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Patent # Description
2016/0336304 METHOD FOR TRANSFERRING MICRO DEVICES AND METHOD FOR MANUFACTURING DISPLAY PANEL
A method for transferring micro devices is provided. The method includes the following operations: providing a carrier substrate and forming micro devices on...
2016/0336303 SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
A semiconductor package includes a semiconductor die having an active surface and a bottom surface opposite to the active surface; a plurality of bond pads...
2016/0336302 DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS
Discontinuous bonds for semiconductor devices are disclosed herein. A device in accordance with a particular embodiment includes a first substrate and a second...
2016/0336301 Surface-Mountable Multi-Chip Component
A surface-mountable multi-chip component includes a carrier having a first connection element, a second connection element and third connection element that...
2016/0336300 STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND ASSOCIATED SYSTEMS AND METHODS
Stacked semiconductor die assemblies with die support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die...
2016/0336299 Semiconductor Device and Method of Forming Wire Studs as Vertical Interconnect in FO-WLP
A semiconductor device has a substrate and semiconductor die disposed over a first surface of the substrate. A wire stud is attached to the first surface of...
2016/0336298 METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
A method for manufacturing a semiconductor package structure is provided. A semiconductor substrate comprising a conductive pad is provided, wherein the...
2016/0336297 INTEGRATED DEVICE DIE AND PACKAGE WITH STRESS REDUCTION FEATURES
An integrated device die and package is disclosed. The integrated device die includes a unitary body. The unitary body can have an upper portion comprising one...
2016/0336296 ELECTRONIC COMPONENT PACKAGE AND PACKAGE-ON-PACKAGE STRUCTURE INCLUDING THE SAME
An electronic component package includes a frame containing a metal or ceramic based material and having a through-hole, an electronic component disposed in...
2016/0336295 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor package structure and a method for manufacturing the same are provided. The semiconductor package structure has a substrate and a die stack of...
2016/0336294 DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARATUS UTILIZING PHTHALATE
Provided are a device packing facility and method using phthalate and a device processing apparatus utilizing the phthalate. The device packaging facility...
2016/0336293 DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARATUS UTILIZING DEHT
Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a...
2016/0336292 DIE BONDING WITH LIQUID PHASE SOLDER
A method of bonding a die comprising solder bumps to a substrate comprising bond pads, the method comprising the steps of heating the die from a first...
2016/0336291 SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD
A semiconductor device manufacturing apparatus includes a stage, a head section facing the stage and configured to hold a semiconductor element, a driving...
2016/0336290 ADHESIVE RESIN COMPOSITION FOR BONDING SEMICONDUCTORS AND ADHESIVE FILM FOR SEMICONDUCTORS
The present invention relates to an adhesive resin composition for bonding semiconductors, including: a (meth)acrylate-based resin including more than 17% by...
2016/0336289 CONNECTING TECHNIQUES FOR STACKED CMOS DEVICES
In some embodiments, the present disclosure relates to an integrated chip having an inter-tier interconnecting structure having horizontal components, which is...
2016/0336288 Semiconductor Device
Disclosed is a semiconductor device suppressed in decrease of reliability. The semiconductor device comprises an electrode pad portion (2) formed on the upper...
2016/0336287 SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE HAVING THE SAME
A semiconductor package structure includes a substrate, a semiconductor chip, and a solder material. The substrate includes an insulating layer, a conductive...
2016/0336286 CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHODS OF MANUFACTURE
In some embodiments, to increase the height-to-pitch ratio of a solder connection that connects different structures with one or more solder balls, only a...
2016/0336285 CHIP PACKAGING STRUCTURES
A method for treating a chip packaging structure includes providing a chip packaging structure having at least a first electrical connect structure and a...
2016/0336284 MOISTURE BARRIER FOR SEMICONDUCTOR STRUCTURES WITH STRESS RELIEF
A semiconductor structure is disclosed. The semiconductor structure includes an electrically conductive layer disposed over a substrate. A moisture barrier...
2016/0336283 SEMICONDUCTOR PACKAGE, PRINTED CIRCUIT BOARD SUBSTRATE AND SEMICONDUCTOR DEVICE
A semiconductor package includes: a semiconductor integrated circuit; an interlayer film disposed on the semiconductor integrated circuit; a rewiring layer...
2016/0336282 PACKAGE STRUCTURES HAVING INTEGRATED WAVEGUIDES FOR HIGH SPEED COMMUNICATIONS BETWEEN PACKAGE COMPONENTS
Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package...
2016/0336281 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
The present disclosure provides a method for manufacturing a semiconductor package. The method includes (1) determining a die warpage value under a...
2016/0336280 METHOD OF FORMING A SEMICONDUCTOR PACKAGE
A method of forming a semiconductor package includes forming an interconnecting structure on an adhesive layer, wherein the adhesive layer is on a carrier. The...
