At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.
SEMICONDUCTOR SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD OF
MANUFACTURING THE SAME
The present disclosure relates to a semiconductor substrate structure, semiconductor package and method of manufacturing the same. The semiconductor substrate...
INTERCONNECT STRUCTURE AND METHOD OF FABRICATING SAME
An interconnect structure and a method of fabrication of the same are introduced. In an embodiment, a post passivation interconnect (PPI) structure is formed...
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of...
METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON
A method of forming bond pads includes providing a substrate including an integrated circuit (IC) device formed thereon having an oxidizable uppermost metal...
SEMICONDUCTOR CHIP, FLIP CHIP PACKAGE AND WAFER LEVEL PACKAGE INCLUDING
A semiconductor chip may include a semiconductor substrate, a first central pad, a second central pad, a first peripheral pad, a second peripheral pad, a first...
Fan-Out Interconnect Structure and Method for Forming Same
A method embodiment includes forming a sacrificial film layer over a top surface of a die, the die having a contact pad at the top surface. The die is attached...
Fan Out Package Method
Methods of forming packages include forming an encapsulant laterally encapsulating a die over an active surface of the die. The active surface has an...
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
A semiconductor device includes plural electrode pads arranged in an active region of a semiconductor chip, and wiring layers provided below the plural...
Integrated quantized inductor and fabrication method thereof
The present invention relates to RFIC process design kits and microelectronics device technologies. More particularly, the invention relates to inductors,...
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device with improved reliability is provided. The semiconductor device is characterized by its embodiments in that sloped portions are formed...
NANOSTRUCTURED CHIP AND METHOD OF PRODUCING THE SAME
A nanostructured chip includes a substrate and a nanostructured layer, wherein the substrate has a first surface and a second surface on which the...
METHOD FOR PROCESSING A DIE
In various embodiments, a die is provided. The die may include a die body, and at least one of a front side metallization structure on a front side of the die...
SECURE CHIP WITH PHYSICALLY UNCLONABLE FUNCTION
A first trench having a first aspect ratio and a second trench having a second aspect ratio that is greater than the first trench are provided into a material...
GRAPHENE WIRING STRUCTURE AND MANUFACTURING METHOD THEREOF
A graphene wring structure of an embodiment includes multilayer graphene, a first interlayer compound existing in an interlayer space of the multilayer...
SEMICONDUCTOR STRUCTURES HAVING LOW RESISTANCE PATHS THROUGHOUT A WAFER
A semiconductor structure with low resistance conduction paths and methods of manufacture are disclosed. The method includes forming at least one low...
EMBEDDED STRUCTURES FOR PACKAGE-ON-PACKAGE ARCHITECTURE
Electronic assemblies including substrates and their manufacture are described. One assembly includes a die embedded in a dielectric layer in a multilayer...
SEMICONDUCTOR FUSES WITH NANOWIRE FUSE LINKS AND FABRICATION METHODS
Semiconductor fuses with nanowire fuse links and fabrication methods thereof are presented. The methods include, for instance: fabricating a semiconductor...
PACKAGE ON PACKAGE ARCHITECTURE AND METHOD FOR MAKING
Embodiments of the present disclosure are directed to package assemblies and methods for fabricating package assemblies. In one embodiment, a package assembly...
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
A semiconductor device is disclosed. The semiconductor device includes: a substrate having a gate structure thereon and a first interlayer dielectric (ILD)...
SEMICONDUCTOR DEVICE HAVING BURIED WORDLINES
A memory device includes a substrate having thereon a plurality of active areas that are isolated from one another by a shallow trench isolation (STI) region....
The present disclosure relates to a semiconductor structure, which includes a semiconductor substrate, an insulating layer and a plurality of wirings. The...
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
A chip package structure can include: a lead frame having a carrier substrate and a first lead around the carrier substrate; a first conductive post arranged...
GLASS CORE SUBSTRATE FOR INTEGRATED CIRCUIT DEVICES AND METHODS OF MAKING
Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up...
A wiring board includes an insulating substrate having a plurality of laminated insulating layers and a mounting part in one surface of the insulating...
HIGH DENSITY PACKAGE INTERCONNECTS
Electronic assemblies and methods including the formation of interconnect structures are described. In one embodiment an apparatus includes semiconductor die...
