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CERAMIC HEATER AND ELECTROSTATIC CHUCK
As viewed in plane, a ceramic heater includes zone heat-generating elements disposed in respective heating zones so as to heat a ceramic substrate...
Hybrid Thermal Electrostatic Clamp
An electrostatic clamp having improved temperature uniformity is disclosed. The electrostatic clamp includes an LED array mounted along an annular ring so as...
GAS INJECTION DEVICE AND ASSISTING MEMBER
A gas injection device a placement portion on which a first or second container is placed, an ejection portion which is placed on the placement portion and...
SUBSTRATE PROCESSING SYSTEM
A substrate processing system includes a processing unit having one or more processing chambers each of which includes a mounting table configured to mount...
SUBSTRATE PROCESSING APPARATUS, RECORDING MEDIUM AND METHOD OF
MANUFACTURING SEMICONDUCTOR DEVICE
A substrate processing apparatus includes first and second process chambers; a mounting section on which a housing vessel that houses the substrate is mounted;...
Buffer Chamber Wafer Heating Mechanism And Supporting Robot
Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for...
ION INJECTOR AND LENS SYSTEM FOR ION BEAM MILLING
The embodiments herein relate to methods and apparatus for performing ion etching on a semiconductor substrate, as well as methods for forming such apparatus....
STRUCTURE AND METHOD TO MINIMIZE WARPAGE OF PACKAGED SEMICONDUCTOR DEVICES
A packaged semiconductor device includes a substrate, an electronic device coupled to the substrate, encapsulant including a first major surface surrounding...
WAFER COATING SYSTEM AND METHOD OF MANUFACTURING CHIP PACKAGE
A wafer coating system includes a wafer chuck, a flowing insulating material sprayer and a wafer tilting lifting pin. The wafer chuck has a carrier part and a...
Die package with Openings Surrounding End-portions of Through Package Vias
(TPVs) and Package on Package (PoP)...
Various embodiments of mechanisms for forming through package vias (TPVs) with openings surrounding end-portions of the TPVs and a package on package (PoP)...
METHOD FOR FABRICATING ELECTRODE AND SEMICONDUCTOR DEVICE
A minute transistor is provided. A transistor having low parasitic capacitance is provided. A transistor having high frequency characteristics is provided. An...
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
It is an object to drive a semiconductor device at high speed or to improve the reliability of the semiconductor device. In a method for manufacturing the...
METHOD FOR ETCHING ORGANIC FILM
Disclosed is a method for etching an organic film. Plasma of a processing gas containing hydrogen gas and nitrogen gas is generated within a processing...
UTLIZATION OF ANGLED TRENCH FOR EFFECTIVE ASPECT RATIO TRAPPING OF DEFECTS
IN STRAIN-RELAXED HETEROEPITAXY OF...
Embodiments of the present disclosure relate to reducing dislocation density in a heteroepitaxial growth film and devices including heteroepitaxial films with...
Method of Manufacturing Semiconductor Devices
A substrate having an insulating layer including an oxide is loaded into a chamber, and at least a part of the insulating layer is removed by injecting a...
SPACER FORMATION PROCESS WITH FLAT TOP PROFILE
Embodiments described herein relate to methods for etching a substrate. Patterning processes, such as double patterning and quadruple patterning processes, may...
GAS-PHASE SILICON NITRIDE SELECTIVE ETCH
A method of etching silicon nitride on patterned heterogeneous structures is described and includes a gas phase etch using anhydrous vapor-phase HF. The HF may...
METHOD AND DEVICE FOR TREATING OBJECTS WITH A LIQUID
In the treatment of a semiconductor wafer (8), a treatment medium, in particular an etching or cleaning liquid, is applied to the semiconductor wafer (8) from...
Lithographic Technique Incorporating Varied Pattern Materials
A technique for patterning a workpiece such as an integrated circuit workpiece is provided. In an exemplary embodiment, the method includes receiving a...
SINGLE PLATFORM, MULTIPLE CYCLE SPACER DEPOSITION AND ETCH
A first portion of a multiple cycle spacer is formed on a sidewall of a patterned feature over a substrate. A spacer layer is deposited on the first portion...
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
A method of forming a semiconductor device includes sequentially forming a hard mask layer and a first sacrificial layer on a substrate, forming a first...
CYCLIC DOPED ALUMINUM NITRIDE DEPOSITION
A process for depositing doped aluminum nitride (doped AlN) is disclosed. The process comprises subjecting a substrate to temporally separated exposures to an...
DRY ETCHING METHOD
A dry etching method for isotropically etching each of SiGe layers selectively relative to each of Si layers in a laminated film is provided. The laminated...
METHOD OF ETCHING SEMICONDUCTOR STRUCTURES WITH ETCH GAS
Disclosed are sulfur-containing compounds for plasma etching channel holes, gate trenches, staircase contacts, capacitor holes, contact holes, etc., in...
THIN PLATE SEPARATING METHOD
A thin plate is separated from an SiC substrate having a first surface, an opposite second surface, a c-axis extending from the first surface to the second...