2016/0336279 SUBSTRATE OPENING FORMATION IN SEMICONDUCTOR DEVICES
Radio-frequency (RF) devices are fabricated by providing a field-effect transistor (FET) formed over an oxide layer, forming one or more electrical connections...
2016/0336278 CAVITY FORMATION IN SEMICONDUCTOR DEVICES
Fabricating of radio-frequency (RF) devices involve providing a field-effect transistor (FET) formed over an oxide layer formed on a semiconductor substrate,...
2016/0336277 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device includes a semiconductor substrate, an insulating film formed above the semiconductor substrate, a wiring having copper as a main...
2016/0336276 ELECTROMAGNETIC SHIELD AND ASSOCIATED METHODS
Semiconductor devices are described, along with methods and systems that include them. One such device includes a diffusion region in a semiconductor material,...
2016/0336275 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
A semiconductor package including a marking film and a method of fabricating the same are provided wherein a marking film including a thermoreactive layer may...
2016/0336274 METHOD FOR FORMING CRACK-STOPPING STRUCTURES
A crack-stopping structure includes a semiconductor wafer comprising a plurality of dies defined by a plurality of scribe line regions, a plurality of metal...
2016/0336273 Method for Displaying Position of Alignment Mark, Array Substrate and Manufacturing Method Thereof
A method for displaying a position of an alignment mark, an array substrate and a manufacturing method thereof are provided. The method for displaying the...
2016/0336272 Semiconductor Device Having Gold Metallization Structures
A semiconductor device includes a semiconductor substrate having first and second terminals of one or more semiconductor devices, first and second barrier...
2016/0336271 METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THEREBY
Methods and associated structures of forming a microelectronic device are described. Those methods may include forming a structure comprising a first contact...
2016/0336270 SEMICONDUCTOR STRUCTURE AND PROCESS FOR FORMING PLUG
A semiconductor process for forming a plug includes the following steps. A dielectric layer having a recess is formed on a substrate. A titanium layer is...
2016/0336269 SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF
A semiconductor process includes the following steps. A dielectric layer having a recess is formed on a substrate. A barrier layer is formed to cover the...
2016/0336268 POWER SEMICONDUCTOR DEVICE
A power semiconductor device includes a first polarity-side semiconductor element whose first principal electrode is in contact with a first polarity-side...
2016/0336267 SEMICONDUCTOR DEVICE
A semiconductor device may include pillars and a plurality of conductive layers being stacked while surrounding the pillars and including a plurality of first...
2016/0336266 SELF ALIGNED CONTACT STRUCTURE
Embodiments of present invention provide a method of forming a semiconductor structure. The method includes forming a semiconductor structure having a first...
2016/0336265 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
A semiconductor device is disclosed. The semiconductor device includes: a substrate having a die region and a scribe line region defined thereon; and a bonding...
2016/0336264 FILLING CAVITIES IN AN INTEGRATED CIRCUIT AND RESULTING DEVICES
A methodology enabling filling of high aspect ratio cavities, with no voids or gaps, in an IC device and the resulting device are disclosed. Embodiments...
2016/0336263 DIGITAL DATA DEVICE INTERCONNECTS
Digital data system disposed on a substrate includes a digital data device and at least one digital data interconnect disposed on the substrate. The digital...
2016/0336262 MICROSTRUCTURE, MULTILAYER WIRING BOARD, SEMICONDUCTOR PACKAGE AND MICROSTRUCTURE MANUFACTURING METHOD
The present invention is to provide a microstructure capable of improving the withstand voltage of an insulating substrate while securing fine conductive...
2016/0336261 PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the conductor layer has a first...
2016/0336260 SEMICONDUCTOR DEVICE HAVING THROUGH-ELECTRODE
A semiconductor device includes a base including a substrate and a first insulating layer formed thereon. The base has a first surface and a second surface...
2016/0336259 SILICON-GLASS HYBRID INTERPOSER CIRCUITRY
An interposer is provided. The interposer includes a silicon substrate layer, a glass substrate layer, and at least one through interposer via. The silicon...
2016/0336258 MOLDED INSULATOR IN PACKAGE ASSEMBLY
Embodiments of the present disclosure describe techniques and configurations for package assembly including an embedded element and a molded insulator...
2016/0336257 SEMICONDUCTOR PACKAGE WITH CLIP STRUCTURE
A semiconductor package comprise a downset has a first end coupled to a connection portion and a second opposite end electrically coupled to a lead of a lead...
2016/0336256 INTEGRATED CLIP AND LEAD AND METHOD OF MAKING A CIRCUIT
A circuit includes a conductive clip coupled to at least one component in the circuit. At least one lead portion is located on an end of the clip. The circuit...
2016/0336255 RADIOFREQUENCY HIGH-OUTPUT DEVICE
A radiofrequency high-output device includes: a base plate having a mount portion and a flange portion; a frame joined to an upper surface of the mount...
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