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Patent # Description
2016/0315007 METHOD FOR FORMING A TWO-LAYERED HARD MASK ON TOP OF A GATE STRUCTURE
A method for fabricating semiconductor device includes the steps of: providing a substrate having a gate structure thereon and a first interlayer dielectric...
2016/0315006 METHOD FOR PATTERNING MESOPOROUS INORGANIC OXIDE FILM, AND ELECTRIC DEVICE INCLUDING MESOPOROUS INORGANIC OXIDE...
Provided are a method for patterning a mesoporous inorganic oxide film, the method including a step of forming a mesoporous inorganic oxide film using a...
2016/0315005 PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
A plasma processing method performs an etching process of supplying a fluorine-containing gas into a plasma processing space and etching a target substrate, in...
2016/0315004 SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING THE SAME
One or more semiconductor arrangements are provided. A semiconductor arrangement includes a first dielectric layer defining a first recess, a first contact in...
2016/0315003 WAFER BOAT
A wafer boat for receiving wafers, in particular semiconductor wafers, includes at least two elongated receiving elements made of quartz, each receiving...
2016/0315002 SUBSTRATE PROCESSING APPARATUS AND METHOD FOR DETECTING ABNORMALITY OF SUBSTRATE
A substrate processing apparatus having a detecting unit that can detect an abnormality of a substrate such as a crack of the substrate or chipping of the...
2016/0315001 TRANSFER CHAMBER AND METHOD FOR PREVENTING ADHESION OF PARTICLE
A transfer chamber is provided between a processing unit for performing a predetermined process on a target substrate to be processed in a depressurized...
2016/0315000 EXTERNAL SUBSTRATE ROTATION IN A SEMICONDUCTOR PROCESSING SYSTEM
A method and apparatus for processing a semiconductor is disclosed herein. In one embodiment, a processing system for semiconductor processing is disclosed....
2016/0314999 PEELING APPARATUS AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the...
2016/0314998 MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
An apparatus for manufacturing a semiconductor device includes a stage configured to hold tape adhering to a second surface of a semiconductor wafer having the...
2016/0314997 LOADLOCK APPARATUS, COOLING PLATE ASSEMBLY, AND ELECTRONIC DEVICE PROCESSING SYSTEMS AND METHODS
A loadlock apparatus including a lower disc diffuser is provided. The loadlock apparatus includes a loadlock body containing a lower loadlock chamber and an...
2016/0314996 SUBSTRATE TREATING APPARATUS AND A METHOD FOR TREATING A SUBSTRATE
The inventive concepts relate to a substrate treating apparatus and a method for treating a substrate using the same. The apparatus includes a spin chuck...
2016/0314995 WAFER SWAPPER
The present disclosure generally relates to semiconductor process equipment used to transfer semiconductor substrates between process chambers. More...
2016/0314994 METHOD FOR ETCHING ETCH LAYER AND WAFER ETCHING APPARATUS
A method for etching an etch layer formed on a front side of a wafer and a wafer etching apparatus are provided. The wafer etching apparatus includes a first...
2016/0314993 WORKPIECE HANDLING MODULES
A workpiece handling module including a first housing member and a second housing member pivotally movable relative to the first member forming a housing...
2016/0314992 LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND RESIN-SEALED SEMICONDUCTOR DEVICE
The present invention relates to a liquid epoxy resin composition for semiconductor sealing, which contains: (A) a liquid epoxy resin that does not contain a...
2016/0314991 METHOD FOR PRODUCING COMPOSITION FOR FORMING COATING FILM FOR LITHOGRAPHY AND PATTERNING PROCESS
The present invention provides a method for producing a composition for forming a coating film for a lithography used in manufacture of a semiconductor device...
2016/0314990 NI:NIGE:GE SELECTIVE ETCH FORMULATIONS AND METHOD OF USING SAME
Compositions and methods for selectively removing unreacted metal material (e.g., unreacted nickel) relative to metal germanide (e.g., NiGe), metal-III-V...
2016/0314989 LOW DISHING COPPER CHEMICAL MECHANICAL PLANARIZATION
Copper chemical mechanical polishing (CMP) formulation, method and system are disclosed. The CMP formulation comprises particulate materials, at least two or...
2016/0314988 SUBSTRATE HEAT TREATMENT APPARATUS AND METHOD
Substrate heat treatment apparatus and method are provided. According to an embodiment of the present invention, there is provided a substrate heat treatment...
2016/0314987 METHOD OF FORMING FINE PATTERNS
Provided is a method of forming fine patterns, which is capable of easily forming a plurality of patterns repeatedly with a fine pitch when forming patterns...
2016/0314986 ETCHING METHOD
An etching method includes generating a plasma from a hydrogen-containing gas and a fluorine-containing gas with high-frequency electric power for plasma...
2016/0314985 COBALT ETCH BACK
Methods of etching cobalt on substrates are provided. Some methods involve exposing the substrate to a boron-containing halide gas and an additive, and...
2016/0314984 METHOD FOR FILM FORMATION, AND PATTERN-FORMING METHOD
A method comprises applying a composition on a substrate to form a coating film on the substrate. The coating film is heated in an atmosphere in which an...
2016/0314983 METHOD OF FORMING PATTERNS OF A SEMICONDUCTOR DEVICE
A method of forming patterns of a semiconductor device includes sequentially forming first to third mask layers on a substrate including a first region and a...