METHODS OF CURING A DIELECTRIC LAYER FOR MANUFACTURE OF A SEMICONDUCTOR
A method of curing a dielectric layer, such as a dielectric layer that has a relatively small thickness and/or a narrow width or a complicated shape, is...
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH RECESS
The present disclosure provides a method of manufacturing a semiconductor device. The method includes providing a substrate with a dielectric disposed thereon,...
METHOD AND SYSTEM FOR APPLYING MATERIALS ON A SUBSTRATE
Embodiments of the invention are directed to a method of printing lines. A method may include positioning a plurality of print units according to a predefined...
PLATING METHOD, RECORDING MEDIUM AND PLATING SYSTEM
A plating method includes forming a catalyst layer 118 on a surface of a substrate including an inner surface of a recess 112; drying the substrate having the...
STRUCTURE AND METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WITH GATE
A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate. The semiconductor device structure...
METHOD FOR CONTROLLING SURFACE CHARGE ON WAFER SURFACE IN SEMICONDUCTOR
A method for processing a semiconductor wafer is provided. The method includes performing a discharging process over the semiconductor wafer in a discharging...
METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
A method of manufacturing a silicon carbide semiconductor device having a contact formed between a p-type silicon carbide semiconductor body and a metal...
METHOD FOR FORMING FINE PATTERNS OF SEMICONDUCTOR DEVICE
A method for forming fine patterns includes patterning a hard mask layer on an etch target layer to form sacrificial pillars and a first opening disposed...
SILICON SUBSTRATES WITH COMPRESSIVE STRESS AND METHODS FOR PRODUCTION OF
A heterostructure may include a substrate having a first primary surface, a second primary surface, and a diffusion layer extending a depth into the substrate...
METHOD FOR PROCESSING A CARRIER AND AN ELECTRONIC COMPONENT
In various embodiments, a method for processing a carrier is provided. The method for processing a carrier may include: forming a first catalytic metal layer...
GAS FLOW PROFILE MODULATED CONTROL OF OVERLAY IN PLASMA CVD FILMS
Methods for modulating local stress and overlay error of one or more patterning films may include modulating a gas flow profile of gases introduced into a...
ATOMIC LAYER DEPOSITION OF SILICON CARBON NITRIDE BASED MATERIALS
A process for depositing a silicon carbon nitride film on a substrate can include a plurality of complete deposition cycles, each complete deposition cycle...
DUAL COATING AND LIFT-OFF METHOD FOR PROTECTING PATTERNED DIELECTRIC-METAL
A dual coating and lift-off method for protecting patterned dielectric-metal coatings using a 2-layer lithography process that is exposed and developed to...
PHYSICAL VAPOR DEPOSITION OF AN ALUMINUM NITRIDE FILM
A method for physical vapor deposition of an aluminum nitride film, comprising: positioning a substrate and an aluminum target in a chamber; vacuuming the...
Deposition Of Si-H Free Silicon Nitride
Methods for the deposition of SiN films comprising cyclical exposure of a substrate surface to a silicon halide comprising one or more of bromine and/or iodine...
METHODS FOR DEPOSITING A MONOLAYER ON A SUBSTRATE
Methods and compositions for depositing a monolayer onto a surface of a substrate are described. The method can include contacting the surface with a vapor...
CLEANING COMPOSITION AND METHODS THEREOF
Provided is a cleaning solution and its applications. The cleaning solution comprises a mixture of a basic chemical compound and a solvent solution. In some...
Systems and Methods for Improved Robustness for Quadrupole Mass
A method for analyzing a sample by mass spectrometry includes producing ions from the sample, delivering the ions to an entrance of a multipole, and applying...
Atmospheric Interface for Electrically Grounded Electrospray
An interface for a mass spectrometer system is provided. The interface can include an inner ceramic tube fabricated from a first ceramic material and an outer...
CHAMBER WITH VERTICAL SUPPORT STEM FOR SYMMETRIC CONDUCTANCE AND RF
A plasma chamber is provided to increase conductance within the plasma chamber and to increase uniformity of the conductance. A radio frequency (RF) path for...
EDGE RING FOR BEVEL POLYMER REDUCTION
Embodiments of the present disclosure include methods and apparatuses utilized to reduce residual film layers from a substrate periphery region, such as an...
METHOD FOR SURFACE TREATMENT OF UPPER ELECTRODE, PLASMA PROCESSING
APPARATUS AND UPPER ELECTRODE
In a method for surface treatment of an upper electrode, a first step is performed to roughen a facing surface of the upper electrode facing a lower electrode...
Substrate Processing System and Ceramic Coating Method Therefor
A substrate processing system and a method of coating a ceramic layer therewith are provided. The system may include a chamber and a ceramic layer on an inner...
REMOTE PLASMA GENERATOR USING CERAMIC
A remote plasma generator includes a body, a driver, and a protection tube. The body includes a gas injection port, a plasma exhaust port, and a plasma...
CONTROL OF IMPEDANCE OF RF DELIVERY PATH
A plasma system includes an RF generator and a matchbox including an impedance matching circuit, which is coupled to the RF generator via an RF cable. The...