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METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING A RESISTOR STRUCTURE
Provided is a method of fabricating a semiconductor device. The method includes providing a substrate including a transistor area and a resistor area, forming...
GATE INPUT PROTECTON FOR DEVICES AND SYSTEMS COMPRISING HIGH POWER E-MODE
An integrated gate protection device P for a GaN power transistor D1 provides negative ESD spike protection. Protection device P comprises a smaller gate width...
Semiconductor Device Including a Diode at Least Partly Arranged in a
A semiconductor device includes a semiconductor body including a first trench extending into the semiconductor body from a first surface and a diode including...
Semiconductor Device Comprising Electrostatic Discharge Protection
A semiconductor device comprises a semiconductor body having a first surface and a second surface opposite to the first surface. The semiconductor device...
SEMICONDUCTOR DEVICE AND RELATED ELECTRONIC DEVICE
A semiconductor device may include the following elements: a first n-type region; a second n-type region; a p-type region, which directly contacts each of the...
MEMORY DEVICE LAYOUT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING
A layout of a memory device is stored on a non-transitory computer-readable medium. The layout includes a plurality of active area regions, a lowermost...
OPTICAL SENSOR MODULE AND METHOD FOR MANUFACTURING THE SAME
An optical sensor module includes a lid defining a first chamber and a second chamber isolated from the first chamber, a light emitting component, a light...
LIGHT-EMITTING DEVICE AND LIGHT-EMITTING MODULE USING THE SAME
A light-emitting device and a light-emitting module using the same are provided. The light-emitting device includes a substrate module and a light-emitting...
Light Emitting Module
A light emitting module including an electrode substrate and a plurality of light emitting diodes is provided. The electrode substrate includes a carrying...
RECONSTITUTED WAFER-LEVEL PACKAGE DRAM
A microelectronic package includes first and second encapsulated microelectronic elements, each of which includes a semiconductor die having a front face and...
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Disclosed herein is a semiconductor device including: a substrate having a first conductive layer and a second conductive layer arranged deeper than the first...
3D Die Stacking Structure with Fine Pitches
A package includes package includes a first package component including a first plurality of electrical connectors at a top surface of the first package...
In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an...
FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION ELEMENTS
FREE OF SOLDER MASK
A solution relating to electronic devices of flip-chip type is proposed. Particularly, an electronic device (200,300;400;700;800) of flip-chip type comprises...
BONDING PAD ARRANGMENT DESIGN FOR SEMICONDUCTOR PACKAGE
A semiconductor memory package is provided. The package includes a semiconductor die having a first die portion and a second die portion. A post-passivation...
Discrete Polymer in Fan-Out Packages
A package includes a first molding material, a lower-level device die in the first molding material, a dielectric layer over the lower-level device die and the...
Fan-out POP Structure with Inconsecutive Polymer Layer
A package includes a device die, a molding material molding at least a portion of the device die therein, and a through-via substantially penetrating through...
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
Methods and systems for a semiconductor package with high routing density routing patch are disclosed and may include a semiconductor die bonded to a substrate...
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
Embodiments of the present disclosure are directed to die adhesive films for integrated circuit (IC) packaging, as well as methods for forming and removing die...
METHODS FOR PACKAGING INTEGRATED CIRCUITS
Techniques for packaging an integrated circuit include attaching a die to a conductive layer before forming dielectric layers on an opposing surface of the...
SEMICONDUCTOR PACKAGES INCLUDING INTERCONNECTION MEMBERS
A semiconductor package may include a main substrate, a sub-substrate spaced apart from the main substrate by a gap, and a semiconductor chip disposed on the...
PACKAGING A SEMICONDUCTOR DEVICE HAVING WIRES WITH POLYMERIZED INSULATOR
The assembly of a chip (101) attached to a substrate (103) with wires (201) spanning from the chip to the substrate is loaded in a heated cavity (402) of a...
WIRE BONDING SYSTEMS AND RELATED METHODS
A wire bond system. Implementations may include: a bond wire including copper (Cu), a bond pad including aluminum (Al) and a sacrificial anode electrically...
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
The present disclosure relates to bonding structures useful in semiconductor packages. In an embodiment, a semiconductor device includes a semiconductor...
The invention provides a semiconductor package. The semiconductor package includes a semiconductor die having a central area and a peripheral area surrounding...
