacturing semiconductor chips includes: forming grooves on a front face side of a substrate; and forming grooves on a back face side of the...
2016/0276524 LED LIGHT EXTRACTION ENHANCEMENT ENABLED USING SELF-ASSEMBLED PARTICLES PATTERNED SURFACE
A light emitting diode (LED) containing device including a light emitting diode (LED) structure, and a light transmissive substrate in contact with the LED...
2016/0276523 SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF
A semiconductor light-emitting element includes a substrate having a first side and a second side, a first semiconductor layer of a first conductivity type on...
2016/0276522 SUBSTRATE CLEAVING UNDER CONTROLLED STRESS CONDITIONS
A thickness of material may be detached from a substrate along a cleave plane, utilizing a cleaving process controlled by a releasable constraint plate. In...
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