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Patent # Description
2016/0293840 Non-Volatile Resistance-Switching Thin Film Devices
Disclosed herein are resistive switching devices having, e.g., an amorphous layer comprised of an insulating aluminum-based or silicon-based material and a...
2016/0293839 MEMORY DEVICE AND MANUFACTURING METHOD OF MEMORY DEVICE
A memory device includes a plurality of bit lines, including first and second bit lines, extending in a first direction away from a substrate, a plurality of...
2016/0293838 PLASMA ASSISTED ATOMIC LAYER DEPOSITION TITANIUM OXIDE FOR PATTERNING APPLICATIONS
The embodiments herein relate to methods and apparatus for depositing an encapsulation layer over memory stacks in MRAM and PCRAM applications. The...
2016/0293837 MULTILAYER HARD MASK PATTERNING FOR FABRICATING INTEGRATED CIRCUITS
A composite hard mask is disclosed that helps formation of an integrated circuit (IC), for example, a magnetic random access memory (MRAM) cell with...
2016/0293836 PLATINUM AND COBALT/COPPER-BASED MULTILAYER THIN FILM HAVING LOW SATURATION MAGNETIZATION AND FABRICATION...
A multilayer thin film for magnetic random access memory that includes thin platinum layers and thin cobalt-copper layers, and more particularly, to a...
2016/0293835 METHOD TO MAKE MRAM WITH SMALL FOOTPRINT
A method to make magnetic random access memory with small footprint using O-ion implantation to form electrically isolated memory pillar and electric (bottom...
2016/0293834 LOW NOISE GRAPHENE HALL SENSORS, SYSTEMS AND METHODS OF MAKING AND USING SAME
Described examples include graphene Hall sensors, magnetic sensor systems and methods for sensing a magnetic field using an adjustable gate voltage to adapt...
2016/0293833 MAGNETIC MEMORY DEVICE HAVING A MAGNETIC SHIELD STRUCTURE
A magnetic memory device includes a magnetic memory unit having a plurality of magnetic memory cells, a first surface, and a second surface opposite to the...
2016/0293832 PIEZOELECTRIC/ELECTROSTRICTIVE MATERIAL, PIEZOELECTRIC/ELECTROSTRICTIVE BODY, AND RESONANCE DRIVING DEVICE
A piezoelectric/electrostrictive material is composed of Mn and a compound of Pb(Zn, Nb)O.sub.3--Pb(Ni, Nb)O.sub.3--Pb(Zr, Ti)O.sub.3. A ratio of a molar...
2016/0293831 PIEZOELECTRIC CERAMIC, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC COMPONENT
A piezoelectric ceramic may be slightly deformed by firing, and a manufacturing method therefor, and an electronic component are disclosed. There is provided a...
2016/0293830 PIEZOELECTRIC DEVICE WITH PIEZOELECTRIC CERAMIC LAYER CONSTITUTED BY ALKALI-CONTAINING NIOBATE TYPE PEROVSKITE...
A piezoelectric device has a piezoelectric ceramic layer obtained by sintering a piezoelectric ceramic composition that contains an alkali-containing niobate...
2016/0293829 PIEZOELECTRIC SWITCH WITH LATERAL MOVING BEAMS
A piezoelectric switching element includes an actuator and multiple piezoelectric-morphing beams. The actuator includes a conducting head and an actuator stem,...
2016/0293828 INTEGRATED COMPLIANT BOUNDARY FOR PIEZOELECTRIC BIMORPH ACTUATOR
A piezoelectric bimorph actuator with an integral compliant boundary employs a first piezoelectric element, a second piezoelectric element and a composite...
2016/0293827 ELECTRONIC DEVICE, METHOD FOR PRODUCING ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT
An electronic device includes a base material, a first metal film disposed on the base material and containing nitrogen and chromium, and a second metal film...
2016/0293826 PIEZOELECTRIC ELEMENT, LIQUID DISCHARGING HEAD PROVIDED WITH PIEZOELECTRIC ELEMENT, AND LIQUID DISCHARGING...
The piezoelectric body is configured to have a layered structure such that a plurality of unit layers are stacked in a film thickness direction, and each of...
2016/0293825 INTEGRATED CIRCUIT COOLING USING EMBEDDED PELTIER MICRO-VIAS IN SUBSTRATE
A semiconductor device package and method for manufacturing the same, includes a semiconductor substrate including a plurality of embedded thermoelectric...
2016/0293824 THERMOELECTRIC GENERATOR
According to an embodiment, a thermoelectric generator includes a thermoelectric element and a DC to DC converter. The thermoelectric element converts heat...
2016/0293823 Thermoelectric Conversion Module
Provided is a thermoelectric conversion module which achieves, in the vicinity of an element/high-temperature-side electrode bonded part, stress relaxation or...
2016/0293822 INTEGRATED CIRCUIT COOLING USING EMBEDDED PELTIER MICRO-VIAS IN SUBSTRATE
A semiconductor device package and method for manufacturing the same, includes a semiconductor substrate including a plurality of embedded thermoelectric...
2016/0293821 THERMOELECTRIC GENERATOR
An apparatus for generating electricity. The apparatus comprises a collar arranged to couple to a pipe and a support having a first planar face, the support...
2016/0293820 Thermoelectric Conversion Element, Method of Manufacturing the Same, and Thermoelectric Conversion Module
There is provided a thermoelectric conversion element and a thermoelectric conversion module capable of ensuring a temperature difference between the front and...
2016/0293819 LIGHT EMITTING DEVICE
A light emitting device includes a substrate, a plurality of light emitting cells disposed on the substrate to be spaced apart from each other, and a...