SEMICONDUCTOR DEVICES AND METHOD OF FORMING THE SAME
Semiconductor devices and methods of forming the same are described. An embodiment is a device including a pad on a substrate. A passivation film is on the...
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR
The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive...
LAYERED CONTACT STRUCTURE
A three dimensional multi-die package includes a first die and second die. The first die includes a contact attached to solder. The second die is thinned by...
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
The invention provides a semiconductor device including a substrate, a dielectric layer, a dummy bonding pad, a bonding pad, a redistribution layer, and a...
PROCESSING OF THICK METAL PADS
In an embodiment of the present invention, a method of forming a semiconductor device includes providing a semiconductor substrate including a first chip...
HIGH-FREQUENCY DEVICE INCLUDING HIGH-FREQUENCY SWITCHING CIRCUIT
A high-frequency device having a switching circuit including a semiconductor substrate; a first high-frequency input/output terminal; a second high-frequency...
MONOLITHIC MICROWAVE INTEGRATED CIRCUIT
A monolithic microwave integrated circuit included a substrate, a first pad, a first line, a second line, a second pad, a third pad, a first active element, a...
ELECTRONIC CHIP COMPRISING A PROTECTED REAR FACE
Electronic chip comprising at least: an electronic circuit arranged at a front face of a substrate; a first protective layer arranged on a rear face of the...
A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first...
MULTILAYER SUBSTRATE, DESIGN METHOD OF MULTILAYER SUBSTRATE, MANUFACTURING
METHOD OF SEMICONDUCTOR DEVICE, AND...
According to one embodiment, there is provided a multilayer substrate including a ground layer and a signal layer. The ground layer includes a mesh ground...
Conductive Traces in Semiconductor Devices and Methods of Forming Same
An embodiment device package includes a semiconductor device die comprising a passivation layer at a top surface, a first conductive line over the passivation...
METHOD OF DIVIDING WAFER
A method of dividing a wafer includes a protective film forming step of forming a water-soluble protective film on a front side of the wafer, a mask forming...
OVERLAY MARKS AND SEMICONDUCTOR PROCESS USING THE OVERLAY MARKS
An overlay mark for determining the alignment between two separately generated patterns formed along with two successive layers above a substrate is provided...
Semiconductor Device and Manufacturing Method
The present disclosure relates to a semiconductor device, comprising a semiconductor substrate; a trench extending into the semiconductor substrate, wherein...
WHOLE WAFER EDGE SEAL
The present invention relates generally to semiconductor devices and more particularly, to a structure and method of creating a non-permeable edge seal around...
ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
An electronic component package and a method of manufacturing an electronic component package are provided. An electronic component package includes a frame...
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A method of manufacturing a semiconductor device includes forming stepped stack structures each including conductive patterns stacked in a shape of steps while...
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
An object of the invention is to provide a semiconductor device with buried copper wirings having improved reliability. An interlayer insulating film including...
SEMICONDUCTOR DEVICE INCLUDING LINE PATTERNS
Provided is a semiconductor device. The device includes a plurality of line patterns, which extend in a first direction and are arranged a first space apart...
SEMICONDUCTOR INTERCONNECT DEVICE
A method for forming an interconnect device is provided by the present disclosure. The method includes providing a dielectric layer on a substrate, forming...
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
A semiconductor device includes a plurality of wiring structures spaced apart from each other, and an insulating interlayer structure. Each of the wiring...
Semiconductor Device and Method Fabricating the Same
According to an exemplary embodiment, a semiconductor device is provided. The semiconductor device includes a first seal ring and a first circuit. The first...
HIGH VOLTAGE POLYMER DIELECTRIC CAPACITOR ISOLATION DEVICE
An electronic isolation device is formed on a monolithic substrate and includes a plurality of passive isolation components. The isolation components are...
SEMICONDUCTOR DEVICE STRUCTURES
A method of forming a semiconductor structure comprises forming pools of acidic or basic material in a substrate structure. A resist is formed over the pools...
NONVOLATILE SEMICONDUCTOR MEMORY DEVICE INCLUDING PILLARS BURIED INSIDE
THROUGH HOLES SAME
In a nonvolatile semiconductor memory device, a stacked body is formed by alternately stacking dielectric films and conductive films on a silicon substrate and...