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Patent # Description
2016/0351549 THERMALLY ENHANCED FACE-TO-FACE SEMICONDUCTOR ASSEMBLY WITH BUILT-IN HEAT SPREADER AND METHOD OF MAKING THE SAME
A face-to-face semiconductor assembly is characterized in that first and second semiconductor devices are face-to-face mounted on two opposite sides of a first...
2016/0351548 LIGHT EMITTING DIODE DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
A manufacturing method of a light emitting diode (LED) display device includes forming at least one sub-pixel circuit on a substrate, forming a primary...
2016/0351547 SEMICONDUCTOR DEVICE HAVING STACKED CHIPS
According to one embodiment, a semiconductor device includes chips and a first selection circuit. Each of the chips has at least first and second vias for...
2016/0351546 3DIC Interconnect Apparatus and Method
An interconnect apparatus and a method of forming the interconnect apparatus is provided. Two integrated circuits are bonded together. A first opening is...
2016/0351545 PRINTED CIRCUIT BOARD, METHOD, AND SEMICONDUCTOR PACKAGE
A printed circuit board includes first and second insulating layers forming a cavity, a first heat releasing layer formed on an exterior surface of the cavity,...
2016/0351544 SEMICONDUCTOR DEVICE
A semiconductor device includes a first substrate, a second substrate stacked over the first substrate, and a pillar member extending obliquely between the...
2016/0351543 PRINTED CIRCUIT BOARD, PACKAGE SUBSTRATE AND PRODUCTION METHOD FOR SAME
A printed circuit board according to the present invention comprises: an insulating substrate; a plurality of pads formed on the upper surface of the...
2016/0351542 SEMICONDUCTOR DEVICE
According to one embodiment, a semiconductor device includes a first semiconductor chip including a first circuit, a second circuit, a first interconnect...
2016/0351541 SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor chip in which a first bump is provided on a first surface, a plurality of first adhesives are provided on the...
2016/0351540 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
A semiconductor device includes a first substrate, an aluminum pad, a first nickel electrode, a second substrate, a second nickel electrode, and a connection...
2016/0351539 INORGANIC-LIGHT-EMITTER DISPLAY WITH INTEGRATED BLACK MATRIX
An inorganic-light-emitter display includes a display substrate and a plurality of spatially separated inorganic light emitters distributed on the display...
2016/0351538 BALL FORMING DEVICE, WIRE-BONDING APPARATUS, AND BALL FORMATION METHOD
A ball forming device 50 for forming a ball 43 at a tip of a wire 42 by producing discharge between a torch electrode 48 and the tip of the wire 42, the device...
2016/0351537 WIRE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A wire bonding apparatus includes: a bonding tool 40 into and through a wire 42 passes; a control unit 80 that performs a movement process of the bonding tool...
2016/0351536 BONDING APPARATUS AND BONDING TOOL CLEANING METHOD
In wire bonding in which a bonding tool is cleaned through plasma irradiation, the plasma application to a wire and therefore the formation of an unexpectedly...
2016/0351535 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPARATUS
A method of manufacturing a semiconductor device includes: a wire tail forming step of forming a wire loop 130 between a first bonding point and a second...
2016/0351534 PRINTED CIRCUIT BOARDS HAVING BLIND VIAS, METHOD OF TESTING ELECTRIC CURRENT FLOWING THROUGH BLIND VIA THEREOF...
A method of manufacturing a semiconductor package is provided. The method includes providing a strip substrate having a plurality of unit substrate regions...
2016/0351533 Method for Producing an Integral Join and Automatic Placement Machine
A powder carrier, to which a powder layer containing a metal powder is applied, is provided by an automatic powder carrier feed. A first joining partner is...
2016/0351532 ALIGNMENT METHOD, METHOD FOR CONNECTING ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING CONNECTION BODY,...
An alignment mark at a position that overlaps an area in which an anisotropic conductive film is pasted, and to accurately perform alignment using an image...
2016/0351531 CONNECTION BODY
Even in case of conductive particles being clamped between stepped sections of substrate electrodes and electrode terminals, conductive particles sandwiched...
2016/0351530 SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL MATERIAL AND RELATED METHODS
Semiconductor devices and device packages include at least one semiconductor die electrically coupled to a substrate through a plurality of conductive...
2016/0351529 METHOD FOR ELECTRICAL COUPLING AND ELECTRIC COUPLING ARRANGEMENT
A method for electrically coupling a pad and a front face of a pillar, including shaping the front face pillar, the front face having at least partially a...
2016/0351528 MOUNTING APPARATUS AND METHOD OF CORRECTING OFFSET AMOUNT OF THE SAME
A method, which includes: a first chip-position calculation step of taking an image of an upper surface of a reference chip and an image of a lower surface of...
2016/0351527 DIE BONDING APPARATUS COMPRISING AN INERT GAS ENVIRONMENT
A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert...
2016/0351526 INTEGRATED CIRCUIT CHIP ATTACHMENT USING LOCAL HEAT SOURCE
Integrated circuit chip attachment is described using a local heat source. In one example an interposer has a top side to connect to a silicon component and a...