2016/0293818 LIGHT-EMITTING DIODE MODULE HAVING LIGHT-EMITTING DIODE JOINED THROUGH SOLDER PASTE AND LIGHT-EMITTING DIODE
Disclosed are a light emitting diode and a light emitting diode module. The light emitting diode module includes a printed circuit board and a light emitting...
2016/0293817 LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES,...
A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame...
2016/0293816 SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE ARRAY, AND IMAGE FORMATION APPARATUS
A semiconductor device includes a first semiconductor chip including a first upper surface and a first electrode pad provided on the first upper surface; a...
2016/0293815 LIGHT EMITTING DEVICE PACKAGE STRIP
Disclosed herein is a light emitting device package strip capable of being used for a display application or an illumination application. The light emitting...
2016/0293814 LED LIGHT SOURCE PACKAGE
Provided is a LED light source package comprising a circuit board, a light source seated on an upper portion of the circuit board, and a lens structure...
2016/0293813 LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE USING THE SAME
A light emitting device and light emitting module using the same are provided. The light emitting device includes a substrate, a light-emitting element...
2016/0293812 METHOD FOR PRODUCING OPTOELECTRONIC SEMICONDUCTOR DEVICES AND OPTOELECTRONIC SEMICONDUCTOR DEVICE
The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality...
2016/0293811 LIGHT EMITTING DIODES AND METHODS WITH ENCAPSULATION
Solid state lighting apparatuses, systems, and related methods are provided. An example apparatus can include one or more light emitting diodes (LEDs) and a...
2016/0293810 LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
A light emitting device includes a light emitting element having a first face, a second face opposing the first face, a plurality of side faces extending...
2016/0293809 FLIP CHIP LIGHT EMITTING DIODE PACKAGE STRUCTURE
A flip chip light emitting diode package structure includes a package carrier, a light guiding unit and at least one light emitting unit. The light guiding...
2016/0293808 LIGHT EMITTING DEVICE
Disclosed is a light-emitting device which comprises: a light-emitting element for emitting a first light in a blue wavelength band; a first wavelength...
2016/0293807 PRODUCTION METHOD FOR LIGHT-EMITTING DEVICE
A fluorescent material-containing sealing resin (20) production method of the present invention includes: a kneading step of kneading a powder mixture (24),...
2016/0293806 LIGHT-EMITTING DIODE (LED) PACKAGE
A light-emitting diode (LED) package including a rectangular carrier, an LED chip, and an encapsulant is provided. The rectangular carrier has an upper...
2016/0293805 DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
A display device including a plurality of semiconductor light emitting devices mounted on a substrate, and a phosphor layer including a plurality of phosphor...
2016/0293804 HOUSING FOR A SEMICONDUCTOR CHIP, HOUSING COMPOSITE, SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING A...
A housing for a semiconductor chip has a front side and a rear side opposite the front side, wherein the front side has a fastening area for the semiconductor...
2016/0293803 LIGHT EMITTING DEVICE
A light emitting device includes a light emitting chip which generates a first light having a first color, a first cavity layer disposed on the light emitting...
2016/0293802 LED PACKAGES AND MANUFACTURING METHOD THEREOF
A method of manufacturing LED packages includes the steps of: forming a conductive circuit layer on a substrate; screen printing a wall layer on the conductive...
2016/0293801 OPTOELECTRONIC DEVICES WITH BACK CONTACT
A semiconductor structure includes an optoelectronic device located in one region of a substrate. A dielectric material is located adjacent and atop the...
2016/0293800 COMPOSITE SUBSTRATE FOR LIGHT-EMITTING ELEMENT AND PRODUCTION METHOD THEREFOR
Provided is a light emitting device composite substrate suitable for manufacturing large-area light emitting devices at low cost. The light emitting device...
2016/0293799 II-VI BASED LIGHT EMITTING SEMICONDUCTOR DEVICE
The invention provides a light emitting semiconductor device comprising a zinc magnesium oxide based layer as active layer, wherein the zinc magnesium oxide...
2016/0293798 PVD BUFFER LAYERS FOR LED FABRICATION
Fabrication of gallium nitride-based light devices with physical vapor deposition (PVD)-formed aluminum nitride buffer layers is described. Process conditions...
2016/0293797 NANOSTRUCTURE LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
A nanostructure semiconductor light emitting device includes a base layer, an insulating layer, and a plurality of light emitting nanostructures. The base...
2016/0293796 Multiple Quantum Well Structure and Light Emitting Diodes
A light emitting diode has a light emitting region including a multiple quantum well structure, including a first protection layer, a first intermediate layer...
2016/0293795 LIGHT-EMITTING DEVICE MANUFACTURING METHOD
Provided is a method that can manufacture a light-emitting device in which quantum dot is used and which has a high luminous efficiency. A light-emitting...
2016/0293794 Methods and Devices for Fabricating and Assembling Printable Semiconductor Elements
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate...
2016/0293793 Method for Manufacturing a Light Emitting Element
A method for manufacturing a light emitting element is disclosed. A larger end face of a gallium nitride pyramid contacts with a mounting face of a gallium...
2016/0293792 METHOD FOR PRODUCING GROUP III NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE
The present invention provides a Group III nitride semiconductor light-emitting device exhibiting improved emission performance. In a MQW structure...
2016/0293791 AUTOMATIC PRODUCTION SYSTEM AND PRODUCTION PROCESS OF A CONDUCTIVE BACKSHEET WITH INTEGRATED ENCAPSULATING AND...
Automatic production system and production process for the automatic manufacturing of conductive backsheets with an integrated encapsulating and dielectric...
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