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Patent # Description
2016/0284659 SEMICONDUCTOR SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
The present disclosure relates to a semiconductor substrate structure, semiconductor package and method of manufacturing the same. The semiconductor substrate...
2016/0284658 INTERCONNECT STRUCTURE AND METHOD OF FABRICATING SAME
An interconnect structure and a method of fabrication of the same are introduced. In an embodiment, a post passivation interconnect (PPI) structure is formed...
2016/0284657 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of...
2016/0284656 METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON
A method of forming bond pads includes providing a substrate including an integrated circuit (IC) device formed thereon having an oxidizable uppermost metal...
2016/0284655 SEMICONDUCTOR CHIP, FLIP CHIP PACKAGE AND WAFER LEVEL PACKAGE INCLUDING THE SAME
A semiconductor chip may include a semiconductor substrate, a first central pad, a second central pad, a first peripheral pad, a second peripheral pad, a first...
2016/0284654 Fan-Out Interconnect Structure and Method for Forming Same
A method embodiment includes forming a sacrificial film layer over a top surface of a die, the die having a contact pad at the top surface. The die is attached...
2016/0284653 Fan Out Package Method
Methods of forming packages include forming an encapsulant laterally encapsulating a die over an active surface of the die. The active surface has an...
2016/0284652 SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
A semiconductor device includes plural electrode pads arranged in an active region of a semiconductor chip, and wiring layers provided below the plural...
2016/0284651 Integrated quantized inductor and fabrication method thereof
The present invention relates to RFIC process design kits and microelectronics device technologies. More particularly, the invention relates to inductors,...
2016/0284650 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device with improved reliability is provided. The semiconductor device is characterized by its embodiments in that sloped portions are formed...
2016/0284649 NANOSTRUCTURED CHIP AND METHOD OF PRODUCING THE SAME
A nanostructured chip includes a substrate and a nanostructured layer, wherein the substrate has a first surface and a second surface on which the...
2016/0284648 METHOD FOR PROCESSING A DIE
In various embodiments, a die is provided. The die may include a die body, and at least one of a front side metallization structure on a front side of the die...
2016/0284647 SECURE CHIP WITH PHYSICALLY UNCLONABLE FUNCTION
A first trench having a first aspect ratio and a second trench having a second aspect ratio that is greater than the first trench are provided into a material...
2016/0284646 GRAPHENE WIRING STRUCTURE AND MANUFACTURING METHOD THEREOF
A graphene wring structure of an embodiment includes multilayer graphene, a first interlayer compound existing in an interlayer space of the multilayer...
2016/0284645 SEMICONDUCTOR STRUCTURES HAVING LOW RESISTANCE PATHS THROUGHOUT A WAFER
A semiconductor structure with low resistance conduction paths and methods of manufacture are disclosed. The method includes forming at least one low...
2016/0284644 EMBEDDED STRUCTURES FOR PACKAGE-ON-PACKAGE ARCHITECTURE
Electronic assemblies including substrates and their manufacture are described. One assembly includes a die embedded in a dielectric layer in a multilayer...
2016/0284643 SEMICONDUCTOR FUSES WITH NANOWIRE FUSE LINKS AND FABRICATION METHODS THEREOF
Semiconductor fuses with nanowire fuse links and fabrication methods thereof are presented. The methods include, for instance: fabricating a semiconductor...
2016/0284642 PACKAGE ON PACKAGE ARCHITECTURE AND METHOD FOR MAKING
Embodiments of the present disclosure are directed to package assemblies and methods for fabricating package assemblies. In one embodiment, a package assembly...
2016/0284641 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
A semiconductor device is disclosed. The semiconductor device includes: a substrate having a gate structure thereon and a first interlayer dielectric (ILD)...
2016/0284640 SEMICONDUCTOR DEVICE HAVING BURIED WORDLINES
A memory device includes a substrate having thereon a plurality of active areas that are isolated from one another by a shallow trench isolation (STI) region....
2016/0284639 SEMICONDUCTOR STRUCTURE
The present disclosure relates to a semiconductor structure, which includes a semiconductor substrate, an insulating layer and a plurality of wirings. The...
2016/0284638 CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
A chip package structure can include: a lead frame having a carrier substrate and a first lead around the carrier substrate; a first conductive post arranged...
2016/0284637 GLASS CORE SUBSTRATE FOR INTEGRATED CIRCUIT DEVICES AND METHODS OF MAKING THE SAME
Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up...
2016/0284636 WIRING BOARD
A wiring board includes an insulating substrate having a plurality of laminated insulating layers and a mounting part in one surface of the insulating...
2016/0284635 HIGH DENSITY PACKAGE INTERCONNECTS
Electronic assemblies and methods including the formation of interconnect structures are described. In one embodiment an apparatus includes semiconductor die...
