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SEMICONDUCTOR PACKAGE WITH ELASTIC COUPLER AND RELATED METHODS
A semiconductor package includes: a die coupled to a substrate; a housing coupled to the substrate and at least partially enclosing the die within a cavity of...
Certain embodiments provide a method for manufacturing a semiconductor device including forming a first interconnection layer having a first conductive layer...
Packaging through Pre-Formed Metal Pins
A package includes first package component and a second package component. The first package component includes a first electrical connector at a surface of...
FORMING SACRIFICIAL COMPOSITE MATERIALS FOR PACKAGE-ON-PACKAGE
ARCHITECTURES AND STRUCTURES FORMED THEREBY
Methods of forming a microelectronic packaging structure are described. Those methods may include forming a solder paste comprising a sacrificial polymer on a...
Conductive Pad Structure for Hybrid Bonding and Methods of Forming Same
A representative device includes a patterned opening through a layer at a surface of a device die. A liner is disposed on sidewalls of the opening and the...
A semiconductor device includes a pad group including pads provided on a semiconductor substrate and arranged in a row to form a pad row as a whole. The pad...
CONDUCTIVE PATHS THROUGH DIELECTRIC WITH A HIGH ASPECT RATIO FOR
Conductive paths through a dielectric are described that have a high aspect ratio for semiconductor devices. In one example, a plurality of conductive...
METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT HAVING A COMMON MODE
FILTER MONOLITHICALLY INTEGRATED WITH A...
In accordance with an embodiment, a semiconductor component, includes a common mode filter monolithically integrated with a protection device. The common mode...
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIPS MOUNTED OVER BOTH
SURFACES OF SUBSTRATE
A semiconductor chip 10 flip-chip mounted on a first surface 32 of a wiring substrate 30, a semiconductor chip 20 flip-chip mounted on a second surface 33 of...
SUBSTRATE DIVIDING METHOD
A substrate dividing method which can thin and divide a substrate while preventing chipping, and cracking from occurring. This substrate dividing method...
SEAL RING STRUCTURE TO AVOID DELAMINATION DEFECT
A semiconductor device includes a semiconductor substrate, a plurality of integrated circuit devices on the semiconductor substrate, and a seal ring structure...
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device package includes a substrate, electrical components disposed on the substrate, and a conductive frame disposed on the substrate. The...
METHOD OF FORMING ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER OF BALL
GRID ARRAY SEMICONDUCTOR PACKAGE AND...
Provided are a method of forming an electromagnetic interference (EMI) shielding layer of a ball grid array (BGA) semiconductor package, and a base tape used...
FLEXIBLE DEVICE HAVING FLEXIBLE INTERCONNECT LAYER USING TWO-DIMENSIONAL
A flexible device includes an electronic device having an electrode and a flexible interconnect layer formed on the electrode. The flexible interconnect layer...
A semiconductor device may include pillars and a plurality of conductive layers being stacked while surrounding the pillars and including a plurality of first...
Material and Process for Copper Barrier Layer
A method of fabricating a semiconductor device comprises forming a first dielectric material layer on a semiconductor substrate. The first dielectric material...
METHODS RELATED TO A SPUTTERED TITANIUM TUNGSTEN LAYER FORMED OVER A
COPPER INTERCONNECT STACK STRUCTURE
Disclosed are devices and methods related to metallization of semiconductors. A metalized structure can include a stack disposed over a compound semiconductor,...
EMBEDDED MULTI-DEVICE BRIDGE WITH THROUGH-BRIDGE CONDUCTIVE VIA SIGNAL
A microelectronic structure includes a substrate having a first surface and a cavity extending into the substrate from the substrate first surface, a first...
TECHNIQUES FOR FORMING INTERCONNECTS IN POROUS DIELECTRIC MATERIALS
Techniques are disclosed for forming interconnects in porous dielectric materials. In accordance with some embodiments, the porosity of a host dielectric layer...
METHOD FOR FORMING METAL SEMICONDUCTOR ALLOYS IN CONTACT HOLES AND
A semiconductor device is provided that includes a gate structure on a channel region of a substrate. A source region and a drain region are present on...
BODY-BIAS VOLTAGE ROUTING STRUCTURES
Body-bias voltage routing structures. In an embodiment, doped well structures distribute body biasing voltages to a plurality of body biasing wells of an...
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
One or more embodiments relate to a method for making a semiconductor structure, comprising: providing a workpiece; forming a barrier layer over the workpiece;...
STRUCTURE FOR COUPLING METAL LAYER INTERCONNECTS IN A SEMICONDUCTOR DEVICE
A MOS device includes a first interconnect extending in a first direction, the first interconnect being configured in a metal layer. The MOS device further...
WIRING STRUCTURES AND SEMICONDUCTOR DEVICES
A wiring structure includes a substrate, a lower insulation layer on the substrate, a lower wiring in the lower insulation layer, a first etch-stop layer...
