Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2016/0329297 FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY
A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip...
2016/0329296 BOND HEADS FOR THERMOCOMPRESSION BONDERS, THERMOCOMPRESSION BONDERS, AND METHODS OF OPERATING THE SAME
A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat...
2016/0329295 SEMICONDUCTOR-MOUNTED PRODUCT AND METHOD OF PRODUCING THE SAME
A semiconductor-mounted product includes a semiconductor package, a circuit board, a solder bonding part, and a resin reinforcing part. Wiring is formed on the...
2016/0329294 BALL BONDING METAL WIRE BOND WIRES TO METAL PADS
An apparatus, and methods therefor, relates generally to an integrated circuit package. In such an apparatus, a platform substrate has a copper pad. An...
2016/0329293 Bonded Structures for Package and Substrate
The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially...
2016/0329292 Semiconductor Package Configured for Connection to a Board
A semiconductor package includes a plurality of contact areas having a specific contact area and a plurality of solder balls applied to the contact areas. Two...
2016/0329291 Packaging Devices, Methods of Manufacture Thereof, and Packaging Methods
Packaging devices, methods of manufacture thereof, and packaging methods are disclosed. In some embodiments, a packaging device includes a first substrate...
2016/0329290 Reliable Device Assembly
Microelectronic assemblies and methods for making the same are disclosed herein. In one embodiment, a method of forming a microelectronic assembly comprises...
2016/0329289 SILVER ALLOYING POST-CHIP JOIN
A method of forming a stacked surface arrangement for semiconductor devices includes joining a first surface to a second surface with a solder bump, the solder...
2016/0329288 Semiconductor Structure With Sacrificial Anode and Method for Forming
A packaged semiconductor device is made by forming a conductive pad on an external surface of an integrated circuit device, forming a passivation layer over...
2016/0329287 INDUCING DEVICE VARIATION FOR SECURITY APPLICATIONS
A Physical Unclonable Function (PUF) semiconductor device includes a semiconductor substrate, and regions, with implant regions and covered regions, in the...
2016/0329286 POWER SEMICONDUCTOR DEVICE
A power semiconductor device is disclosed having a power semiconductor element with an upper and lower side, the upper side being located opposite to the lower...
2016/0329285 SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENING IN SHIELDING CORE PLATE
A semiconductor package includes a first plate having a through hole therein, at least one interconnection layer disposed on a first surface of the first...
2016/0329284 SEMICONDUCTOR PACKAGE WITH HIGH DENSITY DIE TO DIE CONNECTION AND METHOD OF MAKING THE SAME
A semiconductor package according to some examples of the disclosure may include a substrate having a bridge embedded in the substrate, a first and second die...
2016/0329283 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
A semiconductor structure includes a first substrate, a second substrate, a dam layer, a photoresist layer, and a conductive layer. The first substrate has a...
2016/0329282 EMBEDDED FUSE WITH CONDUCTOR BACKFILL
Embedded fuse structures and fabrication techniques. An embedded fuse may include a non-planar conductive line having two high-z portions extending to a...
2016/0329281 Structure of integrated inductor
This invention discloses a structure of an integrated inductor, comprising: an outer metal segment which comprises a first metal sub-segment and a second metal...
2016/0329280 Device-Manufacturing Scheme for Increasing the Density of Metal Patterns in Inter-Layer Dielectrics
A method includes forming a transistor at a surface of a semiconductor substrate, wherein the step of forming the transistor comprises forming a gate...
2016/0329279 INTERCONNECT STRUCTURE
Low capacitance and high reliability interconnect structures and methods of manufacture are disclosed. The method includes forming a copper based interconnect...
2016/0329278 2D SELF-ALIGNED VIA FIRST PROCESS FLOW
A method of forming 2D self-aligned vias before forming a subsequent metal layer and reducing capacitance of the resulting device and the resulting device are...
2016/0329277 SWITCHED-CAPACITOR DC-TO-DC CONVERTERS
A switched-capacitor DC-to-DC converter includes a first P-channel MOS transistor, a first N-channel MOS transistor, a second P-channel MOS transistor, and a...
2016/0329276 SEMICONDUCTOR INTEGRATED CIRCUIT LAYOUT STRUCTURE
A semiconductor integrated circuit layout structure includes a first active region, a second active region isolating from the first active region, a gate...
2016/0329275 PACKAGE SUBSTRATE AND METHODS FOR MANUFACTURING THE SAME
The present inventive concept provides a package substrate. The package substrate comprises an insulating substrate having a top surface a circuit pattern...
2016/0329274 MULTILAYER SUBSTRATE FOR SEMICONDUCTOR PACKAGING
Embodiments disclosed include a multilayer substrate for semiconductor packaging. The substrate may include a first layer with a first side with an xy-plane...
2016/0329273 THROUGH-HOLE ELECTRODE SUBSTRATE
A method of manufacturing a through-hole electrode substrate includes forming a plurality of through-holes in a substrate, forming a plurality of through-hole...
2016/0329272 STACKED SEMICONDUCTOR DEVICE PACKAGE WITH IMPROVED INTERCONNECT BANDWIDTH
The present disclosure describes embodiments of a stacked semiconductor device package and associated techniques and configurations. A package may include a...