2016/0284634 SEMICONDUCTOR TRANSISTOR PACKAGE STRUCTURE
A semiconductor transistor package structure is disclosed and is applicable for the transistors, such as IGBT or MOSFET. The structure is mainly used for...
2016/0284633 MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION
A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe,...
2016/0284632 ELECTRONIC COMPONENT PACKAGE
Provided is a rational arrangement of an electronic component package that tightly keeps a connecting state of a lead member to a conductive pad of a...
2016/0284631 SUBSTRATE INTERPOSER ON A LEADFRAME
In one general aspect, a device can include a leadframe including at least one of an external input terminal or an external output terminal, an interposer made...
2016/0284630 BENDABLE AND STRETCHABLE ELECTRONIC DEVICES AND METHODS
Generally discussed herein are systems and methods that can include a stretchable and bendable device. According to an example a method can include (1)...
2016/0284629 Co-Packaged Die on Leadframe with Common Contact
A leadframe includes a common contact. A first transistor is disposed over the leadframe with a first interconnect structure of the first transistor disposed...
2016/0284628 THIN SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURE
In a general aspect, a packaged semiconductor device can include a semiconductor die having at least a first terminal on a first side of the semiconductor die...
2016/0284627 Staged via formation from both sides of chip
A method of fabricating a semiconductor assembly can include providing a semiconductor element having a front surface, a rear surface, and a plurality of...
2016/0284626 SEMICONDUCTOR DEVICES HAVING CONDUCTIVE VIAS AND METHODS OF FORMING THE SAME
Semiconductor devices having a conductive via and methods of forming the same are described herein. As an example, a semiconductor devices may include a...
2016/0284625 METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE WITH STATOR SET FORMED BY CIRCUITS
A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface...
2016/0284624 HEAT SINK STRUCTURE, SEMICONDUCTOR DEVICE AND HEAT SINK MOUNTING METHOD
[Problem to be solved] In an electronic device that contains a plurality of heat-generating components, not all the heat-dissipation capabilities of the ...
2016/0284623 COOLING DEVICE AND DEVICE
Heat dissipaters 120a, 120b are thermally coupled to a memory 220 and a CPU 230 (heat generating components) disposed on a top surface (a first surface) of a...
2016/0284622 COOLING STRUCTURE AND DEVICE
An object of the present invention is to constantly maintain the degree of contact between a heat generating element that generates high temperature and a heat...
2016/0284621 ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
An electronic component has a circuit board with a main surface, a chip having a sensor facing the main surface, bump electrodes disposed between the main...
2016/0284620 LOW PROFILE IC PACKAGE
An IC package without using an interposer is disclosed to form a low profile IC package. A single redistribution layer is fabricated according to IC process. A...
2016/0284619 Semiconductor Package with Embedded Die
A semiconductor package having an embedded die and solid vertical interconnections, such as stud bump interconnections, for increased integration in the...
2016/0284618 SEMICONDUCTOR DEVICE
A semiconductor device includes: a resin case that houses a semiconductor element; a parallel plate that is disposed inside the resin case while being...
2016/0284617 POLISHING APPARATUS AND POLISHING METHOD
A polishing apparatus capable of achieving a good control operation for a distribution of remaining film thickness is disclosed. The polishing apparatus...
2016/0284616 MOVEABLE AND ADJUSTABLE GAS INJECTORS FOR AN ETCHING CHAMBER
An apparatus for increasing the uniformity in a critical dimension of chemical vapor deposition and etching during substrate processing, comprising a plurality...
2016/0284615 POLISHING WITH MEASUREMENT PRIOR TO DEPOSITION OF OUTER LAYER
A method of controlling polishing includes storing a base measurement, the base measurement being a measurement of a substrate after deposition of at least one...
2016/0284614 METHOD FOR MANUFACTURING ORGANIC EL DISPLAY DEVICE, AND FILM THICKNESS MEASURING DEVICE
In a method for manufacturing an organic EL display device, an underlying film is formed on each of a plurality of crystal oscillators of a film thickness...
2016/0284613 Film Forming Method, Film Forming Apparatus, and Storage Medium
A film forming apparatus, which forms a thin film formed of a metal oxide on a substrate by alternately supplying a raw material gas formed of an organic...
2016/0284612 CUTTING DEVICE AND CUTTING METHOD
A cutting device includes: an imaging module for capturing first marks and third marks, to produce primary image data; and a control module for aligning, by a...
2016/0284611 WORKPIECE CUTTING METHOD
A workpiece cutting method of cutting a workpiece having a front side on which a plurality of crossing division lines are formed to define a plurality of...
2016/0284610 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
A plasma processing method of processing layer structure previously formed on an upper surface of a wafer disposed in a processing chamber within a vacuum...
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