2016/0314982 METHOD FOR PROCESSING TARGET OBJECT
A method for processing a target object by using a capacitively coupled plasma processing apparatus includes a first step of supplying a first gas containing a...
2016/0314981 METHODS FOR FORMING PATTERN USING CYCLIC PROCESSING
A method for forming a vertical pattern includes forming a tungsten layer on a lower layer and performing a cyclic process including an etch process and an...
2016/0314980 LIQUID PRECURSOR COMPOSITIONS, PREPARATION METHODS THEREOF, AND METHODS FOR FORMING LAYER USING THE COMPOSITION
Liquid precursor compositions are provided, along with methods of preparing the liquid precursor compositions, and methods for forming layers using the liquid...
2016/0314979 SEMICONDUCTOR DEVICE AND FORMATION THEREOF
A semiconductor device and method of formation are provided. The semiconductor device comprises a metal plug in a first opening over a substrate. The metal...
2016/0314978 Spacer Enabled Poly Gate
A spacer etching process produces ultra-narrow polysilicon and gate oxides for insulated gates used with insulated gate transistors. Narrow channels are formed...
2016/0314977 STRATIFIED GATE DIELECTRIC STACK FOR GATE DIELECTRIC LEAKAGE REDUCTION
A stratified gate dielectric stack includes a first high dielectric constant (high-k) gate dielectric comprising a first high-k dielectric material, a...
2016/0314976 FINFET HAVING CONTROLLED DIELECTRIC REGION HEIGHT
Embodiments are directed to a method of forming a dielectric region of a fin-type field effect transistor (FinFET). The method includes forming at least one...
2016/0314975 DIFFUSION AGENT COMPOSITION
A diffusion agent composition that, even when coated on a semiconductor substrate in a nano-scale thickness, allows an impurity diffusion component to be well...
2016/0314974 APPARATUS FOR DOPING IMPURITIES, METHOD FOR DOPING IMPURITIES, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
An apparatus for doping impurities includes: a bath reserving liquid containing impurity elements; a liquid transport device transporting the liquid on a...
2016/0314973 METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
A method of manufacturing a silicon carbide semiconductor device, having a silicon carbide semiconductor element substrate and a surface electrode film forming...
2016/0314972 CUT FIRST SELF-ALIGNED LITHO-ETCH PATTERNING
The present disclosure relates to a method for performing a self-aligned litho-etch (SALE) process. In some embodiments, the method is performed by forming a...
2016/0314971 Method of Forming Multiple Patterning Spacer Structures
Disclosed herein is a method of forming a structure, comprising forming a mandrel layer over a substrate, masking the mandrel layer with a first mask and...
2016/0314970 METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
In a method of manufacturing a semiconductor device, a mask layer and a first layer may be sequentially formed on a substrate. The first layer may be patterned...
2016/0314969 MANUFACTURING METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
The present invention provides a method for forming a semiconductor structure, comprising: firstly, a substrate is provided, next, a first dry etching process...
2016/0314968 COMPOSITION FOR LAYERED TRANSITION METAL CHALCOGENIDE COMPOUND LAYER AND METHOD OF FORMING LAYERED TRANSITION...
Provided are a composition for forming a layered transition metal chalcogenide compound layer and a method of forming a layered transition metal chalcogenide...
2016/0314967 STRUCTURES AND DEVICES INCLUDING GERMANIUM-TIN FILMS AND METHODS OF FORMING SAME
Methods of forming germanium-tin films using germane as a precursor are disclosed. Exemplary methods include growing films including germanium and tin in an...
2016/0314966 MULTI-STEP SYSTEM AND METHOD FOR CURING A DIELECTRIC FILM
A multi-step system and method for curing a dielectric film in which the system includes a drying system configured to reduce the amount of contaminants, such...
2016/0314965 MULTILAYER DIELECTRIC STRUCTURES WITH GRADED COMPOSITION FOR NANO-SCALE SEMICONDUCTOR DEVICES
Multilayer dielectric structures are provided with graded composition. For example, a multilayer dielectric structure includes a stack of dielectric films,...
2016/0314964 GAP FILL USING CARBON-BASED FILMS
Provided herein are methods of filling gaps using high density plasma chemical vapor deposition (HDP CVD). According to various implementations,...
2016/0314963 METHOD OF FORMING THIN FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of forming a thin film includes forming an interface layer stack on a semiconductor substrate. Forming the interface layer stack may include...
2016/0314962 CYCLIC ORGANOAMINOSILANE PRECURSORS FOR FORMING SILICON-CONTAINING FILMS AND METHODS OF USING THE SAME
Disclosed are methods for forming a silicon-containing layer on a substrate, the method comprising the steps of introducing into a reactor containing a...
2016/0314961 CLEANING HIGH ASPECT RATIO VIAS
A method of removing an amorphous silicon/silicon oxide film stack from vias is described. The method may involve a remote plasma comprising fluorine and a...
2016/0314960 PLASMA TREATMENT TO IMPROVE ADHESION BETWEEN HARDMASK FILM AND SILICON OXIDE FILM
The present disclosure relates to methods for improving adhesion between a hardmask layer and a subsequent layer on the hardmask layer. Particularly,...
2016/0314959 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM
A method of manufacturing a semiconductor device includes forming a thin film containing a predetermined element, oxygen, carbon, and nitrogen on a substrate...
2016/0314958 SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, AND COMPUTER-READABLE STORAGE MEDIUM
A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the...
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