SEMICONDUCTOR TRANSISTOR PACKAGE STRUCTURE
A semiconductor transistor package structure is disclosed and is applicable for the transistors, such as IGBT or MOSFET. The structure is mainly used for...
MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION
A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe,...
ELECTRONIC COMPONENT PACKAGE
Provided is a rational arrangement of an electronic component package that tightly keeps a connecting state of a lead member to a conductive pad of a...
SUBSTRATE INTERPOSER ON A LEADFRAME
In one general aspect, a device can include a leadframe including at least one of an external input terminal or an external output terminal, an interposer made...
BENDABLE AND STRETCHABLE ELECTRONIC DEVICES AND METHODS
Generally discussed herein are systems and methods that can include a stretchable and bendable device. According to an example a method can include (1)...
Co-Packaged Die on Leadframe with Common Contact
A leadframe includes a common contact. A first transistor is disposed over the leadframe with a first interconnect structure of the first transistor disposed...
THIN SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURE
In a general aspect, a packaged semiconductor device can include a semiconductor die having at least a first terminal on a first side of the semiconductor die...
Staged via formation from both sides of chip
A method of fabricating a semiconductor assembly can include providing a semiconductor element having a front surface, a rear surface, and a plurality of...
SEMICONDUCTOR DEVICES HAVING CONDUCTIVE VIAS AND METHODS OF FORMING THE
Semiconductor devices having a conductive via and methods of forming the same are described herein. As an example, a semiconductor devices may include a...
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE WITH STATOR SET FORMED BY
A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface...
HEAT SINK STRUCTURE, SEMICONDUCTOR DEVICE AND HEAT SINK MOUNTING METHOD
[Problem to be solved] In an electronic device that contains a plurality of heat-generating components, not all the heat-dissipation capabilities of the ...
COOLING DEVICE AND DEVICE
Heat dissipaters 120a, 120b are thermally coupled to a memory 220 and a CPU 230 (heat generating components) disposed on a top surface (a first surface) of a...
COOLING STRUCTURE AND DEVICE
An object of the present invention is to constantly maintain the degree of contact between a heat generating element that generates high temperature and a heat...
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
An electronic component has a circuit board with a main surface, a chip having a sensor facing the main surface, bump electrodes disposed between the main...
LOW PROFILE IC PACKAGE
An IC package without using an interposer is disclosed to form a low profile IC package. A single redistribution layer is fabricated according to IC process. A...
Semiconductor Package with Embedded Die
A semiconductor package having an embedded die and solid vertical interconnections, such as stud bump interconnections, for increased integration in the...
A semiconductor device includes: a resin case that houses a semiconductor element; a parallel plate that is disposed inside the resin case while being...
POLISHING APPARATUS AND POLISHING METHOD
A polishing apparatus capable of achieving a good control operation for a distribution of remaining film thickness is disclosed. The polishing apparatus...
MOVEABLE AND ADJUSTABLE GAS INJECTORS FOR AN ETCHING CHAMBER
An apparatus for increasing the uniformity in a critical dimension of chemical vapor deposition and etching during substrate processing, comprising a plurality...
POLISHING WITH MEASUREMENT PRIOR TO DEPOSITION OF OUTER LAYER
A method of controlling polishing includes storing a base measurement, the base measurement being a measurement of a substrate after deposition of at least one...
METHOD FOR MANUFACTURING ORGANIC EL DISPLAY DEVICE, AND FILM THICKNESS
In a method for manufacturing an organic EL display device, an underlying film is formed on each of a plurality of crystal oscillators of a film thickness...
Film Forming Method, Film Forming Apparatus, and Storage Medium
A film forming apparatus, which forms a thin film formed of a metal oxide on a substrate by alternately supplying a raw material gas formed of an organic...
CUTTING DEVICE AND CUTTING METHOD
A cutting device includes: an imaging module for capturing first marks and third marks, to produce primary image data; and a control module for aligning, by a...
WORKPIECE CUTTING METHOD
A workpiece cutting method of cutting a workpiece having a front side on which a plurality of crossing division lines are formed to define a plurality of...
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
A plasma processing method of processing layer structure previously formed on an upper surface of a wafer disposed in a processing chamber within a vacuum...