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METHOD FOR FORMING A TWO-LAYERED HARD MASK ON TOP OF A GATE STRUCTURE
A method for fabricating semiconductor device includes the steps of: providing a substrate having a gate structure thereon and a first interlayer dielectric...
METHOD FOR PATTERNING MESOPOROUS INORGANIC OXIDE FILM, AND ELECTRIC DEVICE
INCLUDING MESOPOROUS INORGANIC OXIDE...
Provided are a method for patterning a mesoporous inorganic oxide film, the method including a step of forming a mesoporous inorganic oxide film using a...
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
A plasma processing method performs an etching process of supplying a fluorine-containing gas into a plasma processing space and etching a target substrate, in...
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING THE SAME
One or more semiconductor arrangements are provided. A semiconductor arrangement includes a first dielectric layer defining a first recess, a first contact in...
A wafer boat for receiving wafers, in particular semiconductor wafers, includes at least two elongated receiving elements made of quartz, each receiving...
SUBSTRATE PROCESSING APPARATUS AND METHOD FOR DETECTING ABNORMALITY OF
A substrate processing apparatus having a detecting unit that can detect an abnormality of a substrate such as a crack of the substrate or chipping of the...
TRANSFER CHAMBER AND METHOD FOR PREVENTING ADHESION OF PARTICLE
A transfer chamber is provided between a processing unit for performing a predetermined process on a target substrate to be processed in a depressurized...
EXTERNAL SUBSTRATE ROTATION IN A SEMICONDUCTOR PROCESSING SYSTEM
A method and apparatus for processing a semiconductor is disclosed herein. In one embodiment, a processing system for semiconductor processing is disclosed....
PEELING APPARATUS AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the...
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
An apparatus for manufacturing a semiconductor device includes a stage configured to hold tape adhering to a second surface of a semiconductor wafer having the...
LOADLOCK APPARATUS, COOLING PLATE ASSEMBLY, AND ELECTRONIC DEVICE
PROCESSING SYSTEMS AND METHODS
A loadlock apparatus including a lower disc diffuser is provided. The loadlock apparatus includes a loadlock body containing a lower loadlock chamber and an...
SUBSTRATE TREATING APPARATUS AND A METHOD FOR TREATING A SUBSTRATE
The inventive concepts relate to a substrate treating apparatus and a method for treating a substrate using the same. The apparatus includes a spin chuck...
The present disclosure generally relates to semiconductor process equipment used to transfer semiconductor substrates between process chambers. More...
METHOD FOR ETCHING ETCH LAYER AND WAFER ETCHING APPARATUS
A method for etching an etch layer formed on a front side of a wafer and a wafer etching apparatus are provided. The wafer etching apparatus includes a first...
WORKPIECE HANDLING MODULES
A workpiece handling module including a first housing member and a second housing member pivotally movable relative to the first member forming a housing...
LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND RESIN-SEALED
The present invention relates to a liquid epoxy resin composition for semiconductor sealing, which contains: (A) a liquid epoxy resin that does not contain a...
METHOD FOR PRODUCING COMPOSITION FOR FORMING COATING FILM FOR LITHOGRAPHY
AND PATTERNING PROCESS
The present invention provides a method for producing a composition for forming a coating film for a lithography used in manufacture of a semiconductor device...
NI:NIGE:GE SELECTIVE ETCH FORMULATIONS AND METHOD OF USING SAME
Compositions and methods for selectively removing unreacted metal material (e.g., unreacted nickel) relative to metal germanide (e.g., NiGe), metal-III-V...
LOW DISHING COPPER CHEMICAL MECHANICAL PLANARIZATION
Copper chemical mechanical polishing (CMP) formulation, method and system are disclosed. The CMP formulation comprises particulate materials, at least two or...
SUBSTRATE HEAT TREATMENT APPARATUS AND METHOD
Substrate heat treatment apparatus and method are provided. According to an embodiment of the present invention, there is provided a substrate heat treatment...
METHOD OF FORMING FINE PATTERNS
Provided is a method of forming fine patterns, which is capable of easily forming a plurality of patterns repeatedly with a fine pitch when forming patterns...
An etching method includes generating a plasma from a hydrogen-containing gas and a fluorine-containing gas with high-frequency electric power for plasma...
COBALT ETCH BACK
Methods of etching cobalt on substrates are provided. Some methods involve exposing the substrate to a boron-containing halide gas and an additive, and...
METHOD FOR FILM FORMATION, AND PATTERN-FORMING METHOD
A method comprises applying a composition on a substrate to form a coating film on the substrate. The coating film is heated in an atmosphere in which an...
METHOD OF FORMING PATTERNS OF A SEMICONDUCTOR DEVICE
A method of forming patterns of a semiconductor device includes sequentially forming first to third mask layers on a substrate including a first region and a...
METHOD FOR PROCESSING TARGET OBJECT
A method for processing a target object by using a capacitively coupled plasma processing apparatus includes a first step of supplying a first gas containing a...
