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Patent # Description
2016/0276221 STRUCTURE AND FORMATION METHOD OF DAMASCENE STRUCTURE
A structure and a formation method of a semiconductor device are provided. The semiconductor device includes a semiconductor substrate and a first conductive...
2016/0276220 MAGNETIC TRAP FOR CYLINDRICAL DIAMAGNETIC MATERIALS
A magnetic trap is configured to arrange at least one diamagnetic rod. The magnetic trap includes first and second magnets on a substrate that forms the...
2016/0276219 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
According to one embodiment, a method of manufacturing a semiconductor device, the method includes forming a graphene film on a catalytic layer, removing a...
2016/0276218 METHOD OF MANUFACTURING Cu WIRING
In a Cu wiring manufacturing method, a MnO.sub.x film which becomes a self-formed barrier film by reaction with an interlayer insulating film of a substrate is...
2016/0276217 DIFFUSION BARRIER LAYER FORMATION
A method of forming a titanium nitride (TiN) diffusion barrier includes exposing a deposition surface to a first pulse of a titanium-containing precursor and...
2016/0276216 ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS
Compositions of matter, compounds, articles of manufacture and processes to reduce or substantially eliminate EM and/or stress migration, and/or TDDB in copper...
2016/0276215 Method for Manufacturing Semiconductor Device
A method for manufacturing a semiconductor device is provided. The method comprises steps as follows. At least one trench is provided in a low-k dielectric...
2016/0276214 METHODS FOR ETCHING VIA ATOMIC LAYER DEPOSITION (ALD) CYCLES
Methods for etching a substrate are provided herein. In some embodiments, a method for etching a substrate disposed within a processing volume of a process...
2016/0276213 RELIABLE CONTACTS
Semiconductor device and method for forming a semiconductor device are presented. The method includes providing a substrate having a device component with a...
2016/0276212 Method For Producing Semiconductor Device
A semiconductor device is produced while keeping a short circuit margin between its interconnects. A method therefor includes a step in which when a...
2016/0276211 Manufacturing Method of Semiconductor Device
In order to provide a semiconductor device with high reliability while manufacturing cost is being suppressed, dry etching for an insulating film is performed...
2016/0276210 INTEGRATED CIRCUITS USING SILICON ON INSULATOR SUBSTRATES AND METHODS OF MANUFACTURING THE SAME
Integrated circuits and methods for manufacturing the same are provided. A method for producing an integrated circuit includes forming a deep isolation block...
2016/0276209 HANDLE SUBSTRATE FOR USE IN MANUFACTURE OF SEMICONDUCTOR-ON-INSULATOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF
A method is provided for preparing a high resistivity silicon handle substrate for use in semiconductor-on-insulator structure. The handle substrate is...
2016/0276208 SELECTIVE FORMATION OF METALLIC FILMS ON METALLIC SURFACES
Metallic layers can be selectively deposited on surfaces of a substrate relative to a second surface of the substrate. In preferred embodiments, the metallic...
2016/0276207 CUP-WASH DEVICE, SEMICONDUCTOR APPARATUS, AND CUP CLEANING METHOD
A cup-wash device is provided. The cup-wash device includes a supporting disk and a base disposed on the supporting disk. The base includes a catchment groove,...
2016/0276206 Substrate Processing Apparatus
A substrate processing apparatus includes: a substrate holder which holds a plurality of substrates; a processing vessel including an inner tube and an outer...
2016/0276205 Method and Apparatus for Transfer of Semiconductor Devices
An apparatus includes a first frame to hold a wafer tape having a first side and a second side. A plurality of semiconductor device dies are disposed on the...
2016/0276204 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS
A method of manufacturing a semiconductor device uses a semiconductor manufacturing apparatus including a turn table allowing placement of at least first and...
2016/0276203 Wafer pin chuck fabrication and repair
In a wafer chuck design featuring pins or "mesas" making up the support surface, engineering the pins to have an annular shape, or to contain holes or pits,...
2016/0276202 CARRIER SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING FLEXIBLE DISPLAY DEVICE USING...
A carrier substrate includes: a base substrate; a first coating layer on a first surface of the base substrate; and a second coating layer on a second surface...
2016/0276201 SEMICONDUCTOR MANUFACTURING METHOD AND LAMINATED BODY
A semiconductor manufacturing method according to a present embodiment includes forming a supporter on a second surface of a semiconductor substrate opposite...
2016/0276200 SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING DEVICE
According to one embodiment, a semiconductor manufacturing method for a stacked body that includes a semiconductor substrate, a supporting substrate containing...
2016/0276199 DECOMPRESSION PROCESSING APPARATUS
In a state in which a wafer held by a holding portion contacts with an attraction face of an electrostatic chuck after a loading unit loads the wafer into a...
2016/0276198 ELECTROSTATIC CHUCK
According to an aspect of an embodiment of the invention, there is provided an electrostatic chuck including: a ceramic dielectric substrate including a first...
2016/0276197 GAS FLOW FOR CONDENSATION REDUCTION WITH A SUBSTRATE PROCESSING CHUCK
A gas flow is described to reduce condensation with a substrate processing chuck. In one example, a workpiece holder in the chamber having a puck to carry the...
