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Patent # Description
2016/0307887 METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING A RESISTOR STRUCTURE
Provided is a method of fabricating a semiconductor device. The method includes providing a substrate including a transistor area and a resistor area, forming...
2016/0307886 GATE INPUT PROTECTON FOR DEVICES AND SYSTEMS COMPRISING HIGH POWER E-MODE GaN TRANSISTORS
An integrated gate protection device P for a GaN power transistor D1 provides negative ESD spike protection. Protection device P comprises a smaller gate width...
2016/0307885 Semiconductor Device Including a Diode at Least Partly Arranged in a Trench
A semiconductor device includes a semiconductor body including a first trench extending into the semiconductor body from a first surface and a diode including...
2016/0307884 Semiconductor Device Comprising Electrostatic Discharge Protection Structure
A semiconductor device comprises a semiconductor body having a first surface and a second surface opposite to the first surface. The semiconductor device...
2016/0307883 SEMICONDUCTOR DEVICE AND RELATED ELECTRONIC DEVICE
A semiconductor device may include the following elements: a first n-type region; a second n-type region; a p-type region, which directly contacts each of the...
2016/0307882 MEMORY DEVICE LAYOUT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING MEMORY DEVICE
A layout of a memory device is stored on a non-transitory computer-readable medium. The layout includes a plurality of active area regions, a lowermost...
2016/0307881 OPTICAL SENSOR MODULE AND METHOD FOR MANUFACTURING THE SAME
An optical sensor module includes a lid defining a first chamber and a second chamber isolated from the first chamber, a light emitting component, a light...
2016/0307880 LIGHT-EMITTING DEVICE AND LIGHT-EMITTING MODULE USING THE SAME
A light-emitting device and a light-emitting module using the same are provided. The light-emitting device includes a substrate module and a light-emitting...
2016/0307879 Light Emitting Module
A light emitting module including an electrode substrate and a plurality of light emitting diodes is provided. The electrode substrate includes a carrying...
2016/0307878 RECONSTITUTED WAFER-LEVEL PACKAGE DRAM
A microelectronic package includes first and second encapsulated microelectronic elements, each of which includes a semiconductor die having a front face and...
2016/0307877 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Disclosed herein is a semiconductor device including: a substrate having a first conductive layer and a second conductive layer arranged deeper than the first...
2016/0307876 3D Die Stacking Structure with Fine Pitches
A package includes package includes a first package component including a first plurality of electrical connectors at a top surface of the first package...
2016/0307875 ELECTRONIC DEVICE
In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an...
2016/0307874 FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION ELEMENTS FREE OF SOLDER MASK
A solution relating to electronic devices of flip-chip type is proposed. Particularly, an electronic device (200,300;400;700;800) of flip-chip type comprises...
2016/0307873 BONDING PAD ARRANGMENT DESIGN FOR SEMICONDUCTOR PACKAGE
A semiconductor memory package is provided. The package includes a semiconductor die having a first die portion and a second die portion. A post-passivation...
2016/0307872 Discrete Polymer in Fan-Out Packages
A package includes a first molding material, a lower-level device die in the first molding material, a dielectric layer over the lower-level device die and the...
2016/0307871 Fan-out POP Structure with Inconsecutive Polymer Layer
A package includes a device die, a molding material molding at least a portion of the device die therein, and a through-via substantially penetrating through...
2016/0307870 SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
Methods and systems for a semiconductor package with high routing density routing patch are disclosed and may include a semiconductor die bonded to a substrate...
2016/0307869 LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
Embodiments of the present disclosure are directed to die adhesive films for integrated circuit (IC) packaging, as well as methods for forming and removing die...
2016/0307868 METHODS FOR PACKAGING INTEGRATED CIRCUITS
Techniques for packaging an integrated circuit include attaching a die to a conductive layer before forming dielectric layers on an opposing surface of the...
2016/0307867 SEMICONDUCTOR PACKAGES INCLUDING INTERCONNECTION MEMBERS
A semiconductor package may include a main substrate, a sub-substrate spaced apart from the main substrate by a gap, and a semiconductor chip disposed on the...
2016/0307866 PACKAGING A SEMICONDUCTOR DEVICE HAVING WIRES WITH POLYMERIZED INSULATOR SKIN
The assembly of a chip (101) attached to a substrate (103) with wires (201) spanning from the chip to the substrate is loaded in a heated cavity (402) of a...
2016/0307865 WIRE BONDING SYSTEMS AND RELATED METHODS
A wire bond system. Implementations may include: a bond wire including copper (Cu), a bond pad including aluminum (Al) and a sacrificial anode electrically...
2016/0307864 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
The present disclosure relates to bonding structures useful in semiconductor packages. In an embodiment, a semiconductor device includes a semiconductor...
