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STRUCTURE AND FORMATION METHOD OF DAMASCENE STRUCTURE
A structure and a formation method of a semiconductor device are provided. The semiconductor device includes a semiconductor substrate and a first conductive...
MAGNETIC TRAP FOR CYLINDRICAL DIAMAGNETIC MATERIALS
A magnetic trap is configured to arrange at least one diamagnetic rod. The magnetic trap includes first and second magnets on a substrate that forms the...
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
According to one embodiment, a method of manufacturing a semiconductor device, the method includes forming a graphene film on a catalytic layer, removing a...
METHOD OF MANUFACTURING Cu WIRING
In a Cu wiring manufacturing method, a MnO.sub.x film which becomes a self-formed barrier film by reaction with an interlayer insulating film of a substrate is...
DIFFUSION BARRIER LAYER FORMATION
A method of forming a titanium nitride (TiN) diffusion barrier includes exposing a deposition surface to a first pulse of a titanium-containing precursor and...
ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS
Compositions of matter, compounds, articles of manufacture and processes to reduce or substantially eliminate EM and/or stress migration, and/or TDDB in copper...
Method for Manufacturing Semiconductor Device
A method for manufacturing a semiconductor device is provided. The method comprises steps as follows. At least one trench is provided in a low-k dielectric...
METHODS FOR ETCHING VIA ATOMIC LAYER DEPOSITION (ALD) CYCLES
Methods for etching a substrate are provided herein. In some embodiments, a method for etching a substrate disposed within a processing volume of a process...
Semiconductor device and method for forming a semiconductor device are presented. The method includes providing a substrate having a device component with a...
Method For Producing Semiconductor Device
A semiconductor device is produced while keeping a short circuit margin between its interconnects. A method therefor includes a step in which when a...
Manufacturing Method of Semiconductor Device
In order to provide a semiconductor device with high reliability while manufacturing cost is being suppressed, dry etching for an insulating film is performed...
INTEGRATED CIRCUITS USING SILICON ON INSULATOR SUBSTRATES AND METHODS OF
MANUFACTURING THE SAME
Integrated circuits and methods for manufacturing the same are provided. A method for producing an integrated circuit includes forming a deep isolation block...
HANDLE SUBSTRATE FOR USE IN MANUFACTURE OF SEMICONDUCTOR-ON-INSULATOR
STRUCTURE AND METHOD OF MANUFACTURING THEREOF
A method is provided for preparing a high resistivity silicon handle substrate for use in semiconductor-on-insulator structure. The handle substrate is...
SELECTIVE FORMATION OF METALLIC FILMS ON METALLIC SURFACES
Metallic layers can be selectively deposited on surfaces of a substrate relative to a second surface of the substrate. In preferred embodiments, the metallic...
CUP-WASH DEVICE, SEMICONDUCTOR APPARATUS, AND CUP CLEANING METHOD
A cup-wash device is provided. The cup-wash device includes a supporting disk and a base disposed on the supporting disk. The base includes a catchment groove,...
Substrate Processing Apparatus
A substrate processing apparatus includes: a substrate holder which holds a plurality of substrates; a processing vessel including an inner tube and an outer...
Method and Apparatus for Transfer of Semiconductor Devices
An apparatus includes a first frame to hold a wafer tape having a first side and a second side. A plurality of semiconductor device dies are disposed on the...
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR
A method of manufacturing a semiconductor device uses a semiconductor manufacturing apparatus including a turn table allowing placement of at least first and...
Wafer pin chuck fabrication and repair
In a wafer chuck design featuring pins or "mesas" making up the support surface, engineering the pins to have an annular shape, or to contain holes or pits,...
CARRIER SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF
MANUFACTURING FLEXIBLE DISPLAY DEVICE USING...
A carrier substrate includes: a base substrate; a first coating layer on a first surface of the base substrate; and a second coating layer on a second surface...
SEMICONDUCTOR MANUFACTURING METHOD AND LAMINATED BODY
A semiconductor manufacturing method according to a present embodiment includes forming a supporter on a second surface of a semiconductor substrate opposite...
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING DEVICE
According to one embodiment, a semiconductor manufacturing method for a stacked body that includes a semiconductor substrate, a supporting substrate containing...
DECOMPRESSION PROCESSING APPARATUS
In a state in which a wafer held by a holding portion contacts with an attraction face of an electrostatic chuck after a loading unit loads the wafer into a...
According to an aspect of an embodiment of the invention, there is provided an electrostatic chuck including: a ceramic dielectric substrate including a first...
