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Patent # Description
2016/0343683 SEMICONDUCTOR PACKAGE WITH ELASTIC COUPLER AND RELATED METHODS
A semiconductor package includes: a die coupled to a substrate; a housing coupled to the substrate and at least partially enclosing the die within a cavity of...
2016/0343682 SEMICONDUCTOR DEVICE
Certain embodiments provide a method for manufacturing a semiconductor device including forming a first interconnection layer having a first conductive layer...
2016/0343681 Packaging through Pre-Formed Metal Pins
A package includes first package component and a second package component. The first package component includes a first electrical connector at a surface of...
2016/0343680 FORMING SACRIFICIAL COMPOSITE MATERIALS FOR PACKAGE-ON-PACKAGE ARCHITECTURES AND STRUCTURES FORMED THEREBY
Methods of forming a microelectronic packaging structure are described. Those methods may include forming a solder paste comprising a sacrificial polymer on a...
2016/0343679 Conductive Pad Structure for Hybrid Bonding and Methods of Forming Same
A representative device includes a patterned opening through a layer at a surface of a device die. A liner is disposed on sidewalls of the opening and the...
2016/0343678 SEMICONDUCTOR DEVICE
A semiconductor device includes a pad group including pads provided on a semiconductor substrate and arranged in a row to form a pad row as a whole. The pad...
2016/0343677 CONDUCTIVE PATHS THROUGH DIELECTRIC WITH A HIGH ASPECT RATIO FOR SEMICONDUCTOR DEVICES
Conductive paths through a dielectric are described that have a high aspect ratio for semiconductor devices. In one example, a plurality of conductive...
2016/0343676 METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT HAVING A COMMON MODE FILTER MONOLITHICALLY INTEGRATED WITH A...
In accordance with an embodiment, a semiconductor component, includes a common mode filter monolithically integrated with a protection device. The common mode...
2016/0343675 SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIPS MOUNTED OVER BOTH SURFACES OF SUBSTRATE
A semiconductor chip 10 flip-chip mounted on a first surface 32 of a wiring substrate 30, a semiconductor chip 20 flip-chip mounted on a second surface 33 of...
2016/0343674 SUBSTRATE DIVIDING METHOD
A substrate dividing method which can thin and divide a substrate while preventing chipping, and cracking from occurring. This substrate dividing method...
2016/0343673 SEAL RING STRUCTURE TO AVOID DELAMINATION DEFECT
A semiconductor device includes a semiconductor substrate, a plurality of integrated circuit devices on the semiconductor substrate, and a seal ring structure...
2016/0343672 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device package includes a substrate, electrical components disposed on the substrate, and a conductive frame disposed on the substrate. The...
2016/0343671 METHOD OF FORMING ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER OF BALL GRID ARRAY SEMICONDUCTOR PACKAGE AND...
Provided are a method of forming an electromagnetic interference (EMI) shielding layer of a ball grid array (BGA) semiconductor package, and a base tape used...
2016/0343670 FLEXIBLE DEVICE HAVING FLEXIBLE INTERCONNECT LAYER USING TWO-DIMENSIONAL MATERIALS
A flexible device includes an electronic device having an electrode and a flexible interconnect layer formed on the electrode. The flexible interconnect layer...
2016/0343669 SEMICONDUCTOR DEVICE
A semiconductor device may include pillars and a plurality of conductive layers being stacked while surrounding the pillars and including a plurality of first...
2016/0343668 Material and Process for Copper Barrier Layer
A method of fabricating a semiconductor device comprises forming a first dielectric material layer on a semiconductor substrate. The first dielectric material...
2016/0343667 METHODS RELATED TO A SPUTTERED TITANIUM TUNGSTEN LAYER FORMED OVER A COPPER INTERCONNECT STACK STRUCTURE
Disclosed are devices and methods related to metallization of semiconductors. A metalized structure can include a stack disposed over a compound semiconductor,...
2016/0343666 EMBEDDED MULTI-DEVICE BRIDGE WITH THROUGH-BRIDGE CONDUCTIVE VIA SIGNAL CONNECTION
A microelectronic structure includes a substrate having a first surface and a cavity extending into the substrate from the substrate first surface, a first...
2016/0343665 TECHNIQUES FOR FORMING INTERCONNECTS IN POROUS DIELECTRIC MATERIALS
Techniques are disclosed for forming interconnects in porous dielectric materials. In accordance with some embodiments, the porosity of a host dielectric layer...
2016/0343664 METHOD FOR FORMING METAL SEMICONDUCTOR ALLOYS IN CONTACT HOLES AND TRENCHES
A semiconductor device is provided that includes a gate structure on a channel region of a substrate. A source region and a drain region are present on...
2016/0343663 BODY-BIAS VOLTAGE ROUTING STRUCTURES
Body-bias voltage routing structures. In an embodiment, doped well structures distribute body biasing voltages to a plurality of body biasing wells of an...
2016/0343662 SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
One or more embodiments relate to a method for making a semiconductor structure, comprising: providing a workpiece; forming a barrier layer over the workpiece;...
2016/0343661 STRUCTURE FOR COUPLING METAL LAYER INTERCONNECTS IN A SEMICONDUCTOR DEVICE
A MOS device includes a first interconnect extending in a first direction, the first interconnect being configured in a metal layer. The MOS device further...
