Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2016/0276321 LIGHT-EMITTING DEVICE
A light-emitting device according to an embodiment includes a light-emitting part and an external wiring. The light-emitting part includes: a pair of...
2016/0276320 SEMICONDUCTOR LIGHT-EMITTING DEVICE AND THE MANUFACTURING METHOD THEREOF
A semiconductor light-emitting device that includes a substrate, at least one light-emitting unit arranged on the substrate, a phosphor layer at least covering...
2016/0276319 FLEXIBLE LIGHT EMITTING SEMICONDUCTOR DEVICE WITH LARGE AREA CONDUIT
A flexible polymeric dielectric layer (12) having first and second major surfaces, the first major surface having a conductive layer (20) thereon, the...
2016/0276318 Package of LED Chip and Manufacturing Method Thereof
The present invention discloses a package of the LED chip and the related manufacturing method. The present invention is related to the LED package process....
2016/0276317 BUMPLESS BUILD-UP LAYER PACKAGE WITH PRE-STACKED MICROELECTRONIC DEVICES
The present disclosure relates to the field of integrated circuit package design and, more particularly, to packages using a bumpless build-up layer (BBUL)...
2016/0276316 STUB MINIMIZATION FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS
A microelectronic assembly (300) or system (1500) includes at least one microelectronic package (100) having a microelectronic element (130) mounted face up...
2016/0276315 Three-Dimensional Chip Stack and Method of Forming the Same
A three-dimensional chip stack includes a first chip bonded to a second chip to form an electrical interconnection therebetween. The bonded interconnection...
2016/0276314 Cooling Channels in 3DIC Stacks
An integrated circuit structure includes a die including a semiconductor substrate, dielectric layers over the semiconductor substrate, an interconnect...
2016/0276313 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor device according to the present embodiment includes a semiconductor substrate, an insulating film and a conductive film. The insulating film is...
2016/0276312 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device includes a wiring substrate, a first semiconductor chip provided on the wiring substrate, a supporting member provided on the wiring...
2016/0276311 INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
Embodiments of the present disclosure are directed towards an integrated circuit (IC) package including a first die at least partially embedded in a first...
2016/0276310 EDGE STRUCTURE FOR BACKGRINDING ASYMMETRICAL BONDED WAFER
Semiconductor devices and methods of forming a semiconductor device are disclosed. The device includes a wafer with top and bottom surfaces. The wafer includes...
2016/0276309 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various electronic...
2016/0276308 THERMALLY ENHANCED PACKAGE-ON-PACKAGE STRUCTURE
A semiconductor package comprises a bottom package and a top package. The bottom package comprises at least one bottom-package semiconductor device. The top...
2016/0276307 Semiconductor Device and Method of Forming POP Semiconductor Device with RDL Over Top Package
A PoP semiconductor device has a top semiconductor package disposed over a bottom semiconductor package. The top semiconductor package has a substrate and a...
2016/0276306 REDUCING DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES
Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces...
2016/0276305 WINDOW CLAMP
A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame...
2016/0276304 INTEGRATED CIRCUIT PACKAGE
Integrated circuit package including an integrated circuit, external connection elements (3) connected to the integrated circuit, a package material (2)...
2016/0276303 ELECTRONIC COMPONENT
An electric component comprising a terminal electrode and a hot-melt polymer layer formed on the terminal electrode, wherein the hot-melt polymer layer...
2016/0276302 POWER MODULE
A power module is disclosed, including a power module substrate in which a circuit layer is arranged on one surface of an insulating layer; and a semiconductor...
2016/0276301 WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE
A wiring substrate includes a connection pad formed in the outermost wiring layer, a dummy pad formed in the outermost wiring layer, and a dummy wiring portion...
2016/0276300 ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
An electronic device includes a drive substrate (a pressure chamber substrate and a vibration plate) including a piezoelectric element and electrode wirings...
2016/0276299 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor device includes a first semiconductor substrate, a second semiconductor substrate, a first metal layer located on the first semiconductor...
2016/0276298 ARRAY SUBSTRATE AND FABRICATING METHOD THEREOF AS WELL AS DISPLAY DEVICE
This disclosure relates to an array substrate and fabricating method thereof as well as a display device, the array substrate comprising: a plurality of...
2016/0276297 Jog Design in Integrated Circuits
A device includes an active region in a semiconductor substrate, a gate strip over and crossing the active region, and a jog over the active region and...
2016/0276296 TUNABLE COMPOSITE INTERPOSER
A composite interposer can include a substrate element and a support element. The substrate element can have first and second opposite surfaces defining a...