GAS FLOW FOR CONDENSATION REDUCTION WITH A SUBSTRATE PROCESSING CHUCK
A gas flow is described to reduce condensation with a substrate processing chuck. In one example, a workpiece holder in the chamber having a puck to carry the...
CERAMIC ELECTROSTATIC CHUCK BONDED WITH HIGH TEMPERATURE POLYMER BOND TO
Implementations described herein provide a substrate support assembly which enables high temperature processing. The substrate support assembly includes an...
METHOD FOR TRANSFER OF SEMICONDUCTOR DEVICES
A method of transferring semiconductor devices to a product substrate includes positioning a surface of the product substrate to face a first surface of a...
STOCKER AND METHOD FOR DISPATCHING WAFER CARRIER IN STOCKER
A stocker includes a storage shelf, an output-relay shelf, a first crane, an output shelf, a second crane, and a controller. The storage shelf has a plurality...
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
A substrate processing method comprises: an execution step of executing the first processing for the plurality of substrates, and executing the second...
COMMUNICATION DEVICE AND METHOD FOR CONTROLLING COMMUNICATION DEVICE
A communication device includes a communicator that performs communication via a network, IO ports that connect with a manufacturing apparatus, a packet...
Article Transport Facility and Inspection Unit
An article transport facility includes an alignment portion that aligns the position of an inspection unit that is transferred to a transport target location...
TOWERS FOR SUBSTRATE CARRIERS
A diffuser tower assembly having a diffuser with a flared end and a fitting with an offset portion and nipple sized for the flared end. The assembly may be...
GAS PURGE APPARATUS, LOAD PORT APPARATUS, AND GAS PURGE METHOD
A gas purge apparatus, a load port apparatus, and a gas purge method are capable of filling a container with a cleaning gas without leaning the container to be...
END STRUCTURE OF NOZZLE, PURGING DEVICE, AND LOAD PORT
There is provided an end structure of a nozzle 11 including a gas-flow passage 13 communicable with an opening 104 provided through a bottom of a container 100...
OPERATING METHODS OF PURGE DEVICES FOR CONTAINERS
Operating methods of purge devices for containers are provided. The operating methods comprise a step of aligning an opening of a container to a first purging...
WAFER TRANSPORT METHOD
A wafer transport method is provided. The wafer transport method includes loading an initial carrier containing a first wafer and a second wafer on a first...
METHOD AND APPARATUS FOR MAKING INTEGRATED CIRCUIT PACKAGES
A method of making a plurality of integrated circuit ("IC") packages includes picking up a plurality of physically unconnected IC components; and...
Systems and methods for reducing pulsed laser beam profile
non-uniformities for laser annealing
Systems and methods for reducing pulsed laser beam profile non-uniformities for laser annealing are disclosed. The methods include directing an initial pulsed...
Substrate Processing Apparatus
A technique partially adjusts a plasma distribution in a processing region in order to suppress the reduction in in-plane uniformity of a film formed on a...
APPARATUS AND METHOD FOR SCANNING AN OBJECT THROUGH A FLUID STREAM
An apparatus for treating the surface of a microelectronic workpiece via impingement of the surface with at least one fluid and a method for operating the...
SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD
In one embodiment, a substrate cleaning apparatus includes a plurality of rollers configured to hold and rotate a substrate. The apparatus further includes one...
WAFER DRYING APPARATUS AND METHOD FOR DRYING A WAFER
A wafer drying apparatus includes air supply unit having first and second air supply tube provided at respective first and second front-surface side of wafer,...
NITROGEN OXIDE ABATEMENT IN SEMICONDUCTOR FABRICATION
Embodiments enclosed herein relate to methods and apparatus for reducing nitrogen oxides (NO.sub.x) produced during processing, such as during semiconductor...
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of...
THERMALLY-ENHANCED PROVISION OF UNDERFILL TO ELECTRONIC DEVICES
A method of feeding underfill material to fill a space between a semiconductor die and a substrate onto which the semiconductor die has been bonded, the method...
REDUCTION OF DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES
Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces...
LEAD FRAME STRUCTURE, METHOD OF MANUFACTURING LEAD FRAME STRUCTURE, AND
A lead frame structure includes a lead frame having a first surface, a second surface opposed to, and facing away from, the first surface, and a first...
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this...
POWER DISTRIBUTION IMPROVEMENT USING PSEUDO-ESR CONTROL OF AN EMBEDDED
A fan-out wafer level package structure may include a multilayer redistribution layer (RDL). The multilayer RDL may be configured to couple with terminals of...
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME AND POWER CONVERTER
An object is to avoid an increase in contact resistance of an ohmic electrode by etching in a semiconductor device. There is provided a method of manufacturing...