2016/0351525 SHIELDED ELECTRONIC COMPONENT PACKAGE
An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A...
2016/0351524 INTEGRATED CIRCUIT
An integrated circuit is provided. The integrated circuit includes first pads and second pads. The first pads are used to receive a first type signal, and the...
2016/0351523 BONDING MATERIAL, BONDING METHOD AND SEMICONDUCTOR DEVICE FOR ELECTRIC POWER
The present invention has an object to achieve bonding which satisfies both in heat resistivity and in stress-relaxation ability, and the bonding material...
2016/0351522 PACKAGE-ON-PACKAGE DEVICE AND CAVITY FORMATION BY SOLDER REMOVAL FOR PACKAGE INTERCONNECTION
In an electronic package that includes an electronic component, a method of forming one or more cavities in the electronic package includes depositing solder...
2016/0351521 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor substrate provided with a through hole that extends therethrough from a first surface to a second surface on a...
2016/0351520 COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT CHIPS
An integrated circuit (IC) chip includes a copper structure with an intermetallic coating on the surface. The IC chip includes a substrate with an integrated...
2016/0351519 SEMICONDUCTOR DEVICE
A semiconductor chip includes a substrate, an electrode pad formed on the substrate, an insulating layer covering the substrate and the electrode pad, and...
2016/0351518 Packaging Devices and Methods of Manufacture Thereof
Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad...
2016/0351517 ELECTRIC APPARATUS INCLUDING ELECTRIC PATTERNS FOR SUPPRESSING SOLDER BRIDGES
An electric apparatus may include a plurality of electric patterns arranged on a substrate. Each of the electric patterns may include a pad for connection with...
2016/0351516 Solder Metallization Stack and Methods of Formation Thereof
A semiconductor device includes a contact metal layer disposed over a semiconductor surface of a substrate, a diffusion barrier layer disposed over the contact...
2016/0351515 METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH PROTRUDING CONTACTS
A wiring (3) comprising electrical conductors (4, 5, 6, 7) is formed in a dielectric layer (2) on or above a semiconductor substrate (1), an opening is formed...
2016/0351514 WIRELESS IC DEVICE, RESIN MOLDED BODY COMPRISING SAME, COMMUNICATION TERMINAL APPARATUS COMPRISING SAME, AND...
A wireless IC device includes an element body including first and second principal surfaces, an RFIC element buried in the element body, and an antenna coil...
2016/0351513 Impedance matching configuration
A package is provided. The package comprises a die and an impedance matching network. The die has a first terminal and a second terminal. The impedance...
2016/0351512 SEMICONDUCTOR DEVICE
A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for...
2016/0351511 SEMICONDUCTOR PACKAGE
A semiconductor package includes a support substrate; a stress relaxation layer provided on a main surface of the support substrate; a semiconductor device...
2016/0351510 THERMOSETTING ADHESIVE SHEET AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
A thermosetting adhesive sheet comprises a thermosetting binder, a transparent filler having an average primary particle diameter from 1 nm to 1000 nm and a...
2016/0351509 WAFER LEVEL FAN-OUT WITH ELECTROMAGNETIC SHIELDING
The present disclosure integrates electromagnetic shielding into a wafer level fan-out packaging process. First, a mold wafer having multiple modules is...
2016/0351508 Creating Unique Device Identification For Semiconductor Devices
Systems and methods for creating unique device identification for semiconductor devices are described. In some embodiments, a method may include receiving a...
2016/0351507 INTEGRATED CIRCUITS WITH OVERLAY MARKS AND METHODS OF MANUFACTURING THE SAME
Integrated circuits and methods for manufacturing the same are provided. An integrated circuit includes a base dielectric layer, a first dielectric layer...
2016/0351506 PRINTED CIRCUIT BOARD, PACKAGE SUBSTRATE COMPRISING SAME, AND METHOD FOR MANUFACTURING SAME
The printed circuit board, according to one embodiment, comprises: an insulation substrate; a pad formed on at least one side of the insulation substrate; a...
2016/0351505 POWER SEMICONDUCTOR MODULE
A power semiconductor module includes: a positive arm and a negative arm that are formed by series connection of self-arc-extinguishing type semiconductor...
2016/0351504 SEMICONDUCTOR PACKAGE AND MOUNTING STRUCTURE THEREOF
A semiconductor package includes an interposer, a semiconductor element installed on a first surface of the interposer, bumps formed on a second surface of the...
2016/0351503 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor substrate provided with a through-hole, a device layer including a lower layer wiring, an insulating layer that...
2016/0351502 SEMICONDUCTOR DEVICE
According to one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip outputs a...
2016/0351501 SEMICONDUCTOR DEVICE HAVING AIR-GAP AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device in which an air-gap located at a side of a bit line stack is extended to an upper part of the bit line stack is disclosed. An embodiment...
2016/0351500 VIA, TRENCH OR CONTACT STRUCTURE IN THE METALLIZATION, PREMETALLIZATION DIELECTRIC OR INTERLEVEL DIELECTRIC...
A semiconductor substrate includes a doped region. A premetallization dielectric layer extends over the semiconductor substrate. A first metallization layer is...
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