2016/0307863 SEMICONDUCTOR PACKAGE
The invention provides a semiconductor package. The semiconductor package includes a semiconductor die having a central area and a peripheral area surrounding...
2016/0307862 SEMICONDUCTOR DEVICES AND METHOD OF FORMING THE SAME
Semiconductor devices and methods of forming the same are described. An embodiment is a device including a pad on a substrate. A passivation film is on the...
2016/0307861 SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE
The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive...
2016/0307860 LAYERED CONTACT STRUCTURE
A three dimensional multi-die package includes a first die and second die. The first die includes a contact attached to solder. The second die is thinned by...
2016/0307859 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
The invention provides a semiconductor device including a substrate, a dielectric layer, a dummy bonding pad, a bonding pad, a redistribution layer, and a...
2016/0307858 PROCESSING OF THICK METAL PADS
In an embodiment of the present invention, a method of forming a semiconductor device includes providing a semiconductor substrate including a first chip...
2016/0307857 HIGH-FREQUENCY DEVICE INCLUDING HIGH-FREQUENCY SWITCHING CIRCUIT
A high-frequency device having a switching circuit including a semiconductor substrate; a first high-frequency input/output terminal; a second high-frequency...
2016/0307856 MONOLITHIC MICROWAVE INTEGRATED CIRCUIT
A monolithic microwave integrated circuit included a substrate, a first pad, a first line, a second line, a second pad, a third pad, a first active element, a...
2016/0307855 ELECTRONIC CHIP COMPRISING A PROTECTED REAR FACE
Electronic chip comprising at least: an electronic circuit arranged at a front face of a substrate; a first protective layer arranged on a rear face of the...
2016/0307854 SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first...
2016/0307853 MULTILAYER SUBSTRATE, DESIGN METHOD OF MULTILAYER SUBSTRATE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND...
According to one embodiment, there is provided a multilayer substrate including a ground layer and a signal layer. The ground layer includes a mesh ground...
2016/0307852 Conductive Traces in Semiconductor Devices and Methods of Forming Same
An embodiment device package includes a semiconductor device die comprising a passivation layer at a top surface, a first conductive line over the passivation...
2016/0307851 METHOD OF DIVIDING WAFER
A method of dividing a wafer includes a protective film forming step of forming a water-soluble protective film on a front side of the wafer, a mask forming...
2016/0307850 OVERLAY MARKS AND SEMICONDUCTOR PROCESS USING THE OVERLAY MARKS
An overlay mark for determining the alignment between two separately generated patterns formed along with two successive layers above a substrate is provided...
2016/0307849 Semiconductor Device and Manufacturing Method
The present disclosure relates to a semiconductor device, comprising a semiconductor substrate; a trench extending into the semiconductor substrate, wherein...
2016/0307848 WHOLE WAFER EDGE SEAL
The present invention relates generally to semiconductor devices and more particularly, to a structure and method of creating a non-permeable edge seal around...
2016/0307847 ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
An electronic component package and a method of manufacturing an electronic component package are provided. An electronic component package includes a frame...
2016/0307846 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A method of manufacturing a semiconductor device includes forming stepped stack structures each including conductive patterns stacked in a shape of steps while...
2016/0307845 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
An object of the invention is to provide a semiconductor device with buried copper wirings having improved reliability. An interlayer insulating film including...
2016/0307844 SEMICONDUCTOR DEVICE INCLUDING LINE PATTERNS
Provided is a semiconductor device. The device includes a plurality of line patterns, which extend in a first direction and are arranged a first space apart...
2016/0307843 SEMICONDUCTOR INTERCONNECT DEVICE
A method for forming an interconnect device is provided by the present disclosure. The method includes providing a dielectric layer on a substrate, forming...
2016/0307842 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
A semiconductor device includes a plurality of wiring structures spaced apart from each other, and an insulating interlayer structure. Each of the wiring...
2016/0307841 Semiconductor Device and Method Fabricating the Same
According to an exemplary embodiment, a semiconductor device is provided. The semiconductor device includes a first seal ring and a first circuit. The first...
2016/0307840 HIGH VOLTAGE POLYMER DIELECTRIC CAPACITOR ISOLATION DEVICE
An electronic isolation device is formed on a monolithic substrate and includes a plurality of passive isolation components. The isolation components are...
2016/0307839 SEMICONDUCTOR DEVICE STRUCTURES
A method of forming a semiconductor structure comprises forming pools of acidic or basic material in a substrate structure. A resist is formed over the pools...
2016/0307838 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE INCLUDING PILLARS BURIED INSIDE THROUGH HOLES SAME
In a nonvolatile semiconductor memory device, a stacked body is formed by alternately stacking dielectric films and conductive films on a silicon substrate and...
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