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Patent # Description
2016/0329347 VERTICAL CHANNEL-TYPE 3D SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
A vertical channel-type 3D semiconductor memory device and a method for manufacturing the same are disclosed. In one aspect, the method includes depositing...
2016/0329346 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
According to one embodiment, the stacked body includes a plurality of stacked units and a first intermediate layer. Each of the stacked units includes a...
2016/0329345 3D NAND DEVICE AND FABRICATION METHOD THEREOF
A method for forming a 3D NAND structure includes providing a semiconductor substrate; forming a control gate structure having a plurality of staircase-stacked...
2016/0329344 3D VOLTAGE SWITCHING TRANSISTORS FOR 3D VERTICAL GATE MEMORY ARRAY
The area consumed by switching transistors for a 3D NAND memory array can be reduced with 3D voltage switching transistors with reduced aggregate area in...
2016/0329343 THREE DIMENSIONAL MEMORY DEVICE WITH HYBRID SOURCE ELECTRODE FOR WAFER WARPAGE REDUCTION
The metallic material content of a contact via structure for a three-dimensional memory device can be reduced by employing a vertical stack of a doped...
2016/0329342 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device includes a charge storage pattern on a substrate, a blocking insulating pattern on the charge storage pattern, and a control gate...
2016/0329341 THREE DIMENSIONAL MEMORY DEVICE HAVING WELL CONTACT PILLAR AND METHOD OF MAKING THEREOF
A monolithic three dimensional memory device includes a semiconductor substrate having a major surface and a doped well region of a first conductivity type...
2016/0329340 NONVOLATILE MEMORY DEVICE
A nonvolatile memory device may include a first well area formed on a substrate, a plurality of channel layers disposed on the first well area and extended in...
2016/0329339 SEMICONDUCTOR MEMORY DEVICE
Provided is a semiconductor memory device including a floating gate formed of a semiconductor, which includes a first floating gate and a second floating gate...
2016/0329338 SEMICONDUCTOR DEVICE
A semiconductor device includes: a substrate having a plurality of active regions; a plurality of bit lines extending in a first direction, the plurality of...
2016/0329337 SEMICONDUCTOR DEVICE INCLUDING AIR GAPS AND METHOD FOR FABRICATING THE SAME
Disclosed are a semiconductor device capable of reducing parasitic capacitance between adjacent conductive structures and a method for fabricating the same....
2016/0329336 SEMICONDUCTOR DEVICE OR ELECTRONIC COMPONENT INCLUDING THE SAME
A semiconductor device includes a memory cell, a buffer circuit, a switch, first to p-th switch circuits, and first to p-th capacitors (p is an integer of 2 or...
2016/0329335 MEMORY STRUCTURE HAVING ARRAY-UNDER-PERIPHERY STRUCTURE
A memory structure is provided. The memory structure includes a substrate, an array portion disposed on the substrate, a periphery portion disposed on the...
2016/0329334 SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF
A semiconductor arrangement and method of formation are provided. A semiconductor arrangement includes a first semiconductor device adjacent a second...
2016/0329333 SEMICONDUCTOR DEVICE HAVING STRAIN-RELAXED BUFFER LAYER AND METHOD OF MANUFACTURING THE SAME
A semiconductor device includes a substrate, a strain-relaxed buffer layer on the substrate, at least one well in the strain-relaxed buffer layer, a first...
2016/0329332 DUAL MATERIAL FINFET ON SINGLE SUBSTRATE
A semiconductor device and a method for fabricating the device are provided. The semiconductor device has a substrate having a first device region and a second...
2016/0329331 Mechanism for FinFET Well Doping
The embodiments of mechanisms for doping wells of finFET devices described in this disclosure utilize depositing doped films to dope well regions. The...
2016/0329330 METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Using an STI insulating film in a high breakdown voltage MOSFET leads to deterioration in reliability due to impact ionization near the bottom corner of a...
2016/0329329 FinFETs with Nitride Liners and Methods of Forming the Same
An integrated circuit structure includes a semiconductor substrate, which includes a semiconductor strip. A Shallow Trench Isolation (STI) region is on a side...
2016/0329328 SEMICONDUCTOR DEVICE HAVING CONTACT PLUG AND METHOD OF FORMING THE SAME
A semiconductor device includes merged contact plugs. A multi-fin active having N sub-fins is formed in a substrate. A contact plug is formed on the impurity...
2016/0329327 Semiconductor Device Having Strained Channel Layer and Method of Manufacturing the Same
Semiconductor devices are provided. The semiconductor devices include active fins including a buffer layer disposed on a substrate and a channel layer disposed...
2016/0329326 SUB-FIN DOPED BULK FIN FIELD EFFECT TRANSISTOR (FINFET), INTEGRATED CIRCUIT (IC) AND METHOD OF MANUFACTURE
A field effect transistor (FET), integrated circuit (IC) chip including the FETs and a method of forming the IC. Fins on pedestals are defined, e.g., with a...
2016/0329325 ROM Chip Manufacturing Structures
An integrated circuit (IC) chip embodiment includes first and second ROM cells arranged in a same row of a ROM array. The first and second ROM cells include...
2016/0329324 Bidirectional Bipolar Power Devices with Two-Surface Optimization of Striped Emitter/Collector Orientation
Two-surface bidirectional power bipolar transistors, in which the emitter/collector regions on the opposite surfaces of the die are each laid out as an array...
