Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2016/0293540 Metallic Device Having Mobile Element in a Cavity of the BEOL of an Integrated Circuit
In order, for example, to improve the ohmic contact between two metal pieces located at a metallization level, these two metal pieces are equipped with two...
2016/0293539 THREE-DIMENSIONAL SEMICONDUCTOR DEVICE
A three-dimensional semiconductor device is provided as follows. A substrate includes a contact region, a dummy region, and a cell array region. A stack...
2016/0293538 THERMOSETTING RESIN COMPOSITION, METAL-CLAD LAMINATED PLATE, INSULATING SHEET, PRINTED WIRING BOARD, METHOD OF...
A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to...
2016/0293537 EMBEDDED COMPONENT SUBSTRATE AND SEMICONDUCTOR MODULE
An embedded component substrate includes: a core layer; a first electrode provided on a top surface of the core layer with a first insulating layer ...
2016/0293536 Method for Producing an electronic Chip Support, Chip Support and Set of Such Supports
Method for producing at least one electronic chip support, from a plate that includes a first face intended to be in contact with a chip reader, a second face,...
2016/0293535 WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE
A wiring substrate includes a buried substrate disposed within a through-hole penetrating through a resin substrate of a core layer and including a plate-like...
2016/0293534 CIRCUIT ASSEMBLIES WITH MULTIPLE INTERPOSER SUBSTRATES, AND METHODS OF FABRICATION
A combined interposer (120) includes multiple constituent interposers (120.i), each with its own substrate (120.iS) and with a circuit layer (e.g....
2016/0293533 PLATED TERMINALS WITH ROUTING INTERCONNECTIONS SEMICONDUCTOR DEVICE
A semiconductor package includes terminals, each having an exposed surface that is flush with a bottom surface of the semiconductor package, and a layer of...
2016/0293532 DIE-ON-INTERPOSER ASSEMBLY WITH DAM STRUCTURE AND METHOD OF MANUFACTURING THE SAME
A semiconductor package includes an interposer chip having a frontside, a backside, and a corner area on the backside defined by a first corner edge and a...
2016/0293531 SEMICONDUCTOR PACKAGES AND RELATED MANUFACTURING METHODS
Described herein are semiconductor packages having an insulating layer and the manufacturing methods thereof, wherein semiconductor packages include a die pad;...
2016/0293530 SEMICONDUCTOR DEVICE
Provided is a semiconductor device which is compact and highly reliable. The semiconductor device includes a multi-gauge strip leadframe having a thick portion...
2016/0293529 MANUFACTURING METHOD OF CHIP PACKAGE STRUCTURE
A manufacturing method of a chip package structure includes following steps. A substrate including a first metal layer, a second metal layer, and an insulation...
2016/0293528 SEMICONDUCTOR DEVICES INCLUDING CONTROL AND LOAD LEADS OF OPPOSITE DIRECTIONS
A device includes a carrier and a semiconductor chip arranged over a surface of the carrier. The semiconductor chip includes a control electrode and a load...
2016/0293527 MOUNTING UNIT
A mounting unit is provided with the following: a molded resin part; a lead frame that is supported by the molded resin part and that includes a plurality of...
2016/0293526 LEAD FRAME WITH DEFLECTING TIE BAR FOR IC PACKAGE
A packaged integrated circuit (IC) device having a heatsink mounted onto an IC die, itself mounted onto a die pad, is assembled using a lead frame having tie...
2016/0293525 LEAD FRAME, MOLD AND METHOD OF MANUFACTURING LEAD FRAME WITH MOUNTED COMPONENT
A lead frame includes one metal plate 10 having a terminal 15, and the other metal plate 50 joined to the one metal plate 10, on which a mounted component 91...
2016/0293524 Printed Circuit Board Including a Leadframe with Inserted Packaged Semiconductor Chips
An electronic module includes a circuit board, having a carrier layer, the carrier layer having a plurality of recess areas in a main surface thereof, and a...
2016/0293523 SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE CLIP WITH FLEXIBLE LEADS AND RELATED METHODS
An integrated circuit (IC) device may include a leadframe and an IC die having a first surface coupled to the lead frame and a second surface opposite the...
2016/0293522 AU-BASED SOLDER DIE ATTACHMENT SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device according to the present invention, having an Au-based solder layer (3) sandwiched between a semiconductor element (1) and a Cu...
2016/0293521 SEMICONDUCTOR PACKAGE
A semiconductor package includes a die pad, a semiconductor die mounted on the die pad, a plurality of leads including a power lead disposed along a peripheral...
2016/0293520 STACKED INTERCONNECT STRUCTURE AND METHOD OF MAKING THE SAME
A method is provided of forming an interconnect structure. The method comprises forming a first dielectric layer overlying a first conductive layer, etching a...
2016/0293519 SEMICONDUCTOR DEVICE HAVING THROUGH-SILICON-VIA AND METHODS OF FORMING THE SAME
Semiconductor devices having a through-silicon-via and methods of forming the same are described herein. As an example, a semiconductor device may include a...
2016/0293518 SEMICONDUCTOR MODULE COOLER AND METHOD FOR MANUFACTURING SAME
A semiconductor module cooler for reducing a pressure loss of a coolant includes a first plate mounted with a first semiconductor module; a jacket disposed...
2016/0293517 SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
A semiconductor module includes a semiconductor element having a gate electrode and source electrode on the front surface, and a drain electrode on the rear...