2016/0276196 CERAMIC ELECTROSTATIC CHUCK BONDED WITH HIGH TEMPERATURE POLYMER BOND TO METAL BASE
Implementations described herein provide a substrate support assembly which enables high temperature processing. The substrate support assembly includes an...
2016/0276195 METHOD FOR TRANSFER OF SEMICONDUCTOR DEVICES
A method of transferring semiconductor devices to a product substrate includes positioning a surface of the product substrate to face a first surface of a...
2016/0276194 STOCKER AND METHOD FOR DISPATCHING WAFER CARRIER IN STOCKER
A stocker includes a storage shelf, an output-relay shelf, a first crane, an output shelf, a second crane, and a controller. The storage shelf has a plurality...
2016/0276193 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
A substrate processing method comprises: an execution step of executing the first processing for the plurality of substrates, and executing the second...
2016/0276192 COMMUNICATION DEVICE AND METHOD FOR CONTROLLING COMMUNICATION DEVICE
A communication device includes a communicator that performs communication via a network, IO ports that connect with a manufacturing apparatus, a packet...
2016/0276191 Article Transport Facility and Inspection Unit
An article transport facility includes an alignment portion that aligns the position of an inspection unit that is transferred to a transport target location...
2016/0276190 TOWERS FOR SUBSTRATE CARRIERS
A diffuser tower assembly having a diffuser with a flared end and a fitting with an offset portion and nipple sized for the flared end. The assembly may be...
2016/0276189 GAS PURGE APPARATUS, LOAD PORT APPARATUS, AND GAS PURGE METHOD
A gas purge apparatus, a load port apparatus, and a gas purge method are capable of filling a container with a cleaning gas without leaning the container to be...
2016/0276188 END STRUCTURE OF NOZZLE, PURGING DEVICE, AND LOAD PORT
There is provided an end structure of a nozzle 11 including a gas-flow passage 13 communicable with an opening 104 provided through a bottom of a container 100...
2016/0276187 OPERATING METHODS OF PURGE DEVICES FOR CONTAINERS
Operating methods of purge devices for containers are provided. The operating methods comprise a step of aligning an opening of a container to a first purging...
2016/0276186 WAFER TRANSPORT METHOD
A wafer transport method is provided. The wafer transport method includes loading an initial carrier containing a first wafer and a second wafer on a first...
2016/0276185 METHOD AND APPARATUS FOR MAKING INTEGRATED CIRCUIT PACKAGES
A method of making a plurality of integrated circuit ("IC") packages includes picking up a plurality of physically unconnected IC components; and...
2016/0276184 Systems and methods for reducing pulsed laser beam profile non-uniformities for laser annealing
Systems and methods for reducing pulsed laser beam profile non-uniformities for laser annealing are disclosed. The methods include directing an initial pulsed...
2016/0276183 Substrate Processing Apparatus
A technique partially adjusts a plasma distribution in a processing region in order to suppress the reduction in in-plane uniformity of a film formed on a...
2016/0276182 APPARATUS AND METHOD FOR SCANNING AN OBJECT THROUGH A FLUID STREAM
An apparatus for treating the surface of a microelectronic workpiece via impingement of the surface with at least one fluid and a method for operating the...
2016/0276181 SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD
In one embodiment, a substrate cleaning apparatus includes a plurality of rollers configured to hold and rotate a substrate. The apparatus further includes one...
2016/0276180 WAFER DRYING APPARATUS AND METHOD FOR DRYING A WAFER
A wafer drying apparatus includes air supply unit having first and second air supply tube provided at respective first and second front-surface side of wafer,...
2016/0276179 NITROGEN OXIDE ABATEMENT IN SEMICONDUCTOR FABRICATION
Embodiments enclosed herein relate to methods and apparatus for reducing nitrogen oxides (NO.sub.x) produced during processing, such as during semiconductor...
2016/0276178 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of...
2016/0276177 THERMALLY-ENHANCED PROVISION OF UNDERFILL TO ELECTRONIC DEVICES
A method of feeding underfill material to fill a space between a semiconductor die and a substrate onto which the semiconductor die has been bonded, the method...
2016/0276176 REDUCTION OF DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES
Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces...
2016/0276175 LEAD FRAME STRUCTURE, METHOD OF MANUFACTURING LEAD FRAME STRUCTURE, AND SEMICONDUCTOR DEVICE
A lead frame structure includes a lead frame having a first surface, a second surface opposed to, and facing away from, the first surface, and a first...
2016/0276174 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this...
2016/0276173 POWER DISTRIBUTION IMPROVEMENT USING PSEUDO-ESR CONTROL OF AN EMBEDDED PASSIVE CAPACITOR
A fan-out wafer level package structure may include a multilayer redistribution layer (RDL). The multilayer RDL may be configured to couple with terminals of...
2016/0276172 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME AND POWER CONVERTER
An object is to avoid an increase in contact resistance of an ohmic electrode by etching in a semiconductor device. There is provided a method of manufacturing...
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