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Patent # Description
2016/0276171 Surface Treatment Method for Atomically Flattening a Silicon Wafer and Heat Treatment Apparatus
In a silicon wafer which has a surface with a plurality of terraces formed stepwise by single-atomic-layer steps, respectively, no slip line is formed.
2016/0276170 SEMICONDUCTOR MANUFACTURING METHOD
A semiconductor manufacturing method in accordance with an embodiment includes feeding a first gas, which contains a component of a first film, to a reaction...
2016/0276169 METHOD OF FORMING COPPER INTERCONNECTS
A method of forming copper interconnects includes: depositing a dielectric layer on a silicon wafer substrate; forming vias and/or trenches in the dielectric...
2016/0276168 METHOD FOR THERMAL PROCESS IN PACKAGING ASSEMBLY OF SEMICONDUCTOR
A method for thermal process in packaging assembly of semiconductor is disclosed. The high-pressure overheated vapor is injected into the process chamber. The...
2016/0276167 PATTERN FORMATION METHOD
According to one embodiment, a pattern formation method includes forming a resist pattern on an underlying film, slimming the resist pattern, forming a pinning...
2016/0276166 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
In one embodiment, a method of manufacturing a semiconductor device includes forming a first silicon oxide film having a first carbon content above a...
2016/0276165 METHOD OF INTERFACIAL OXIDE LAYER FORMATION IN SEMICONDUCTOR DEVICE
A method of an interfacial oxide layer formation comprises a plurality of steps. The step (S1) is to remove a native oxide layer from a surface of a substrate;...
2016/0276164 Method for Forming Patterns with Sharp Jogs
The present disclosure provides a method for forming patterns in a semiconductor device. The method includes forming a main pattern on a substrate; forming a...
2016/0276163 METHOD TO IMPROVE FINFET CUT OVERLAY
A patterned photoresist having an overlay tolerance of (x+y)/2 is formed over preselected hard mask portions or semiconductor fin portions, wherein x is a...
2016/0276162 ATOMIC LAYER PROCESS CHAMBER FOR 3D CONFORMAL PROCESSING
Embodiments described herein relate to methods for forming or treating material layers on semiconductor substrates. In one embodiment, a method for performing...
2016/0276161 TA BASED OHMIC CONTACT
A method of forming an Ohmic contact including forming a Ta layer in a contact area of a barrier, forming a Ti layer on the first Ta layer, and forming an Al...
2016/0276160 Silicide Region of Gate-All-Around Transistor
The disclosure relates to a semiconductor device and methods of forming same. A representative structure for a semiconductor device comprises a substrate; a...
2016/0276159 Contact Formation for Split Gate Flash Memory
An integrated circuit structure includes a plurality of flash memory cells forming a memory array, wherein each of the plurality of flash memory cells includes...
2016/0276158 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
A semiconductor structure comprising a first layer, a metal layer and a second layer is disclosed. The first layer comprises a recessed surface. The metal...
2016/0276157 METHOD OF FORMING A SEMICONDUCTOR STRUCTURE
A method of forming a semiconductor device is disclosed. A substrate having a dielectric layer thereon is provided. The dielectric layer has a gate trench...
2016/0276156 SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF
A semiconductor device is provided which includes a dielectric layer over a gate structure of the semiconductor device. The semiconductor device also includes...
2016/0276155 DOPANT PRECURSORS FOR MONO-LAYER DOPING
A doping process is described, which includes applying to a substrate a film of dopant material that bonds to the substrate by at least one of hydrogen bonding...
2016/0276154 CUT LAST SELF-ALIGNED LITHO-ETCH PATTERNING
The present disclosure relates to a method of performing a semiconductor fabrication process. In some embodiments, the method is performed by forming a spacer...
2016/0276153 Self-Aligned Patterning Process
Embodiments of the present disclosure are a method of forming a semiconductor device and methods of patterning a semiconductor device. An embodiment is a...
2016/0276152 PATTERNING PROCESS
The present invention provides a patterning process, which comprises step of forming a BPSG film on the under layer film by using a composition for forming a...
2016/0276151 Priming Material for Substrate Coating
A coating technique and a priming material are provided. In an exemplary embodiment, the coating technique includes receiving a substrate and identifying a...
2016/0276150 PULSED PLASMA FOR FILM DEPOSITION
Methods of processing a substrate are provided herein. In some embodiments, a method of processing a substrate disposed in a processing chamber includes: (a)...
2016/0276149 Spin-On Layer for Directed Self Assembly with Tunable Neutrality
Techniques disclosed herein include methods for creating a directed self-assembly tunable neutral layer that works with multiple different block copolymer...
2016/0276148 ULTRATHIN ATOMIC LAYER DEPOSITION FILM ACCURACY THICKNESS CONTROL
Methods for depositing ultrathin films by atomic layer deposition with reduced wafer-to-wafer variation are provided. Methods involve exposing the substrate to...
2016/0276147 Silicon Nitride Film Forming Method and Silicon Nitride Film Forming Apparatus
A silicon nitride film forming method includes accommodating a workpiece within a reaction chamber, forming a silicon nitride film on the workpiece...
2016/0276146 FLAT GAS DISCHARGE TUBE DEVICES AND METHODS
Devices and methods related to flat discharge tubes. In some embodiments, a gas discharge tube (GDT) device can include a first insulator substrate having...