2016/0343660 WIRING STRUCTURES AND SEMICONDUCTOR DEVICES
A wiring structure includes a substrate, a lower insulation layer on the substrate, a lower wiring in the lower insulation layer, a first etch-stop layer...
2016/0343659 E-FUSE IN SOI CONFIGURATION
A method of forming a semiconductor device comprising a fuse is provided including providing a semiconductor-on-insulator (SOI) structure comprising an...
2016/0343658 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
According to one embodiment, a semiconductor device includes interconnects extending from a element formation area to the drawing area, and connected with...
2016/0343657 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
According to one embodiment, a semiconductor device includes a stacked body, a core film, and a stacked film. The stacked body includes a plurality of...
2016/0343656 Semiconductor Device and Method of Manufacturing Semiconductor Device
A semiconductor device includes a substrate having an active region, a first gate structure over a top surface of the substrate, a second gate structure over...
2016/0343655 SUBSTRATE STRUCTURE WITH ARRAY OF MICROMETER SCALE COPPER PILLAR BASED STRUCTURES AND METHOD FOR MANUFACTURING SAME
Micro bump interconnection structures for semiconductor devices, and more specifically, a substrate structure comprising an array of micrometer scale copper...
2016/0343654 WIRING SUBSTRATE, MANUFACTURING METHOD OF WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE
A wiring substrate includes an insulation layer having an electronic component mounting area, and a wiring layer embedded in the insulation layer, the wiring...
2016/0343653 Package Structure and Three Dimensional Package Structure
A package structure is disclosed. The package structure includes at least a lead, for delivering at least a signal; at least a routing layer, connected to the...
2016/0343652 METHOD AND APPARATUS FOR FORMING MULTI-LAYERED VIAS IN SEQUENTIALLY FABRICATED CIRCUITS
An electronic module assembly including a via spanning multiple layers in a wafer based module is described. The electronic module assembly can include a first...
2016/0343651 SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A 3D COMPONENT WITH AN INTERCONNECT STRUCTURE
A package may include a die proximate to a structure having a substrate with interconnects and a first component coupled to the interconnects. The die may be...
2016/0343650 GLASS CLAD MICROELECTRONIC SUBSTRATE
Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing...
2016/0343649 Molding Compound Structure
A device comprises a package component comprising a plurality of bumps formed on a first side of the package component, a semiconductor die mounted on the...
2016/0343648 INTERPOSER AND SEMICONDUCTOR MODULE FOR USE IN AUTOMOTIVE APPLICATONS
An interposer of silicon for use in a semiconductor module, wherein the interposer has a top side serving for arrangement of functional semiconductor and an...
2016/0343647 SEMICONDUCTOR DEVICE, METAL MEMBER, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A flange on first open end of a tubular contact member is soldered to a conductive plate of an insulating substrate. An external electrode terminal is fitted...
2016/0343646 HIGH ASPECT RATIO INTERCONNECT FOR WAFER LEVEL PACKAGE (WLP) AND INTEGRATED CIRCUIT (IC) PACKAGE
A package (e.g., wafer level package) that includes a die, a redistribution portion coupled to the die, a first high aspect ratio (HAR) interconnect coupled to...
2016/0343645 PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Provided is a package structure including a circuit board, a plurality of first contact pads, a plurality of metal pillars and at least one chip. The first...
2016/0343644 POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A power semiconductor element is fixed on a die pad of the lead frame. A metal plate is bonded to a lower surface of the die pad via an insulating film. The...
2016/0343643 SEMICONDUCTOR LEAD FRAME, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD THEREOF
A semiconductor lead frame includes a metal plate and a semiconductor chip mounting area provided on a top surface of the metal plate. A first plating layer...
2016/0343642 SEMICONDUCTOR DEVICE
A semiconductor device includes a laminated substrate having a circuit board; a semiconductor chip fixed to the circuit board; a terminal having a leading end...
2016/0343641 POWER SEMICONDUCTOR MODULE
A power semiconductor module includes a cooler; a plurality of power semiconductor units fixed on the cooler; and a bus bar unit connected electrically to the...
2016/0343640 SEMICONDUCTOR DEVICE
A cooler 20 of a semiconductor device includes an inlet portion 27 and an outlet portion 28 for a cooling liquid, an inlet path 24, an outlet path 25, and a...
2016/0343639 SEMINCONDUCTOR DEVICE ASSEMBLY WITH VAPOR CHAMBER
Semiconductor device assemblies having stacked semiconductor dies and thermal transfer devices that include vapor chambers are disclosed herein. In one...
2016/0343638 PROCESS FOR PRODUCING A MICROFLUIDIC CIRCUIT WITHIN A THREE-DIMENSIONAL INTEGRATED STRUCTURE, AND CORRESPONDING...
A three-dimensional integrated structure includes a first and a second element each having an interconnection part formed by metallization levels encased in an...
2016/0343637 DEVICE INTEGRATION OF ACTIVE COOLING SYSTEMS
In various embodiments, component-level and product-level devices incorporated one or more low-profile cooling devices for dissipating heat. The low-profile...
2016/0343636 Waterproof Electronic Device and Manufacturing Method Thereof
A waterproof electronic device includes: an electronic component module having an electronic component including a semiconductor element, a heat dissipating...
2016/0343635 SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A DEVICE IN A FACEUP WORKPIECE
An integrated package may be manufactured in a die face up orientation with a component proximate to the attached die by creating a cavity in the mold compound...
2016/0343634 PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE
A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the...
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