At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.
An electronic device includes a sealing plate including a first surface connected to a pressure chamber formation substrate, and a second surface having a...
SILICIDED NANOWIRES FOR NANOBRIDGE WEAK LINKS
Silicided nanowires as nanobridges in Josephson junctions. A superconducting silicided nanowire is used as a weak-link bridge in a Josephson junction, and a...
PROCESS FOR MANUFACTURING A PYROELECTRIC AND/OR PIEZOELECTRIC DRIVE
A process for manufacturing a piezoelectric and/or pyroelectric device comprising a polyvinylidene fluoride film, the process comprising a step of forming at...
ENERGY HARVESTING MATTRESS WITH THERMOELECTRIC FABRIC
Energy harvesting mattresses, systems, and methods of cooling mattresses are disclosed herein. In some aspects, the energy harvesting mattress can include a...
METHODS FOR THICK FILM THERMOELECTRIC DEVICE FABRICATION
Solid state thermoelectric energy conversion devices can provide electrical energy from heat flow, creating energy, or inversely, provide cooling through...
Electrical Circuit and Method for Producing an Electrical Circuit
An electrical circuit includes a component, a thermoelectric generator, and a housing. The component is a sensor element configured to sense a quantity to be...
INTERNALLY HEATED CONCENTRATED SOLAR POWER (CSP) THERMAL ABSORBER
A system and method are disclosed for internally heated concentrated solar power (CSP) thermal absorbers. The system and method involve an energy-generating...
THERMOELECTRIC CONVERSION MATERIAL, THERMOELECTRIC CONVERSION ELEMENT,
THERMOELECTRIC CONVERSION MODULE,...
Provided is a thermoelectric conversion material including a plurality of kinds of phases including a first phase and a second phase which have elemental...
THERMOELECTRIC GENERATOR WITH MINIMAL THERMAL SHUNTING
In at least one embodiment, a thermoelectric generator is provided. The thermoelectric generator includes a substrate, a cap, a thermoelectric detector, and an...
METHOD OF MANUFACTURING LIGHT EMITTING DEVICE WITH EXPOSED WIRE END
A light emitting device is constituted with a semiconductor light emitting element on which a support member is disposed on one surface provided with a p-side...
LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
A light emitting device includes a first light transmissive supportive substrate having a first light transmissive insulator and a conductive circuitry layer...
SEMICONDUCTOR LIGHT EMITTING DEVICE
According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first metal pillar, a second metal pillar, and an...
Light-Emitting Diode Package With Substantially In-Plane Light Emitting
Surface and Fabrication Method
The present specification discloses a novel light emitting diode package having a package substrate with a light emitting layer bonded to the package...
LIGHT EMITTING DIODE HAVING MULTILAYER BONDING PAD
A light-emitting diode having a multilayer bonding pad includes: a P1 layer disposed under a light-emitting structure and configured to improve ohmic contact...
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE
A light emitting device includes: a semiconductor light emitting element having a sapphire substrate and a semiconductor layer; a mounting board; and a light...
OPTOELECTRONIC COMPONENT, OPTOELECTRONIC ARRANGEMENT, METHOD OF PRODUCING
AN OPTICAL ELEMENT, AND METHOD OF...
An optoelectronic component includes an optoelectronic semiconductor chip having a radiation-emitting face; and an optical element arranged over the...
LIGHT EMITTING DEVICE MANUFACTURING METHOD AND LIGHT EMITTING DEVICE
A light emitting device manufacturing method includes: bonding a second film having an adhesive layer formed thereon to a substrate having bonded on a surface...
LIGHT EMITTING COMPONENT
A light emitting component includes a light emitting unit, a molding compound and a wavelength converting layer. The light emitting unit has a forward light...
A light-emitting device includes a base; wiring patterns formed on the base; and light-emitting elements arranged on the base and/or the wiring patterns. The...
Optoelectronic Semiconductor Chip and Optoelectronic Semiconductor
An optoelectronic semiconductor chip has a non-rectangular, parallelogram-shaped top surface and an active zone, which is at a distance from the top surface...
LED WITH CERAMIC GREEN PHOSPHOR AND PROTECTED RED PHOSPHOR LAYER
A ceramic green wavelength conversion element (120) is coated with a red wavelength conversion material (330) and placed above a blue light emitting element...
SYSTEM AND METHOD FOR SELECTED PUMP LEDS WITH MULTIPLE PHOSPHORS
An LED pump light with multiple phosphors is described. LEDs emitting radiation at violet and/or ultraviolet wavelengths are used to pump phosphor materials...
LIGHT EMITTING DEVICE AND ILLUMINATION DEVICE
A light emitting device which emits a secondary light with high color purity and has a fast response speed is obtained. A KSF phosphor (15) which absorbs a...
BLUISH GREEN PHOSPHOR AND LIGHT EMITTING DEVICE PACKAGE INCLUDING THE SAME
Embodiments of the present invention provide a bluish green phosphor represented by Formula 1 below. In particular, the bluish green phosphor and a light...
LIGHT EMITTING DIODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
An edge lighting light emitting diode (LED) structure and a method of manufacturing the same are provided. The edge lighting LED structure includes a...
CHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
A chip package structure and method of manufacturing the same are provided. The chip package structure includes a substrate with a carrier surface, a chip...
ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
In various embodiments, a method for producing an electronic component is provided. The method includes applying an adhesive layer to a carrier, initially...
COVER GLASS FOR LIGHT EMITTING DIODE PACKAGE, SEALED STRUCTURE, AND LIGHT
To provide a cover glass for light emitting diode package, which is capable of preventing deterioration in transmittance characteristics during use for a long...
LIGHT EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
A light emitting diode package structure and a manufacturing method thereof are disclosed. The light emitting diode package structure includes a carrier...
LIGHT EMITTING DIODE FOR SURFACE MOUNT TECHNOLOGY, METHOD OF MANUFACTURING
THE SAME, AND METHOD OF...
A light emitting diode (LED) includes a substrate, a first semiconductor layer disposed on the substrate, an active layer disposed on a portion of the first...
Light Emitting Diodes With Current Injection Enhancement From The
A light emitting diode (LED) assembly with current injection enhancement from the periphery of the LED is disclosed. In one embodiment, the LED assembly...
SEMICONDUCTOR LIGHT-EMITTING ELEMENT
A semiconductor light-emitting element includes a substrate having a convex portion protruding therefrom. A first semiconductor layer having a first...
SEMICONDUCTOR LIGHT-EMITTING ELEMENT
A semiconductor light-emitting element includes a first layer having a first conductivity. A second layer having a second conductivity is provided between the...
Light Emitting Diodes With Current Spreading Material Over Perimetric
A vertical light emitting diode (LED) assembly with current spreading material over one or more sidewalls of the LED is disclosed. In one embodiment, the...
LIGHT-EMITTING DEVICE AND PRODUCTION METHOD THEREFOR
An emission efficiency of a light-emitting device is improved by reducing strains applied to a light-emitting layer. On a sapphire substrate, an n-type contact...
LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEROF
A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes an LED including a first electrode pad and a...
LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
A light emitting device, includes: a substrate, including a top surface, a bottom surface, a first side surface connecting the top surface and the bottom...
OPTOELECTRONIC SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING OPTOELECTRONIC
An optoelectronic semiconductor chip (1) is provided which has a semiconductor body comprising a semiconductor layer sequence (2) with an active region (20)...
ULTRAVIOLET LIGHT EMITTING DEVICES AND METHODS OF FABRICATION
An ultraviolet light emitting semiconductor chip, its use in a LED, and methods of its fabrication are disclosed. The semiconductor chip can include a buffer...
SEMICONDUCTOR LIGHT EMITTING ELEMENT, METHOD FOR MANUFACTURING SAME, AND
LIGHT EMITTING DEVICE
According to one embodiment, semiconductor light emitting element includes: a substrate having a first surface and a second surface on an opposite side of the...
SEMICONDUCTOR LAYER SEQUENCE AND METHOD OF PRODUCING THE SAME
A semiconductor layer sequence includes an n-conducting n-type side, a p-conducting p-type side, and an active zone between the sides, the active zone...
SEMICONDUCTOR STRUCTURES HAVING ACTIVE REGIONS COMPRISING INGAN AND
METHODS OF FORMING SUCH SEMICONDUCTOR...
Semiconductor structures include an active region between a plurality of layers of InGaN. The active region may be at least substantially comprised by InGaN....
GAN-BASED LED EPITAXIAL STRUCTURE AND PREPARATION METHOD THEREOF
A GaN-based LED epitaxial structure comprises a non-doped GaN buffer layer, an undoped GaN layer, an N-type GaN layer, an InGaN/GaN superlattice quantum well...
METHOD FOR MANUFACTURING HETEROSTRUCTURES FOR MIDDLE INFRARED BAND, A
HETEROSTRUCTURE, AND A LIGHT-EMITTING...
The present invention relates to producing spontaneous radiation sources based on A.sup.IIIB.sup.V semiconductor compounds in 2.6-4.7 .mu.m spectral range, and...
SEMICONDUCTOR STRUCTURE HAVING NANOCRYSTALLINE CORE AND NANOCRYSTALLINE
SHELL WITH INSULATOR COATING
Lighting apparatus including a light emitting diode and a plurality of semiconductor structures. Each semiconductor structure includes a quantum dot comprising...
SEMICONDUCTOR LIGHT EMITTING DEVICE
According to one embodiment, a semiconductor light emitting device includes a base body, first to sixth semiconductor layers, first to third conductive layers,...
METHOD OF MANUFACTURING SEMICONDUCTOR CHIPS
A method of manufacturing semiconductor chips includes: forming grooves on a front face side of a substrate; and forming grooves on a back face side of the...
LED LIGHT EXTRACTION ENHANCEMENT ENABLED USING SELF-ASSEMBLED PARTICLES
A light emitting diode (LED) containing device including a light emitting diode (LED) structure, and a light transmissive substrate in contact with the LED...
SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF
A semiconductor light-emitting element includes a substrate having a first side and a second side, a first semiconductor layer of a first conductivity type on...
SUBSTRATE CLEAVING UNDER CONTROLLED STRESS CONDITIONS
A thickness of material may be detached from a substrate along a cleave plane, utilizing a cleaving process controlled by a releasable constraint plate. In...