2016/0293516 HEAT EXCHANGER
A thermal exchange device with reduced sizes and suitable to cool down electronic components in data center is disclosed. The device includes: a pair of outer...
2016/0293515 PROGRAMMABLE ACTIVE COOLING DEVICE
Cooling devices for SOI wafers and methods for forming the devices are presented. A substrate having a top surface layer, a support substrate and an insulator...
2016/0293514 SEMICONDUCTOR ASSEMBLY WITH BUILT-IN STIFFENER AND INTEGRATED DUAL ROUTING CIRCUITRIES AND METHOD OF MAKING THE...
A semiconductor assembly with built-in stiffener and integrated dual routing circuitries is characterized in that a semiconductor device and a first routing...
2016/0293513 SEMICONDUCTOR DEVICE HAVING A HEAT TRANSFER PATH THROUGH A GROUND LAYER
A semiconductor device includes a first substrate including a surface layer and a ground layer, the surface layer including a plurality of first vias that is...
2016/0293512 ELECTRONIC DEVICE WITH DUMMY IC DIE AND RELATED METHODS
An electronic device may include a substrate, an active IC die above the substrate, and a dummy IC die above the active IC die. The electronic device may...
2016/0293511 Conductive Line System and Process
A system and method for providing a conductive line is provided. In an embodiment the conductive line is formed by forming two passivation layers, wherein each...
2016/0293510 SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS OF EXTERNAL ELECTRODES
The semiconductor device has the CSP structure, and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to...
2016/0293509 Metal Top Stacking Package Structure and Method for Manufacturing the same
The present invention relates to a meal top stacking package structure and a method for manufacturing the same, wherein the metal top stacking package...
2016/0293508 SEMICONDUCTOR DEVICE PACKAGES
A semiconductor device package that incorporates a combination of ceramic, organic, and metallic materials that are coupled using silver is provided. The...
2016/0293507 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MEASURING METHOD
A semiconductor device reduces measurement time. The semiconductor device according to an embodiment of the invention includes: plural series-coupled...
2016/0293506 SCAN TESTABLE THROUGH SILICON VIAs
The disclosure describes a novel method and apparatus for testing different types of TSVs in a single die or different types of TSV connections in a stack of...
2016/0293505 Accelerated Failure Test of Coupled Device Structures Under Direct Current Bias
A method of conducting an in situ reliability test on a cross-section of a device with layered structure at micron-scale and at least two electrodes. The...
2016/0293504 THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY PANEL HAVING THE SAME
A thin film transistor (TFT) substrate includes a base substrate, a TFT disposed on the base substrate. The TFT includes a gate electrode, a semiconductor...
2016/0293503 APPARATUS AND METHOD FOR ENDPOINT DETECTION
An apparatus to control processing conditions for a substrate. The apparatus may include a current measurement component to perform a plurality of extraction...
2016/0293502 METHOD AND APPARATUS FOR DETECTING DEFECTS ON WAFERS
Methods and apparatuses for detecting particle defects on partially fabricated semiconductor wafers using chemical markers capable of binding to defects that...
2016/0293501 METHOD OF DIVIDING WAFER
Disclosed herein is a method of dividing a wafer including an exposed area incising step of lowering a cutting blade to a preset lowered position for fully...
2016/0293500 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes receiving film thickness distribution data of a polished first insulating film of a substrate;...
2016/0293499 SEMICONDUCTOR ASSEMBLY AND METHOD TO FORM THE SAME
A semiconductor device having a composite pad including a primary portion and a subsidiary portion is disclosed. The primary portion is provided for the...
2016/0293498 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
The present disclosure provides a technique capable of suppressing a deviation in a characteristic of a semiconductor device. There is provided a technique...
2016/0293497 SOLDERING THREE DIMENSIONAL INTEGRATED CIRCUITS
A method for soldering three-dimensional integrated circuits is provided. A three-dimensional integrated circuit is heated to a base temperature, wherein the...
2016/0293496 METHOD OF UTILIZING TRENCH SILICIDE IN A GATE CROSS-COUPLE CONSTRUCT
A method of forming a logic cell utilizing a TS gate cross-couple construct and the resulting device are provided. Embodiments include forming active fins and...
2016/0293495 METHOD OF UTILIZING TRENCH SILICIDE IN A GATE CROSS-COUPLE CONSTRUCT
A method of forming a logic cell utilizing a TS gate cross-couple construct and the resulting device are provided. Embodiments include forming active fins and...
2016/0293494 METHOD FOR MAKING STRAINED SEMICONDUCTOR DEVICE AND RELATED METHODS
A method for making a semiconductor device is provided. Raised source and drain regions are formed with a tensile strain-inducing material, after thermal...
2016/0293493 STABLE MULTIPLE THRESHOLD VOLTAGE DEVICES ON REPLACEMENT METAL GATE CMOS DEVICES
A technique for a multiple voltage threshold transistor structure is provided. A narrow channel and long channel are formed on a fin. An epitaxial layer is...
2016/0293492 STABLE MULTIPLE THRESHOLD VOLTAGE DEVICES ON REPLACEMENT METAL GATE CMOS DEVICES
A technique for a multiple voltage threshold transistor structure is provided. A narrow channel and long channel are formed on a fin. An epitaxial layer is...
2016/0293491 FIN STRUCTURE AND FIN STRUCTURE CUTTING PROCESS
A fin structure cutting process includes the following steps. Four fin structures are formed in a substrate, where the four fin structures including a first...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.