2016/0329271 STACKING ARRANGEMENT FOR INTEGRATION OF MULTIPLE INTEGRATED CIRCUITS
A stacked integrated circuit (IC) system including a substrate, a contour support, and a first and second IC dies. The contour support including a first...
2016/0329270 HIGH HEAT-DISSIPATION CHIP PACKAGE STRUCTURE
A high heat-dissipation chip package structure for packaging the semiconductor chips is disclosed. A pre-attachment film is adhered on an upper surface of a...
2016/0329269 CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
A chip package structure including a lead frame, a chip, a plurality of solder bumps, a solder resist layer and an encapsulant is provided. The lead frame has...
2016/0329268 METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE THEREOF
Some embodiments include a method. The method can include providing a carrier substrate, providing a release layer over the carrier substrate, and providing a...
2016/0329267 ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
An electronic package is provided, which includes: a circuit structure having opposite first and second sides; at least an electronic element disposed on the...
2016/0329266 ELECTRONIC POWER DEVICE WITH IMPROVED COOLING
An electronic device comprising at least one electronic component mounted on a support and surrounded by a deformable casing containing a heat-conducting and...
2016/0329265 PHASE CHANGING ON-CHIP THERMAL HEAT SINK
A method of forming an on-chip heat sink includes forming a device on a substrate. The method also includes forming a plurality of insulator layers over the...
2016/0329264 SEMICONDUCTOR ASSEMBLY
A semiconductor assembly includes a stack with a semiconductor module and a cooler, wherein the semiconductor module is provided in contact with the cooler. A...
2016/0329263 Semiconductor Device Having a Copper Element and Method of Forming a Semiconductor Device Having a Copper Element
A semiconductor device includes a base element and a copper element over the base element. The copper element includes a layer stack having at least two copper...
2016/0329262 SEMICONDUCTOR CHIP PACKAGE ASSEMBLY WITH IMPROVED HEAT DISSIPATION PERFORMANCE
A semiconductor chip package assembly includes a package substrate having a chip mounting surface; a plurality of solder pads disposed on the chip mounting...
2016/0329261 Electronic device and fabrication method thereof
An electronic device is provided, which includes an electronic element and a heat dissipating element disposed on the electronic element through a thermal...
2016/0329260 ELECTRONIC DEVICE INCLUDING A METAL SUBSTRATE AND A SEMICONDUCTOR MODULE EMBEDDED IN A LAMINATE
An electronic device having a substrate including a metal layer, an electrically insulating layer disposed above the substrate, a semiconductor module disposed...
2016/0329259 CIRCUIT CARRIER INCLUDING A SILICONE POLYMER COATING
A circuit carrier. The circuit carrier has at least one electronic component, the electronic component being soldered to the circuit carrier, in particular...
2016/0329258 METHOD AND APPARATUS FOR BOND-PAD CHARGING PROTECTION OF TRANSISTOR TEST STRUCTURES
A method for preparing a non-reference transistor test structure having multiple terminals is disclosed. The method may include when an intended application of...
2016/0329257 SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZED PACKAGING WITH DYNAMIC VIA CLIPPING
A semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping is described. A panel comprising an encapsulating...
2016/0329256 METHODS AND APPARATUS FOR CONTROLLING SUBSTRATE UNIFORMITY
A dynamically tunable process kit, a processing chamber having a dynamically tunable process kit, and a method for processing a substrate using a dynamically...
2016/0329255 SEMICONDUCTOR DEVICE, MEASUREMENT APPARATUS, AND MEASUREMENT METHOD OF RELATIVE PERMITTIVITY
The field of an oxide semiconductor has been attracted attention in recent years. Therefore, the correlation between electric characteristics of a transistor...
2016/0329254 SELECTIVE THICKENING OF PFET DIELECTRIC
A complementary metal-oxide semiconductor (CMOS) device and a method of fabricating a CMOS device are described. The method includes forming an interfacial...
2016/0329253 INTEGRATED TENSILE STRAINED SILICON NFET AND COMPRESSIVE STRAINED SILICON-GERMANIUM PFET IMPLEMENTED IN FINFET...
A tensile strained silicon layer is patterned to form a first group of fins in a first substrate area and a second group of fins in a second substrate area....
2016/0329252 Multi-Gate Device Structure Including a Fin-Embedded Isolation Region and Methods Thereof
A structure and method for implementation of high voltage devices within multi-gate device structures includes a substrate having a fin extending therefrom and...
2016/0329251 UNIDIRECTIONAL SPACER IN TRENCH SILICIDE
A semiconductor device includes a trench region in an interconnect level dielectric layer. A silicide layer is on the bottom of the trench region. Opposing...
2016/0329250 SEMICONDUCTOR DEVICE AND FORMATION THEREOF
A semiconductor device and method of formation are provided herein. A semiconductor device includes a fin having a doped region, in some embodiments. The...
2016/0329249 ISOLATION COMPONENTS FOR TRANSISTORS FORMED ON FIN FEATURES OF SEMICONDUCTOR SUBSTRATES
In an embodiment, a method comprises: forming a fin feature on a portion of a surface of a substrate; forming a first region of polycrystalline silicon over a...
2016/0329248 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
A semiconductor device and a method of forming the same, the semiconductor device includes a substrate, a plurality of fin shaped structures and an insulating...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.