2016/0276145 APPARATUS AND METHOD FOR RAPID CHEMICAL ANALYSIS USING DIFFERENTIAL DESORPTION
The present invention is directed to a method and device to generate a chemical signature for a mixture of analytes. The present invention involves using a...
2016/0276144 RUGGEDIZED ADVANCED IDENTIFICATION MASS SPECTROMETER
A dual-ionization mass spectrometer includes a first mass spectrometer module forming a hard ionization mass spectrometer, a second mass spectrometer forming a...
2016/0276143 TARGET FOR MAGNETRON SPUTTERING
The invention provides a new sputtering target that provides a large leakage of magnetic flux, is free of the risk of a change of composition during...
2016/0276142 SUBSTRATE CARRIER FOR A REDUCED TRANSMISSION OF THERMAL ENERGY
According to the present disclosure, a semiconductor substrate handling systems and substrate carrier is provided. The substrate carrier for holding a...
2016/0276141 Semiconductor processing apparatus with protective coating including amorphous phase
Embodiments of the invention relate to compositions including a yttrium-based fluoride crystal phase, or a yttrium-based oxyfluoride crystal phase, or an...
2016/0276140 GROUND STATE HYDROGEN RADICAL SOURCES FOR CHEMICAL VAPOR DEPOSITION OF SILICON-CARBON-CONTAINING FILMS
A thin layer of a silicon-carbon-containing film is deposited on a substrate by generating hydrogen radicals from hydrogen gas supplied to a radicals...
2016/0276139 TUNER, MICROWAVE PLASMA SOURCE AND IMPEDANCE MATCHING METHOD
A tuner 43 includes a microwave transmission path 51, having a coaxial structure, configured to transmit a supplied microwave to a planar slot antenna 101;...
2016/0276138 POWER GENERATOR WITH FREQUENCY TUNING FOR USE WITH PLASMA LOADS
A generator and method for tuning the generator are disclosed. The method includes setting the frequency of power applied by the generator to a current best...
2016/0276137 SUB-PULSING DURING A STATE
A method for achieving sub-pulsing during a state is described. The method includes receiving a clock signal from a clock source, the clock signal having two...
2016/0276136 Elongated Capacitively Coupled Plasma Source For High Temperature Low Pressure Environments
A modular plasma source assembly for use with a processing chamber is described. The assembly includes an RF hot electrode with an end dielectric and a sliding...
2016/0276135 SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus includes a substrate mounting table on which a substrate is mounted, a process chamber including the substrate mounting table,...
2016/0276134 ION-ION PLASMA ATOMIC LAYER ETCH PROCESS AND REACTOR
A reactor with an overhead electron beam source is capable of generating an ion-ion plasma for performing an atomic layer etch process.
2016/0276133 PLASMA ETCHING OF POROUS SUBSTRATES
The disclosed technology generally relates to semiconductor fabrication, and more particularly to plasma etching of dielectric materials having pores. In one...
2016/0276132 Multi-Beam Writing of Pattern Areas of Relaxed Critical Dimension
To irradiate a target with a beam of energetic electrically charged particles, the beam is formed and imaged onto a target, where it generates a pattern image...
2016/0276131 Bi-Directional Double-Pass Multi-Beam Writing
To irradiate a target with a beam of energetic electrically charged particles, the beam is formed and imaged onto a target, where it generates a pattern image...
2016/0276130 METHOD OF PERFORMING SPECTROSCOPY IN A TRANSMISSION CHARGED-PARTICLE MICROSCOPE
A Transmission Charged-Particle Microscope, comprising: A specimen holder, for holding a specimen; A source, for producing a beam of charged particles; An...
2016/0276129 COMPRESSIVE TRANSMISSION MICROSCOPY
Transmission microscopy imaging systems include a mask and/or other modulator situated to encode image beams, e.g., by deflecting the image beam with respect...
2016/0276128 Charged Particle Beam Apparatus, Image Forming Method Using a Charged Particle Beam Apparatus, and Image...
To provide a charged particle beam apparatus capable of obtaining an image with high contrast and high visibility, the apparatus has: a charged particle...
2016/0276127 SYSTEM AND METHOD FOR SCANNING AN OBJECT
A system for scanning an object, the system may include (a) charged particles optics that is configured to: scan, with a charged particle beam and at a first...
2016/0276126 LOW SPECIMEN DRIFT TEM HOLDER AND COOLER FOR USE IN MICROSCOPY
A low specimen drift holder and cooler for use in microscopy, and a microscope comprising said holder. The present invention is in the field of microscopy,...
2016/0276125 Phase Plate, Method of Fabricating Same, and Electron Microscope
A phase plate capable of suppressing electrification and a method of fabricating the plate are provided. The phase plate is for use in an electron microscope...
2016/0276124 X-RAY TUBE
According to one embodiment, an X-ray tube includes a cathode, an anode target and an envelope. The cathode includes an insulating member, a conductive line, a...
2016/0276123 COMPACT DUAL ELEMENT FUSE UNIT, MODULE AND FUSIBLE DISCONNECT SWITCH
An embodiment of a fuse module has been disclosed. The fuse module includes a housing and a fuse element assembly contained within the housing. The fuse...
2016/0276122 Method for controlling a contactor device, and control unit
A method performed in a control unit for opening a contactor device. The contactor device includes a carrier being movable between a closed position in which a...
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