2016/0276295 Packaging Devices and Methods of Manufacture Thereof
Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a method of manufacturing a packaging device...
2016/0276294 INTEGRATED CIRCUIT ASSEMBLIES WITH REINFORCEMENT FRAMES, AND METHODS OF MANUFACTURE
An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames...
2016/0276293 LIGHT-EMITTING DEVICE AND BACKLIGHT MODULE USING THE SAME
A light-emitting device is provided. The light-emitting device includes a substrate having a long edge and a short edge, at least one electrode pad assembly,...
2016/0276292 SEMICONDUCTOR CHIP
A semiconductor chip includes: a body; holes disposed in a first surface of the body; and a warpage preventing member including filling members disposed in the...
2016/0276291 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
According to one embodiment, a semiconductor device includes: a semiconductor substrate; and an insulating film provided above the semiconductor substrate. The...
2016/0276290 SEMICONDUCTOR PACKAGE AND MOBILE DEVICE USING THE SAME
According to an embodiment, a semiconductor package includes a semiconductor chip mounted on an interposer board, a encapsulant sealing the semiconductor chip,...
2016/0276289 WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING
A bonded wafer structure having a handle wafer, a device wafer, and an interface region with an abrupt transition between the conductivity profile of the...
2016/0276288 SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC WAVE SHIELD LAYER
A semiconductor package is provided with an electromagnetic wave shielding layer, and a conductive ground layer connected thereto. For example, in certain...
2016/0276287 SEMICONDUCTOR DEVICE
A semiconductor device capable of achieving a reduction of noise is provided. For example, the semiconductor device includes a first region for forming a core...
2016/0276286 CHIP PART AND METHOD OF MAKING THE SAME
A chip part includes a substrate, an element formed on the substrate, and an electrode formed on the substrate. A recess and/or projection expressing...
2016/0276285 Method for Forming Alignment Marks and Structure of Same
A method of fabrication of alignment marks for a non-STI CMOS image sensor is introduced. In some embodiments, zero layer alignment marks and active are...
2016/0276284 Eliminate Sawing-Induced Peeling Through Forming Trenches
A package includes a device die, a molding material encircling the device die, wherein a top surface of the molding material is substantially level with a top...
2016/0276283 SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
The disclosed subject matter provides a semiconductor structure and fabrication method thereof. In a semiconductor structure, a dielectric layer, a plurality...
2016/0276282 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
A semiconductor device includes a semiconductor layer, a first insulating film provided on the semiconductor layer, a second insulating film provided on the...
2016/0276281 MANUFACTURING METHOD OF WIRING STRUCTURE AND WIRING STRUCTURE
A trench is formed in an insulating film, carbon is formed on the insulating film to fill an inside of the trench, a catalytic material is formed on the...
2016/0276280 ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS
Compositions of matter, compounds, articles of manufacture and processes to reduce or substantially eliminate EM and/or stress migration, and/or TDDB in copper...
2016/0276279 SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor chip, an electrically insulating element separated from the semiconductor chip by a space, and encapsulation...
2016/0276278 Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices
Packaged semiconductor devices, methods of packaging semiconductor devices, and package-on-package (PoP) devices are disclosed. In some embodiments, a method...
2016/0276277 SEMICONDUCTOR DEVICE AND WAFER LEVEL PACKAGE INCLUDING SUCH SEMICONDUCTOR DEVICE
An RDL structure on a passivation layer includes a first landing pad disposed directly above a first on-chip metal pad; a first via in a passivation layer to...
2016/0276276 SEMICONDUCTOR DEVICE
According to one embodiment, a semiconductor device includes a substrate; a first interconnect portion provided on the substrate and including a plurality of...
2016/0276275 MIS (METAL-INSULATOR-SEMICONDUCTOR) CONTACT STRUCTURES FOR SEMICONDUCTOR DEVICES
An MIS contact structure comprises a layer of semiconductor material, a layer of insulating material having a contact opening formed therein, a layer of...
2016/0276274 POWER AND GROUND ROUTING OF INTEGRATED CIRCUIT DEVICES WITH IMPROVED IR DROP AND CHIP PERFORMANCE
An integrated circuit chip includes a semiconductor substrate having thereon a plurality of inter-metal dielectric (IMD) layers and a plurality of first...
2016/0276273 SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME
A method for fabricating a semiconductor device includes preparing a substrate which includes a memory cell region and a peripheral circuit region; forming a...
2016/0276272 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a first dielectric layer over the substrate. The...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.