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Patent # Description
2016/0293490 Integrated High-K/Metal Gate in CMOS Process Flow
A method of fabricating a semiconductor device includes providing a semiconductor substrate having a first region and a second region, forming a first...
2016/0293489 Laser liftoff of epitaxial thin film structures
This work provides a new approach for epitaxial liftoff. Instead of using a sacrificial layer that is selectively etched chemically, the sacrificial layer...
2016/0293488 ELECTRONIC DIE SINGULATION METHOD
In one embodiment, die are singulated from a wafer having a back layer by placing the wafer onto a carrier substrate with the back layer adjacent the carrier...
2016/0293487 PROTECTED THROUGH SEMICONDUCTOR VIA (TSV)
Method for forming a through semiconductor via (TSV) in a semiconductor wafer comprising: etching an annular recess into a front side of the semiconductor...
2016/0293486 METHOD FOR FABRICATING ELECTRONIC DEVICES HAVING SEMICONDUCTOR MEMORY UNIT
Devices and methods based on disclosed technology include, among others, an electronic device including silicide layers capable of effectively reducing contact...
2016/0293485 SELF-ALIGNED STRUCTURE
A fin-type semiconductor device includes a gate structure and a source/drain structure. The fin-type semiconductor device also includes a gate hardmask...
2016/0293484 METHODS OF FORMING WIRING STRUCTURES
In a method of forming a wiring structure, a lower structure is formed on a substrate. An insulating interlayer is formed on the lower structure. The...
2016/0293483 PROCESS OF FILLING THE HIGH ASPECT RATIO TRENCHES BY CO-FLOWING LIGANDS DURING THERMAL CVD
Implementations of the present disclosure generally relate to methods for forming thin films in high aspect ratio feature definitions. In one implementation, a...
2016/0293482 Semiconductor Constructions and Methods of Forming Intersecting Lines of Material
Some embodiments include semiconductor constructions having first and second electrically conductive lines that intersect with one another at an intersection....
2016/0293481 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
A rectangular optical waveguide, an optical phase shifter and an optical modulator each formed of a semiconductor layer are formed on an insulating film...
2016/0293480 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes forming a first insulating film as a portion of a laminated insulating film on a substrate in which a...
2016/0293479 Selectively Removing Titanium Nitride Hard Mask and Etch Residue Removal
Formulations for stripping titanium nitride hard mask and removing titanium nitride etch residue comprise an amine salt buffer, a non-ambient oxidizer, and the...
2016/0293478 SELF-ALIGNED DOUBLE PATTERNING PROCESS FOR METAL ROUTING
Self-aligned double patterning processes to produce metal route between and connecting conductive lines are disclosed. Embodiments include forming a hard mask...
2016/0293477 SILICON-ON-INSULATOR (SOI) WAFERS EMPLOYING MOLDED SUBSTRATES TO IMPROVE INSULATION AND REDUCE CURRENT LEAKAGE
Silicon-on-insulator (SOI) wafers employing molded substrates to improve insulation and reduce current leakage are provided. In one aspect, a SOI wafer...
2016/0293476 PROCESS FOR FABRICATING A STRUCTURE HAVING A BURIED DIELECTRIC LAYER OF UNIFORM THICKNESS
A process is used for fabricating a final structure comprising in succession a useful semiconductor layer, a dielectric layer and a carrier substrate. The...
2016/0293475 SYSTEMS AND METHODS TO REDUCE PARASITIC CAPACITANCE
Devices and methods to reduce parasitic capacitance are disclosed. A device may include a dielectric layer. The device may include first and second conductive...
2016/0293474 SEMICONDUCTOR PROCESSING SYSTEM
The semiconductor processing system includes a reactor chamber that has an upper wall and a lower wall. A hold member is disposed in the reactor chamber to...
2016/0293473 Method For Manufacturing Semiconductor Device
Provided is a method of manufacturing a semiconductor device with improved manufacturing efficiency for the semiconductor device. The method of manufacturing a...
2016/0293472 ORGANIC LAYER DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING...
An organic layer deposition apparatus, and a method of manufacturing an organic light-emitting display device using the organic layer deposition apparatus. The...
2016/0293471 METHOD AND SYSTEM FOR POSITIONING WAFER IN SEMICONDUCTOR MANUFACTURING FABRICATION
A method for positioning a wafer in semiconductor fabrication is provided. The method includes sending a wafer into a processing chamber by a transferring...
2016/0293470 DEVICE FOR AT LEAST EMPTYING A TRANSPORT CONTAINER
A device for at least emptying a transport container having a stack of plate-shaped items, including semiconductor wafers and/or packaging material, includes...
2016/0293469 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
A plasma processing apparatus includes: a reaction chamber; a plasma generation unit; a stage disposed inside the reaction chamber; an electrostatic chuck...
2016/0293468 Article Transport Facility
When a transport start condition, which includes at least a condition that the controller is receiving a closed state signal, is satisfied, a controller allows...
2016/0293467 PROCESSING APPARATUS
In accordance with one or more aspects of the disclosed embodiment a semiconductor processing apparatus is provided. The semiconductor processing apparatus...