METHODS FOR FORMING PATTERN USING CYCLIC PROCESSING
A method for forming a vertical pattern includes forming a tungsten layer on a lower layer and performing a cyclic process including an etch process and an...
LIQUID PRECURSOR COMPOSITIONS, PREPARATION METHODS THEREOF, AND METHODS
FOR FORMING LAYER USING THE COMPOSITION
Liquid precursor compositions are provided, along with methods of preparing the liquid precursor compositions, and methods for forming layers using the liquid...
SEMICONDUCTOR DEVICE AND FORMATION THEREOF
A semiconductor device and method of formation are provided. The semiconductor device comprises a metal plug in a first opening over a substrate. The metal...
Spacer Enabled Poly Gate
A spacer etching process produces ultra-narrow polysilicon and gate oxides for insulated gates used with insulated gate transistors. Narrow channels are formed...
STRATIFIED GATE DIELECTRIC STACK FOR GATE DIELECTRIC LEAKAGE REDUCTION
A stratified gate dielectric stack includes a first high dielectric constant (high-k) gate dielectric comprising a first high-k dielectric material, a...
FINFET HAVING CONTROLLED DIELECTRIC REGION HEIGHT
Embodiments are directed to a method of forming a dielectric region of a fin-type field effect transistor (FinFET). The method includes forming at least one...
DIFFUSION AGENT COMPOSITION
A diffusion agent composition that, even when coated on a semiconductor substrate in a nano-scale thickness, allows an impurity diffusion component to be well...
APPARATUS FOR DOPING IMPURITIES, METHOD FOR DOPING IMPURITIES, AND METHOD
FOR MANUFACTURING SEMICONDUCTOR DEVICE
An apparatus for doping impurities includes: a bath reserving liquid containing impurity elements; a liquid transport device transporting the liquid on a...
METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
A method of manufacturing a silicon carbide semiconductor device, having a silicon carbide semiconductor element substrate and a surface electrode film forming...
CUT FIRST SELF-ALIGNED LITHO-ETCH PATTERNING
The present disclosure relates to a method for performing a self-aligned litho-etch (SALE) process. In some embodiments, the method is performed by forming a...
Method of Forming Multiple Patterning Spacer Structures
Disclosed herein is a method of forming a structure, comprising forming a mandrel layer over a substrate, masking the mandrel layer with a first mask and...
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
In a method of manufacturing a semiconductor device, a mask layer and a first layer may be sequentially formed on a substrate. The first layer may be patterned...
MANUFACTURING METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
The present invention provides a method for forming a semiconductor structure, comprising: firstly, a substrate is provided, next, a first dry etching process...
COMPOSITION FOR LAYERED TRANSITION METAL CHALCOGENIDE COMPOUND LAYER AND
METHOD OF FORMING LAYERED TRANSITION...
Provided are a composition for forming a layered transition metal chalcogenide compound layer and a method of forming a layered transition metal chalcogenide...
STRUCTURES AND DEVICES INCLUDING GERMANIUM-TIN FILMS AND METHODS OF
Methods of forming germanium-tin films using germane as a precursor are disclosed. Exemplary methods include growing films including germanium and tin in an...
MULTI-STEP SYSTEM AND METHOD FOR CURING A DIELECTRIC FILM
A multi-step system and method for curing a dielectric film in which the system includes a drying system configured to reduce the amount of contaminants, such...
MULTILAYER DIELECTRIC STRUCTURES WITH GRADED COMPOSITION FOR NANO-SCALE
Multilayer dielectric structures are provided with graded composition. For example, a multilayer dielectric structure includes a stack of dielectric films,...
GAP FILL USING CARBON-BASED FILMS
Provided herein are methods of filling gaps using high density plasma chemical vapor deposition (HDP CVD). According to various implementations,...
METHOD OF FORMING THIN FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR
A method of forming a thin film includes forming an interface layer stack on a semiconductor substrate. Forming the interface layer stack may include...
CYCLIC ORGANOAMINOSILANE PRECURSORS FOR FORMING SILICON-CONTAINING FILMS
AND METHODS OF USING THE SAME
Disclosed are methods for forming a silicon-containing layer on a substrate, the method comprising the steps of introducing into a reactor containing a...
CLEANING HIGH ASPECT RATIO VIAS
A method of removing an amorphous silicon/silicon oxide film stack from vias is described. The method may involve a remote plasma comprising fluorine and a...
PLASMA TREATMENT TO IMPROVE ADHESION BETWEEN HARDMASK FILM AND SILICON
The present disclosure relates to methods for improving adhesion between a hardmask layer and a subsequent layer on the hardmask layer. Particularly,...
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING
APPARATUS, AND RECORDING MEDIUM
A method of manufacturing a semiconductor device includes forming a thin film containing a predetermined element, oxygen, carbon, and nitrogen on a substrate...
SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, AND
COMPUTER-READABLE STORAGE MEDIUM
A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the...