E-FUSE IN SOI CONFIGURATION
A method of forming a semiconductor device comprising a fuse is provided including providing a semiconductor-on-insulator (SOI) structure comprising an...
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
According to one embodiment, a semiconductor device includes interconnects extending from a element formation area to the drawing area, and connected with...
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
According to one embodiment, a semiconductor device includes a stacked body, a core film, and a stacked film. The stacked body includes a plurality of...
Semiconductor Device and Method of Manufacturing Semiconductor Device
A semiconductor device includes a substrate having an active region, a first gate structure over a top surface of the substrate, a second gate structure over...
SUBSTRATE STRUCTURE WITH ARRAY OF MICROMETER SCALE COPPER PILLAR BASED
STRUCTURES AND METHOD FOR MANUFACTURING SAME
Micro bump interconnection structures for semiconductor devices, and more specifically, a substrate structure comprising an array of micrometer scale copper...
WIRING SUBSTRATE, MANUFACTURING METHOD OF WIRING SUBSTRATE AND ELECTRONIC
A wiring substrate includes an insulation layer having an electronic component mounting area, and a wiring layer embedded in the insulation layer, the wiring...
Package Structure and Three Dimensional Package Structure
A package structure is disclosed. The package structure includes at least a lead, for delivering at least a signal; at least a routing layer, connected to the...
METHOD AND APPARATUS FOR FORMING MULTI-LAYERED VIAS IN SEQUENTIALLY
An electronic module assembly including a via spanning multiple layers in a wafer based module is described. The electronic module assembly can include a first...
SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A 3D COMPONENT WITH AN
A package may include a die proximate to a structure having a substrate with interconnects and a first component coupled to the interconnects. The die may be...
GLASS CLAD MICROELECTRONIC SUBSTRATE
Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing...
Molding Compound Structure
A device comprises a package component comprising a plurality of bumps formed on a first side of the package component, a semiconductor die mounted on the...
INTERPOSER AND SEMICONDUCTOR MODULE FOR USE IN AUTOMOTIVE APPLICATONS
An interposer of silicon for use in a semiconductor module, wherein the interposer has a top side serving for arrangement of functional semiconductor and an...
SEMICONDUCTOR DEVICE, METAL MEMBER, AND METHOD OF MANUFACTURING
A flange on first open end of a tubular contact member is soldered to a conductive plate of an insulating substrate. An external electrode terminal is fitted...
HIGH ASPECT RATIO INTERCONNECT FOR WAFER LEVEL PACKAGE (WLP) AND
INTEGRATED CIRCUIT (IC) PACKAGE
A package (e.g., wafer level package) that includes a die, a redistribution portion coupled to the die, a first high aspect ratio (HAR) interconnect coupled to...
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Provided is a package structure including a circuit board, a plurality of first contact pads, a plurality of metal pillars and at least one chip. The first...
POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A power semiconductor element is fixed on a die pad of the lead frame. A metal plate is bonded to a lower surface of the die pad via an insulating film. The...
SEMICONDUCTOR LEAD FRAME, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD
A semiconductor lead frame includes a metal plate and a semiconductor chip mounting area provided on a top surface of the metal plate. A first plating layer...
A semiconductor device includes a laminated substrate having a circuit board; a semiconductor chip fixed to the circuit board; a terminal having a leading end...
POWER SEMICONDUCTOR MODULE
A power semiconductor module includes a cooler; a plurality of power semiconductor units fixed on the cooler; and a bus bar unit connected electrically to the...
A cooler 20 of a semiconductor device includes an inlet portion 27 and an outlet portion 28 for a cooling liquid, an inlet path 24, an outlet path 25, and a...
SEMINCONDUCTOR DEVICE ASSEMBLY WITH VAPOR CHAMBER
Semiconductor device assemblies having stacked semiconductor dies and thermal transfer devices that include vapor chambers are disclosed herein. In one...
PROCESS FOR PRODUCING A MICROFLUIDIC CIRCUIT WITHIN A THREE-DIMENSIONAL
INTEGRATED STRUCTURE, AND CORRESPONDING...
A three-dimensional integrated structure includes a first and a second element each having an interconnection part formed by metallization levels encased in an...
DEVICE INTEGRATION OF ACTIVE COOLING SYSTEMS
In various embodiments, component-level and product-level devices incorporated one or more low-profile cooling devices for dissipating heat. The low-profile...
Waterproof Electronic Device and Manufacturing Method Thereof
A waterproof electronic device includes: an electronic component module having an electronic component including a semiconductor element, a heat dissipating...
SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A DEVICE IN A FACEUP WORKPIECE
An integrated package may be manufactured in a die face up orientation with a component proximate to the attached die by creating a cavity in the mold compound...
PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE
A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the...