2016/0293466 SUBSTRATE TRANSFERRING APPARATUS
Substrate transferring apparatus includes a first-hand mechanism and second hand mechanism. The first-hand mechanism includes a first lower arm, first upper...
2016/0293465 SUBSTRATE TRANSPORTING DEVICE, SUBSTRATE TREATING APPARATUS, AND SUBSTRATE TRANSPORTING METHOD
Disclosed is a substrate transporting device including a transport mechanism, a transport chamber, a first exhaust fan, and a controller. The transport...
2016/0293464 Linearly Moving and Rotating Device
The linearly moving and rotating device includes a support portion that supports an operated member integrally provided with the article support portion, for...
2016/0293463 SEMICONDUCTOR MANUFACTURING DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP
Provided is a semiconductor manufacturing device including an expanding unit that expands a holding member having an adhesive layer on which a substrate in a...
2016/0293462 ABNORMALITY PORTENT DETECTION SYSTEM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
According to one embodiment, in an abnormality portent detection system, a collection unit is configured to time-sequentially collect plural kinds of...
2016/0293461 SEMICONDUCTOR DEVICE HANDLER THROUGHPUT OPTIMIZATION
A method and system are provided for optimizing operational throughput for a semiconductor device handler having multiple stages. The method includes receiving...
2016/0293460 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM
A substrate processing apparatus includes a reception part configured to receive film thickness distribution data of a substrate on which a channel region, an...
2016/0293459 APPARATUS FOR PROCESSING SUSTRATE AND SEMICONDUCTOR FABRICATION LINE INCLUDING THE SAME
In a substrate processing apparatus and a fabrication line including the same, the substrate processing apparatus includes a first unit apparatus performing a...
2016/0293458 Device And Method For Substrate Heating During Transport
A system for heating substrates while being transported between processing chambers is disclosed. The system comprises an array of light emitting diodes (LEDs)...
2016/0293457 HEAT TREATMENT APPARATUS, HEAT TREATMENT METHOD, AND PROGRAM
Disclosed is a heat treatment apparatus including: a heating unit that heats an inside of a processing chamber that accommodates a plurality of workpieces; a...
2016/0293456 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
A plasma processing apparatus includes: a reaction chamber; a plasma generation unit; a stage disposed inside the reaction chamber; an electrostatic chuck...
2016/0293455 PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Linear coils, a first ceramic block, and a second ceramic block are arranged in an inductively-coupled plasma torch. A chamber has an annular shape. Plasma...
2016/0293454 SUBSTRATE PROCESSING DEVICE
A substrate processing device capable of quickly increasing oxygen concentration in an area outside a substrate transfer part up to the oxygen concentration in...
2016/0293453 INTEGRATED CIRCUIT PACKAGE CONFIGURATIONS TO REDUCE STIFFNESS
Embodiments of the present disclosure are directed towards an integrated circuit (IC) package including a die having a first side and a second side disposed...
2016/0293452 METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
The manufacturing efficiency of a semiconductor device is improved. A method for manufacturing a semiconductor device includes a step of sealing a...
2016/0293451 METHOD FOR CREATING THROUGH-CONNECTED VIAS AND CONDUCTORS ON A SUBSTRATE
A method for creating electrically or thermally conductive vias in both vertical and horizontal orientations in a dielectric material has the steps of: (a)...
2016/0293450 SEMICONDUCTOR DEVICE WITH SLOPED SIDEWALL AND RELATED METHODS
A semiconductor device may include a multi-layer interconnect board having in stacked relation a lower conductive layer, a dielectric layer, and an upper...
2016/0293449 Methods Of Etching Films Comprising Transition Metals
Provided are methods for etching films comprising transition metals. Certain methods involve activating a substrate surface comprising at least one transition...
2016/0293448 ETCHING PROCESS IN CAPACITOR PROCESS OF DRAM USING A LIQUID ETCHANT COMPOSITION
An etching process in a capacitor process for DRAM is described. A substrate is provided, which has thereon a silicon layer and metal electrodes in the silicon...
2016/0293447 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus (1) includes a processing part (11), a supply tank (12), and a recovery tank (13). In the supply tank (12), a processing...
2016/0293446 METHOD FOR MANUFACTURING A SILICON WAFER
Provided is a method for manufacturing a silicon wafer including a first step of heat-treating a raw silicon wafer sliced from a silicon single crystal ingot...
2016/0293445 METHOD OF FORMING FINE PATTERN OF SEMICONDUCTOR DEVICE
A method of fabricating a semiconductor device is disclosed. The method may include forming an target layer on a substrate, forming a mask pattern on a target...
2016/0293444 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device, the method including forming an insulating layer on a substrate; forming a metallic hardmask pattern on the...
2016/0293443 METHODS OF FORMING DIFFERENT SIZED PATTERNS
A method includes forming a template portion to provide a first opening trench portion surrounding a first isolated pattern, and forming an array of pillars on...
2016/0293442 METHODS OF FORMING PATTERNS
A method of forming patterns includes forming an array of pillars on an underlying layer stacked on an etch target layer, forming a separation wall layer on...
2016/0293441 MASK ETCH FOR PATTERNING
A hard mask layer is deposited on a feature layer over a substrate. The hard mask layer comprises an organic mask layer. An opening in the organic mask layer...
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