2016/0329323 SEMICONDUCTOR DEVICE
A small semiconductor device having a diode forward voltage less likely to change due to a gate potential is provided. An anode and an upper IGBT structure...
2016/0329322 SEMICONDUCTOR DEVICE
In the reverse-conducting IGBT according to the present invention, an n-type buffer layer surrounds a p-type collector layer. A p-type separation layer...
2016/0329321 HIGH DENSITY CAPACITORS FORMED FROM THIN VERTICAL SEMICONDUCTOR STRUCTURES SUCH AS FINFETS
A vertical structure may be manufactured in a substrate of an integrated circuit, and that vertical structure used to form a high density capacitance for the...
2016/0329320 POWER SEMICONDUCTOR DEVICE AND METHOD THEREFOR
A power transistor includes a plurality of transistor cells. Each transistor cell has a first electrode coupled to a first electrode interconnection region...
2016/0329319 FinFET-Based ESD Devices and Methods for Forming the Same
A semiconductor device includes semiconductor fins on semiconductor strips on a substrate. The semiconductor fins are parallel to each other. A gate stack is...
2016/0329318 DIODE, DIODE STRING CIRCUIT, AND ELECTROSTATIC DISCHARGE PROTECTION DEVICE
A diode includes a substrate, a first insulating layer, a second insulating layer, a well, a deep doped region, a first doped region, and a second doped...
2016/0329317 IMMUNITY TO INLINE CHARGING DAMAGE IN CIRCUIT DESIGNS
Approaches for checking a design of an integrated circuit using an antenna rule are provided. A method includes determining a figure of merit for a transistor...
2016/0329316 LIGHTING MODULE FOR EMITTING MIXED LIGHT
A lighting module for emitting mixed light comprises at least one first semiconductor element which emits unconverted red light, at least one second...
2016/0329315 SEMICONDUCTOR DEVICE AND METHOD FOR DESIGNING IT
This semiconductor device (10) has a heat source element (HSE) and a thermosensor element (TE) on a semiconductor chip (SCH). The profile of the heat source...
2016/0329314 SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
Provided are a semiconductor device and a fabricating method thereof. The fabricating method includes forming first to fourth fins, each extending in a first...
2016/0329313 CELLS HAVING TRANSISTORS AND INTERCONNECTS INCLUDING NANOWIRES OR 2D MATERIAL STRIPS
An integrated circuit design tool includes a cell library. The cell library includes entries for a plurality of cells, entries in the cell library including...
2016/0329312 SEMICONDUCTOR CHIP WITH OFFLOADED LOGIC
Various semiconductor chip and interposer devices are disclosed. In one aspect, an apparatus is provided that includes an interposer, a first semiconductor...
2016/0329311 LIGHT EMITTING DEVICE PACKAGE
A light emitting device package is provided. The light emitting device package may include a main body having a cavity including side surfaces and a bottom,...
2016/0329310 Methods of Forming Conductive and Insulating Layers
Methods of forming conductive and insulating layers for semiconductor devices and packages. Substrate is provided with integrated circuit device and...
2016/0329309 SSI PoP
An assembly can include a first microelectronic package and a circuit structure comprising a plurality of dielectric layers and electrically conductive...
2016/0329308 WIRE BOND SUPPORT STRUCTURE AND MICROELECTRONIC PACKAGE INCLUDING WIRE BONDS THEREFROM
A microelectronic package may include a substrate having first and second regions, a first surface and a second surface remote from the first surface; at least...
2016/0329307 Integrated Fan-Out Structure with Guiding Trenches in Buffer Layer
A bottom package includes a molding compound, a buffer layer over and contacting the molding compound, and a through-via penetrating through the molding...
2016/0329306 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
A semiconductor package and a manufacturing method thereof are provided. The package element has a first insulating layer, and a plurality of holes are...
2016/0329305 STACKED PACKAGE DEVICE AND METHOD FOR FABRICATING THE SAME
A method for fabricating a stacked package device is provided. A second substrate is adhered onto a first substrate. The first substrate includes a plurality...
2016/0329304 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
One device includes a first chip having first electrodes on one surface, and a rough portion on another surface. The device also includes a second chip having...
2016/0329303 SEMICONDUCTOR DEVICE PACKAGES INCLUDING A CONTROLLER ELEMENT AND RELATED METHODS
Semiconductor device packages include a stack of semiconductor memory devices positioned over an interposer substrate, a controller element, and a...
2016/0329302 Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
Packaged semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes a substrate and a plurality of integrated circuit...
2016/0329301 METHOD FOR PREPARING LOW COST SUBSTRATES
A mask is formed over a first conductive portion of a conductive layer to expose a second conductive portion of the conductive layer. An electrolytic process...
2016/0329300 NEW 2.5D MICROELECTRONIC ASSEMBLY AND METHOD WITH CIRCUIT STRUCTURE FORMED ON CARRIER
A dielectric element has a plurality of contacts at a first surface and a plurality of first traces coupled thereto which extend in directions parallel to the...
2016/0329299 FAN-OUT PACKAGE STRUCTURE INCLUDING ANTENNA
A semiconductor package structure including a first semiconductor package is provided. The first semiconductor package includes a first semiconductor package...
2016/0329298 PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR DEVICE INCLUDING FAN-OUT MEMORY PACKAGE
A semiconductor device may include a bottom package embedded with a first semiconductor chip. The semiconductor device may include a middle package stacked...
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